Abstract:A novel three-dimensional (3D) hermetic packaging technique suitable for capacitive microelectromechanical systems (MEMS) sensors is studied. The composite substrate with through silicon via (TSV) is used as the encapsulation cap fabricated by a glass-in-silicon (GIS) reflow process. In particular, the low-resistivity silicon pillars embedded in the glass cap are designed to serve as the electrical feedthrough and the fixed capacitance plate at the same time to simplify the fabrication process and improve the reliability. The fabrication process and the properties of the encapsulation cap were studied systematically. The resistance of the silicon vertical feedthrough was measured to be as low as 263.5 mΩ, indicating a good electrical interconnection property. Furthermore, the surface root-mean-square (RMS) roughnesses of glass and silicon were measured to be 1.12 nm and 0.814 nm, respectively, which were small enough for the final wafer bonding process. Anodic bonding between the encapsulation cap and the silicon wafer with sensing structures was conducted in a vacuum to complete the hermetic encapsulation. The proposed packaging scheme was successfully applied to a capacitive gyroscope. The quality factor of the packaged gyroscope achieved above 220,000, which was at least one order of magnitude larger than that of the unpackaged. The validity of the proposed packaging scheme could be verified. Furthermore, the packaging failure was less than 1%, which demonstrated the feasibility and reliability of the technique for high-performance MEMS vacuum packaging.

Design and Fabrication of High Performance Wafer-Level Vacuum Packaging Based on Glass–silicon–glass Bonding Techniques

Process Development of A New Tgv Interposer for Wafer Level Package of Inertial Mems Device

MEMS vacuum packaging technology and applications

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Fabrication of SiC MEMS Pressure Sensor Based on Novel Vacuum-Sealed Method

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Development of wafer-level-packaging technology for simultaneous sealing of accelerometer and gyroscope under different pressures

Implementation of Various Vacuum Conditions in Sealed Chambers for Wafer-Level Bonding by Using Embedded Cavity

Novel Silicon Cap Package Technology for Monolithic Microinertial Measurement Unit