Abstract:Purpose - The mismatch of the thermal expansion coefficients of the materials in multiplayer structure may induce serious stress concentrations in electronic packaging. Experimental evaluation of the thermal stresses and strains in those electronic composites is becoming significantly important for optimizing design and failure prediction of the electronic devices. Design/methodology/approach - Digital image correlation (DIC) technique was utilized to obtain thermal deformation filed of a BGA package. With the help of white light to illuminate the cross section of the BGA package, the gray images were taken from the rough surface of the specimen, that offer a kid of carrier pattern for the DIC processing with statistical resemblance in gray distributions. By using the algorithm of correlation computation, the DIC searched the matching spots in a pair of those images in which the spot displacements were involved in between, to obtain the deformation fields of the package specimen caused by temperature changes. Findings - The results show interesting strain distributions in the assembly. Both the horizontal displacement component and its normal derivative are strongly related to the arrangement of the solder joints in the bonding medium between the die and the ceramic substrate. The strain components in the middle region of the package are larger than those in the side regions where the strain relaxation may exist near the stress-free boundaries. The shear strain components show special bands of parallel lines with identical amount over the chip-package to sustain the shearing of the packed structure under thermal loading. Originality/value - The DIC technique shows to be a useful tool for the thermal strain analysis of the electronic packaging devices. Not only provides it the whole field deformation of the assembly, but also maintains the surface pictures of the package without covering any fringes, which is important to compare the deformation field with the specimen surface to reveal the stain distribution related to the failure prediction of the materials.

Reliability Research on the Thermal Deformation and Thermal Stress of the Metal Packaging with Low Resistance and High Electric Current

Reliability Research on the Thermal Deformation and Stress of Metal Packaging with Low-Resistance Leads

The Portevin-Le Chatelier Effect in Al-Mg Alloy Investigated by Infrared Pyrometry

Prediction of the Temperature of Large Framed Mold and Curing Deformation of Composite Components in the Autoclave Process

Thermal Stress Reduction Strategy for High-Temperature Power Electronics with Ag Sintering

Thermal Performance And Reliability Management For Novel Power Electronic Packaging Using Integrated Base Plate

Prestressing-Based Thermal Budget Study of MEMS Cantilever and Its Application in Package Processes

A Study on the Reliability Evaluation of a 3D Packaging Storage Module under Temperature Cycling Ultimate Stress Conditions

Experimental methods for thermomechanical characterization of electronic packages: a review and evaluation

Thermal deformation analysis of BGA package by digital image correlation technique

Finite element analysis of 2.5D packaging processes based on multi-physics field coupling for predicting the reliability of IC components

Numerical investigation of the effect of thermal gradients on curing performance of autoclaved laminates

An Experimental Research on the CTE Measurement of Metal Composite Leads Using Laser Speckle Interferometry

Recent advances on thermal analysis of stretchable electronics

An Experimental Study on the Thermal D Eformation in the Metal Base of Packages for Hybrid IC′s

Overview of the Experimental Methods for Thermo-mechanical Behavior Characterization of Electronic Packages

Improvement of Thermo-Mechanical Reliability of Wafer-Level Chip Scale Packaging

Thermal Stress Analysis in Package of Power Transistor

Initial Thermal Stress and Strain Effects on Thermal Mechanical Stability of Through Silicon Via

Thermal Deformation Measurement of Electronic Package Using Advanced Moire Methods

Thermal Deformation Measurement of Electronic Packaging Component Using Afm Scanning Moire Method