Abstract:Fused-silica glass, as a desirable material with rigidity, biological inertness, and favorable light transmission for nanofluidic devices, should be assembled via low-temperature bonding technology to hermetically seal channels for stable liquid manipulation in extended-nano (101-103 nm) space. Confronted with the predicament of localized functionalization of nanofluidic applications (e.g. DNA microarray) with temperature-sensitive structures, the room-temperature direct bonding of glass chips to achieve modification of channels prior to bonding offers a considerably attractive solution to avoid component denaturation during the conventional post-bonding heating process. Therefore, we developed a nano-structure friendly and technically convenient room-temperature (RT, 25 °C) glass-glass direct bonding technology using polytetrafluoroethylene (PTFE)-assisted plasma modification without a requirement for special equipment. Unlike the establishment of chemical functionalities relying on immersion in potent but dangerous chemicals like HF, the fluorine radicals (F*) from PTFE pieces with superior chemical inertness were introduced on glass surfaces via O2 plasma sputtering and constructed fluorinated silicon oxides on the glass surfaces effectively, eliminating the significant etching effect of HF to protect fine nanostructures. Very strong bonding was obtained at RT with no heating and the high-pressure resistant glass-glass interfaces were evaluated under high-pressure-driven flow conditions up to 2 MPa based on a two-channel liquid introduction system. Moreover, the favorable optical transmittance of the fluorinated bonding interface demonstrated a capacity for high-resolution optical detection or liquid sensing.

Glass Frit Bonding with Controlled Width and Height Using A Two-Step Wet Silicon Etching Procedure

Bonding of Glass-Based Microfluidic Chips at Low- or Room-Temperature in Routine Laboratory

Micro Fabrication of Micro Fluidic Glass Chip Without Clean Room Condition

Silicon-Silicon Anodic Bonding Process With Embedded Glass

Design and Fabrication of High Performance Wafer-Level Vacuum Packaging Based on Glass–silicon–glass Bonding Techniques

Glass Frit Jetting for Advanced Wafer-Level Hermetic Packaging

A Novel Approach to Fabricate Glass Micro-Objects for MEMS Application

Pressure-Free Localized Laser Bonding for Silicon and Glass

Micromachining of Pyrex7740 glass and their applications to wafer-level hermetic packaging of MEMS devices

Micromachining of Pyrex 7740 Glass by Silicon Molding and Vacuum Anodic Bonding

The Electrostatic-Alloy Bonding Technique Used in Mems

Electrostatic Bonding of A Silicon Master to A Glass Wafer for Plastic Microchannel Fabrication

Bonding of Glass Microfluidic Chips at Room Temperatures

Intermediate Layer Bonding for Silicon and Glass Based on UV Adhesive

Room-temperature Bonding of Glass Chips Via PTFE-assisted Plasma Modification for Nanofluidic Applications

Low-temperature Wafer Direct Bonding of Silicon and Quartz Glass by a Two-Step Wet Chemical Surface Cleaning

Silicon direct bonding on vacuum and force

Low-temperature Direct Bonding of Strengthened Glass Chips for Optical Imaging and Co-Packaged Optics

Silicon–glass Wafer Bonding with Silicon Hydrophilic Fusion Bonding Technology

Plastic-Silicon Bonding for MEMS Packaging Application

Plasma-activated Silicon–glass High-Strength Multistep Bonding for Low-Temperature Vacuum Packaging