Excellent Heat Dissipation Properties of the Super-Aligned Carbon Nanotube Films

Guang Zhang,Shaohui Jiang,Hui Zhang,Wei Yao,Changhong Liu

DOI: https://doi.org/10.1039/c6ra07143k

IF: 4.036

2016-01-01

RSC Advances

Abstract:Excellent heat dissipation properties of multilayer super-aligned carbon nanotube films were measured and a novel CNT CPU-radiator was proposed.

What problem does this paper attempt to address?

Enhancement of Natural Convection by Carbon Nanotube Films Covered Microchannel-Surface for Passive Electronic Cooling Devices.

Guang Zhang,Shaohui Jiang,Wei Yao,Changhong Liu

DOI: https://doi.org/10.1021/acsami.6b08815

IF: 9.5

2016-01-01

ACS Applied Materials & Interfaces

Abstract:Owing to the outstanding properties of thermal conduction, lightweight, and chemical durability, carbon nanotubes (CNTs) have revealed promising applications in thermal management materials. Meanwhile, the increasingly popular portable electronics and the rapid development of space technology need lighter weight, smaller size, and more effective thermal management devices. Here, a novel kind of heat dissipation devices based on the superaligned CNT films and underlying microchannels is proposed, and the heat dissipation properties are measured at the natural condition. Distinctive from previous studies, by combining the advantages of microchannels and CNTs, such a novel heat dissipation device enables superior natural convection heat transfer properties. Our findings prove that the novel CNT-based devices could show an 86.6% larger total natural heat dissipation properties than bare copper plate. Further calculations of the radiation and natural convection heat transfer properties demonstrate that the excellent passive cooling properties of these CNT-based devices are primarily caused by the reinforcement of the natural convection heat transfer properties. Furthermore, the heat dissipation mechanisms are briefly discussed, and we propose that the very high heat transfer coefficients and the porous structures of superaligned CNT films play critical roles in reinforcing the natural convection. The novel CNT-based heat dissipation devices also have advantages of energy-saving, free-noise, and without additional accessories. So we believe that the CNT-based heat dissipation devices would replace the traditional metal-finned heat dissipation devices and have promising applications in electronic devices, such as photovoltaic devices, portable electronic devices, and electronic displays.
Monolithic Three‐dimensional Integration of Aligned Carbon Nanotube Transistors for High‐performance Integrated Circuits

Chenwei Fan,Xiaohan Cheng,Lin Xu,Maguang Zhu,Sujuan Ding,Chuanhong Jin,Yunong Xie,Lian-Mao Peng,Zhiyong Zhang

DOI: https://doi.org/10.1002/inf2.12420

2023-01-01

InfoMat

Abstract:Carbon nanotube field-effect transistors (CNT FETs) have been demonstrated to exhibit high performance only through low-temperature fabrication process and require a low thermal budget to construct monolithic three-dimensional (M3D) integrated circuits (ICs), which have been considered a promising technology to meet the demands of high-bandwidth computing and fully functional integration. However, the lack of high-quality CNT materials at the upper layer and a low-parasitic interlayer dielectric (ILD) makes the reported M3D CNT FETs and ICs unable to provide the predicted high performance. In this work, we demonstrate a multilayer stackable process for M3D integration of high-performance aligned carbon nanotube (A-CNT) transistors and ICs. A low-kappa (similar to 3) interlayer SiO2 layer is prepared from spin-on-glass (SOG) through processes with a highest temperature of 220 C-degrees, presenting low parasitic capacitance between two transistor layers and excellent planarization to offer an ideal surface for the A-CNT and device fabrication process. A high-quality A-CNT film with a carrier mobility of 650 cm(2) V-1 s(-1) is prepared on the ILD layer through a clean transfer process, enabling the upper CNT FETs fabricated with a low-temperature process to exhibit high on-state current (1 mA mu m(-1)) and peak transconductance (0.98 mS mu m(-1)). The bottom A-CNT FETs maintain pristine high performance after undergoing the ILD growth and upper FET fabrication. As a result, 5-stage ring oscillators utilizing the M3D architecture show a gate propagation delay of 17 ps and an active region of approximately 100 mu m(2), representing the fastest and the most compact M3D ICs to date.
Thermo-physical properties of water-based single-walled carbon nanotube nanofluid as advanced coolant

meibo xing,jianlin yu,ruixiang wang

DOI: https://doi.org/10.1016/j.applthermaleng.2015.05.033

IF: 6.4

2015-01-01

Applied Thermal Engineering

Abstract:In this paper, the thermo-physical properties of water-based single-walled carbon nanotube nanofluids (SWCNTs-nanofluids) are experimentally studied. The effect of mass concentration, varying from 0.1 to 1 wt%, on the thermal conductivity, viscosity and density of nanofluids is investigated at the temperatures of 10–60 °C. The results show that the thermal conductivity, viscosity and density of nanofluids are higher than that of the base fluid, and increase with an increase in nanotubes concentration. The thermo-physical property variation of SWCNTs-nanofluids with temperature is similar to that of pure water, i.e. thermal conductivity increases, whereas the viscosity and density decrease with an increase in the temperature. When the concentration is 1 wt%, at 60 °C, the maximum thermal conductivity and viscosity enhancements increase by up to 16.2% and 35.9%, respectively. Furthermore, the heat transfer performance of SWCNTs-nanofluids as advanced coolants is evaluated in both laminar and turbulent flow regimes based on the measured data. The evaluated results indicate that SWCNTs-nanofluids have good heat transfer performance in laminar flow regime. For the case of turbulent flow regime, however, the viscosity increase worsens the heat transfer performance at the lower temperature and higher concentration.
High Water-Absorbent and Phase-Change Heat Dissipation Materials Based on Super-Aligned Cross-Stack CNT Films

Wei Yu,Changhong Liu,Shoushan Fan

DOI: https://doi.org/10.1002/adem.201801216

IF: 3.6

2019-01-01

Advanced Engineering Materials

Abstract:Carbon nanotubes (CNTs) with the advantage of high thermal conductivity and light weight can be widely used in thermal management. Meanwhile, heat removal for hot spots has become a major issue in the development of electronics because of the increasing of power density and thermal load. Therefore, more effective heat dissipation approaches are needed. Here, the high water-absorbent and phase-change heat dissipation materials based on super-aligned cross-stack CNT (CSCNT) films with excellent cooling performance are reported. Pure CSCNT and CaCl2/CSCNT composite show the outstanding water absorption property because of their high specific surface area and porosity. Combined the high natural convection and heat radiation of CSCNTs with heat removal by water evaporation, the heat dissipation coefficient of CaCl2/CSCNT can reach as high as 98 W m(-2) K-1 with the help of auxiliary plate. Due to the high absorption rate, the composite can absorb water when electronics are at low power and dissipate heat by water evaporation at high power. Moreover, it is founded that there is a dynamic balance of water absorption and desorption to enhance cooling performance at thermal equilibrium.
Package heat dissipation with integrated carbon nanotube micro heat sink

Xiaojing Wang,Hongjun Liu,Jia Wang,Wen Zhang,Zongshuo Li

DOI: https://doi.org/10.1109/icept.2009.5270792

2009-08-01

Abstract:Micro-channel cooler is a very promising approach to meet the requirements of microelectronics package cooling. A lot of investigations about micro-channels have been undertaken in the past years. A silicon micro-channel can remove 790W/cm2 heat with a temperature rise of 71 degrees between the substrate and the coolant. The width and height of the silicon channel are 50um and 302um separately [1]. However, as the trends in the electronics industry moves towards higher packaging density, the high-pressure drop problem limits the performance of traditional silicon heat sink. Replacing the silicon fins with nanotube fins to enhance the thermal exchange rate between cooling liquid and substrate is one way to overcome this problem. Growing aligned nanotubes on the whole substrate is another one [2]. Carbon nanotubes (CNTs) are a new form of carbon which was discovered in 1991 by Iijima [3]. CNTs can be grown directly on the surface of silicon accurately according to predefined small-scale catalyst patterns normally transferred by standard photolithography processes. It was reported that nanotubes have an extremely high thermal conductivity over 3000W/(km) [4], so in the present work, the thermo physical properties of CNTs are obtained via molecular dynamics (MD) method. Fig. 1 shows one single-wall CNT simulation by LAMMPS. Several CNTs-fin heat sinks (1cm*1cm) with different fin width varied from 2um to 200um are tested (Fig. 2). Then the aligned CNTs heat sink is also simulated to compare with the long CNTs-fin model. The heat transfer coefficients and pressure drop of these structures are computed. Results indicate replacing the silicon-fin with CNTs-fin is a promising method and the long CNT-fin model shows better performance than the aligned CNTs for generating little pressure drop. Among the models, the best one is chosen for experiments in next work.
Aligned Carbon Nanotube Composite Films for Thermal Management

H Huang,CH Liu,Y Wu,SS Fan

DOI: https://doi.org/10.1002/adma.200500467

IF: 29.4

2005-01-01

Advanced Materials

Abstract:An ideal composite film based on a carbon nanotube (CNT) array for 0 thermal management applications is prepared using "in-situ injection molding". The aligned CNTs with their tips protruding out of both surfaces form ideal thermal conducting paths between surfaces. Much better thermal conductivity improvements can be achieved at low CNT loadings compared with dispersed CNT composites.
Design and Test of Carbon Nanotube Biwick Structure for High-Heat-Flux Phase Change Heat Transfer

Qingjun Cai,Chung-Lung Chen

DOI: https://doi.org/10.1115/1.4000469

2010-03-09

Journal of Heat Transfer

Abstract:With the increase in power consumption in compact electronic devices, passive heat transfer cooling technologies with high-heat-flux characteristics are highly desired in microelectronic industries. Carbon nanotube (CNT) clusters have high thermal conductivity, nanopore size, and large porosity and can be used as wick structure in a heat pipe heatspreader to provide high capillary force for high-heat-flux thermal management. This paper reports investigations of high-heat-flux cooling of the CNT biwick structure, associated with the development of a reliable thermometer and high performance heater. The thermometer/heater is a 100-nm-thick and 600 μm wide Z-shaped platinum wire resistor, fabricated on a thermally oxidized silicon substrate of a CNT sample to heat a 2×2 mm2 wick area. As a heater, it provides a direct heating effect without a thermal interface and is capable of high-temperature operation over 800°C. As a thermometer, reliable temperature measurement is achieved by calibrating the resistance variation versus temperature after the annealing process is applied. The thermally oxidized layer on the silicon substrate is around 1-μm-thick and pinhole-free, which ensures the platinum thermometer/heater from the severe CNT growth environments without any electrical leakage. For high-heat-flux cooling, the CNT biwick structure is composed of 250 μm tall and 100 μm wide stripelike CNT clusters with 50 μm stripe-spacers. Using 1×1 cm2 CNT biwick samples, experiments are completed in both open and saturated environments. Experimental results demonstrate 600 W/cm2 heat transfer capacity and good thermal and mass transport characteristics in the nanolevel porous media.
Pool Boiling Heat Transfer During Quenching in Carbon Nanotube (Cnt)-Based Aqueous Nanofluids: Effects of Length and Diameter of the CNTs

Li-Wu Fan,Jia-Qi Li,Yue-Zi Wu,Liang Zhang,Zi-Tao Yu

DOI: https://doi.org/10.1016/j.applthermaleng.2017.05.036

IF: 6.4

2017-01-01

Applied Thermal Engineering

Abstract:Quenching experiments were performed with hot stainless steel spheres in a pool of saturated water based nanofluids with carbon nanotubes (CNTs) of various sizes. A test matrix was developed by choosing multi-walled CNTs having four combinations of nominal lengths and outer diameters, while the concentration was fixed at 0.5% by mass. It was shown that the quenching process is progressively accelerated upon consecutive runs due to the accumulative deposition of CNTs. The relative quenching acceleration and boiling heat transfer enhancement were found to be strongly related to the size discrepancy among the CNTs, as a result of the various surface morphologies and properties of the deposition layers. The CNTs with a length of 5 mu m and a diameter of 60 nm were exhibited to lead to the most remarkable enhancement on the quenching and boiling behaviors, with the critical heat flux and Leidenfrost point being increased by about 60% and 100% respectively, due to the easy formation of micro-porous layers by this type of longer and thicker CNT5. It was identified that the significantly increased surface roughness with porous structure, instead of the nearly unvaried surface wettability, is responsible for the enhanced boiling heat transfer during quenching. The findings of this work suggested an active approach. to optimization of quenching performance of CNT-based nanofluids. (C) 2017 Elsevier Ltd. All rights reserved.
Tunable Anisotropic Thermal Transport in Super-Aligned Carbon Nanotube Films

W. Yu,X. Zhao,P. Jiang,C. Liu,R. Yang

DOI: https://doi.org/10.1016/j.mtphys.2021.100447

IF: 11.021

2021-01-01

Materials Today Physics

Abstract:Super-aligned carbon nanotube (CNT) films have intriguing anisotropic thermal transport properties due to the anisotropic nature of individual nanotubes and the important role of nanotube alignment. However, the relationship between the alignment and the anisotropic thermal conductivities was not well understood due to the challenges in both the preparation of high-quality super-aligned CNT film samples and the thermal characterization of such highly anisotropic and porous thin films. Here, super-aligned CNT films with different alignment configurations are designed and their anisotropic thermal conductivities are measured using time-domain thermoreflectance (TDTR) with an elliptical-beam approach. The results suggest that the alignment configuration could tune the cross-plane thermal conductivity k_z from 6.4 to 1.5 W/mK and the in-plane anisotropic ratio from 1.2 to 13.5. This work confirms the important role of CNT alignment in tuning the thermal transport properties of super-aligned CNT films and provides an efficient way to design thermally anisotropic films for thermal management.
Thermal Management for Purification of Aligned Arrays of Single-Walled Carbon Nanotubes Based on Thermocapillary Flow by Pulsed Heating

Yuhang Li,Jin Chen,Xu Xie,Yufeng Xing,Jizhou Song

DOI: https://doi.org/10.1016/j.ijthermalsci.2019.01.010

IF: 4.779

2019-01-01

International Journal of Thermal Sciences

Abstract:Semiconducting single-walled carbon nanotube (s-SWNT) arrays attract much attention due to the ideal configuration for high performance electronics. A recent approach based on the nanoscale thermocapillary flow enabled the achievement of aligned arrays of highly purified s-SWNTs by removing the metallic SWNTs (m-SWNTs) in as-grown arrays by direct pulsed current injection. Thermal management of this process is critically important since the cumulative heating from the m-SWNT array yields a high temperature increase to cause the difficult control of thermocapillary flow. In this paper, an analytical heat transfer model combining a two-dimensional transient thermal model and a three-dimensional steady state thermal model is established for predicting the temperature increase of the SWNT array under a pulsed current injection with a period step function. The analytical predictions agree well with three-dimensional finite element analysis. Effects of parameters (such as duty cycle, period, spacing, etc.) on the temperature distributions and the maximum temperature increase are investigated systematically. These results can help guide the purification process to reduce the adverse thermal effects to obtain highly purified s-SWNTs.
Application of CNTs/H2O nanofluid and the wavy fin with dimples in thermal management of CPU: A numerical modeling of hybrid passive cooling

Soheil Siahchehrehghadikolaei,S. S. Ghadikolaei,M. Gholinia,Goodarz Ahmadi

DOI: https://doi.org/10.1080/10407782.2024.2343591

2024-04-25

Numerical Heat Transfer Part A Applications

Abstract:A study was conducted utilizing computational fluid dynamics (CFD) to explore a novel cooling technique for the central processing unit (CPU), involving the use of carbon nanotubes (CNTs)/H 2 O nanofluid-fin heat sinks with dimples. Different fin heat sink designs with varying dimple arrangements were created using AutoCAD software. The three-dimensional flow, heat transfer, and mass transfer of the nanofluid within the liquid block were simulated using a finite volume-based CFD code. The study investigated the influence of different nanoparticle concentrations and dimple arrangements on cooling performance, heat transfer coefficient, pumping power, and thermal efficiency. The results revealed that the maximum temperature reduction on the CPU's top surface was approximately 13.1 K for multi-walled carbon nanotube/H 2 O nanofluids and 14.34 K for single-walled carbon nanotube (SWCNT)/H 2 O nanofluids. The best thermal efficiencies were achieved using SWCNT (2%)/H 2 O with three rows of dimples on each fin, resulting in an 8.5% improvement in heat sink performance at Re = 1,500 and an 8.8% improvement at Re = 2,000 compared to fins without dimples. However, it was observed that increasing the number of dimples on the fins led to an increase in pressure drop within the liquid block, necessitating additional pumping power. The simulation results aligned well with earlier experimental data and numerical studies in terms of cooling and heat transfer.

thermodynamics,mechanics
Thermal Properties of Carbon Nanotube Array Used for Integrated Circuit Cooling

Yuan Xu,Yi Zhang,Ephraim Suhir,Xinwei Wang

DOI: https://doi.org/10.1063/1.2337254

IF: 2.877

2006-01-01

Journal of Applied Physics

Abstract:Carbon nanotubes (CNTs), owing to their exceptionally high thermal conductivity, have a potential to be employed in micro- and optoelectronic devices for integrated circuit (IC) cooling. In this study we describe a photothermal metrology intended to evaluate the thermal conductivity of a vertically aligned CNT array (VCNTA) grown on a silicon (Si) substrate. Plasma-enhanced chemical vapor deposition, with nickel (Ni) as a catalyst, was used to grow CNT. The experimentally evaluated thermal conductivity of the VCNTA and the thermal contact resistance at the interface between the VCNTA and the “hot” surface was found to be in a satisfactory agreement with theoretical predictions. The measured effective thermal resistance is measured to be 0.12∼0.16cm2∙K∕W. This resistance was compared to the measured resistance of commercially available thermal grease. Based on this comparison, we conclude that, although the thermal resistance of CNTs might not be as low as it might be desirable, there exists a definite incentive for using VCNTA of the type in question for IC cooling.
Characterize the Thermal Properties of the Vertical Aligned Carbon Nanotubes Array Used for IC Cooling with Photothermal Method

Zhang, Yi,Xu, Yuan,Wang, Xinwei

DOI: https://doi.org/10.1109/nano.2006.247735

2006-01-01

Abstract:Carbon Nanotubes show great potential to be used as an interface material for heat transport in IC cooling due to their high thermal conductivity. In this work, we developed a novel photothermal metrology to characterize the thermal properties of vertically aligned carbon nanotubes array (V-CNTA), which is grown directly on silicon/copper substrate with plasma-enhanced chemical vapor deposition (PECVD). The thermal conductivity of the V-CNTA and the thermal interface contact resistance are measured and correlated with theoretical calculation. The total thermal resistance of V-CNTA is measured to be 0.12 cm 2 . K/W with a pressure of 60 psi and decreases with increasing the applied pressure. It demonstrated the capability of using V-CNTA for IC cooling. The total thermal resistance of the thermal grease is also measured for comparison.
Nanoscale Heat Transport of Vertically Aligned Carbon Nanotube Bundles for Thermal Management Applications

Jean Spièce,Kunal Lulla,Pauline de Crombrugghe de Picquendaele,Laurent Divay,Odile Bezencenet,Benoit Hackens,Pascal Gehring,Alex J Robson,Charalambos Evangeli,Oleg V Kolosov

DOI: https://doi.org/10.1021/acsami.4c07913

2024-08-28

Abstract:Electronic devices continue to shrink in size while increasing in performance, making excess heat dissipation challenging. Traditional thermal interface materials (TIMs) such as thermal grease and pads face limitations in thermal conductivity and stability, particularly as devices scale down. Carbon nanotubes (CNTs) have emerged as promising candidates for TIMs because of their exceptional thermal conductivity and mechanical properties. However, the thermal conductivity of CNT films decreases when integrated into devices due to defects and bundling effects. This study employs a novel cross-sectional approach combining high-vacuum scanning thermal microscopy (SThM) with beam-exit cross-sectional polishing (BEXP) to investigate the nanoscale morphology and thermal properties of vertically aligned CNT bundles at low and room temperatures. Using appropriate thermal transport models, we extracted effective thermal conductivities of the vertically aligned nanotubes and obtained 4 W m-1 K-1 at 200 K and 37 W m-1 K-1 at 300 K. Additionally, non-negligible lateral thermal conductance between CNT bundles suggests more complex heat transfer mechanisms in these structures. These findings provide unique insights into nanoscale thermal transport in CNT bundles, which is crucial for optimizing novel thermal management strategies.
An Experimental Study of Boiling Heat Transfer During Quenching of Nanofluids with Carbon Nanotubes of Various Sizes

Jia-Qi Li,Li-Wu Fan,Liang Zhang,Zi-Tao Yu

DOI: https://doi.org/10.1115/ht2016-7319

2016-01-01

Abstract:Quenching experiments were performed with hot stainless steel spheres in a pool of water-based nanofluids in the presence of carbon nanotubes (CNTs) of various sizes. In order to explore the size effect, a test matrix was developed by choosing multi-walled CNTs with lengths from 1 μm to 5 μm and outer diameters from 30 nm to 60 nm. The concentration was fixed at 0.5% by mass for all types of CNTs. The initial temperature was 400 °C and the transient temperature variations at the center of the sphere were recorded as quenching curves. By establishing a lumped capacitance model, the transient surface heat flux variations were obtained as boiling curves. The original and boiled surfaces were both subjected to a series of characterizations to determine the changes in morphology, roughness, and wettability to identify the effects of CNT size on the surface properties of the formed deposition layers as well as to elucidate the mechanisms for regulation of the boiling and quenching behaviors. The results suggested that the critical heat flux (CHF) and the Leidenfrost point (LFP) are enhanced to various degrees due to the discrepancy in the size of the CNTs in nanofluids. It was shown that the CNTs deposited on the surfaces create various morphologies depending on their size. The CNTs with a length of 5 μm and a diameter of 60 nm exhibited the most significant effect on the boiling behaviors. In comparison to CNTs with a shorter length of 1 μm, the 5 μm long CNTs were much easier to form porous layers. The results of the contact angle and roughness tests showed that the porous layers tend to affect the surface roughness instead of surface wettability. The increases of the nucleation site density and surface roughness due to the presence of porous layers were identified as the primary cause for the modified boiling behaviors during quenching.
Efficient natural-convective heat transfer properties of carbon nanotube sheets and their roles on the thermal dissipation.

Shaohui Jiang,Changhong Liu,Shoushan Fan

DOI: https://doi.org/10.1021/am405491t

IF: 9.5

2014-01-01

ACS Applied Materials & Interfaces

Abstract:In this work, we report our studies related to the natural-convective heat transfer properties of carbon nanotube (CNT) sheets. We theoretically derived the formulas and experimentally measured the natural-convective heat transfer coefficients (H) via electrical heating method. The H values of the CNT sheets containing different layers (1, 2, 3, and 1000) were measured. We found that the single-layer CNT sheet had a unique ability on heat dissipation because of its great H. The H value of the single-layer CNT sheet was 69 W/(m(2) K) which was about twice of aluminum foil in the same environment. As the layers increased, the H values dropped quickly to the same with that of aluminum foil. We also discussed its roles on thermal dissipation, and the results indicated that the convection was a significant way of dissipation when the CNT sheets were applied on macroscales. These results may give us a new guideline to design devices based on the CNT sheets.
Carbon Nanotubes Grown on Graphite Films as Effective Interface Enhancement for an Aluminum Matrix Laminated Composite in Thermal Management Applications

Jing Chang,Qiang Zhang,Yingfei Lin,Chang Zhou,Wenshu Yang,Liwen Yan,Gaohui Wu

DOI: https://doi.org/10.1021/acsami.8b12691

2018-11-07

Abstract:Uniform and dense carbon nanotubes (CNTs) were grown on the surface of the graphite film (GF) by a plasma-enhanced chemical vapor deposition process. The synthesized CNTs can act as a bridge between GF and Al matrix to enhance the interface performance and improve thermal properties of the GF/Al laminated composite simultaneously. A layer-by-layer CNTs-GF/Al composite with both increased mechanical property and thermal management capability was fabricated through an optimized pressure infiltration process, which was time- and energy-saving. The results show that the interface of the laminated composite is well bonded and no interface product such as Al4C3 is generated. Additional investigations reveal that the growth of CNTs is an effective way to improve the thermal conductivity and reduce the coefficient of thermal expansion of the GF reinforced Al composites. Overall, the best-performing CNTs-GF/Al composites with a CNTs-GF volume fraction of 51.42% show an increase of 47.99% in thermal conductivity and 26.44% in interlaminar shear strength, making them promising thermal management laminated materials.
Hard Carbon Nanotube Sponges for Highly Efficient Cooling via Moisture Absorption–Desorption Process

Wei Yu,Guang Zhang,Changhong Liu,Shoushan Fan

DOI: https://doi.org/10.1021/acsnano.0c06748

IF: 17.1

2020-10-12

ACS Nano

Abstract:Heat dissipation is a serious limitation for increasingly miniaturized and functionalized electronics, resulting in the continuous need for developing highly efficient cooling methods. Here, utilizing the strong van der Waals force between super-aligned carbon nanotubes (SACNTs), a self-supported three-dimensional (3D) CNT/CaCl2 radiator with a more outstanding cooling performance than Al cooling fins was designed. Unlike the soft CNT sponges, these 3D structures could sustain a high pressure of 4.5 MPa with a small compression of 10% and thus are defined as hard CNT sponges. Hard CNT sponges show a 44.3% higher cooling efficiency than commercial Al cooling fins at a humidity of 50% due to the massive latent heat of water combining with the high thermal conductivity of CNTs and the high emissivity of the composites. The self-adjusting moisture absorption–desorption process could dissipate heat by water evaporation when electronics work at high power and spontaneously absorb moisture to regenerate the sponges at the standby mode of electronics. Besides, hard CNT sponges possess a much lower density (0.98–1.70 g cm–3) than aluminum (2.7 g cm–3). This high-performance cooler provides an alternative thermal management method for electronics.The Supporting Information is available free of charge at <a class="ext-link" href="/doi/10.1021/acsnano.0c06748?goto=supporting-info">https://pubs.acs.org/doi/10.1021/acsnano.0c06748</a>.Calculation for radiative heat dissipation; schematics of the cooling performance measurement setup; figures for additional experimental results, EDS images and TG data; additional simulated results of the cooling devices; heat-transfer coefficient of samples; cooling performance of hard CNT sponge, cooling fins and CNT decorated cooling fins; heat dissipation of the batteries in the discharging process (<a class="ext-link" href="/doi/suppl/10.1021/acsnano.0c06748/suppl_file/nn0c06748_si_001.pdf">PDF</a>)This article has not yet been cited by other publications.

materials science, multidisciplinary,chemistry, physical,nanoscience & nanotechnology
Interface Engineering for High-Performance Thermoelectric Carbon Nanotube Films

Ying Zhou,Qingshuo Wei,Minfang Zhang,Hideaki Nakajima,Toshiya Okazaki,Takeo Yamada,Kenji Hata

DOI: https://doi.org/10.1021/acsami.3c15704

IF: 9.5

2023-12-20

ACS Applied Materials & Interfaces

Abstract:Carbon nanotubes (CNTs) stand out for their exceptional electrical, thermal, and mechanical attributes, making them highly promising materials for cutting-edge, lightweight, and flexible thermoelectric applications. However, realizing the full potential of advanced thermoelectric CNTs requires precise management of their electrical and thermal characteristics. This study, through interface optimization, demonstrates the feasibility of reducing the thermal conductivity while preserving robust...

materials science, multidisciplinary,nanoscience & nanotechnology
Highly Thermally Conductive Super-Aligned Boron Nitride Nanotube Films for Flexible Electronics Thermal Management

Yue Yue,Xiaoran Yang,Kai Yang,Kangyong Li,Zexin Liu,Fanfan Wang,Rong Zhang,Jian Huang,Zhiqiang Wang,Lifu Zhang,Guoqing Xin

DOI: https://doi.org/10.1021/acsami.4c05971

IF: 9.5

2024-06-21

ACS Applied Materials & Interfaces

Abstract:Flexible electronics toward high integration, miniaturization, and multifunctionality, leading to a dramatic increase in power density. However, the low thermal conductivity of flexible substrates impedes efficient heat dissipation and device performance improvement. In this work, we propose a template-assisted chemical conversion strategy for obtaining boron nitride nanotube (BNNT) films with high thermal conductivity and great flexibility. Aligned carbon nanotube (CNT) films have been adopted...

materials science, multidisciplinary,nanoscience & nanotechnology

Excellent Heat Dissipation Properties of the Super-Aligned Carbon Nanotube Films

Enhancement of Natural Convection by Carbon Nanotube Films Covered Microchannel-Surface for Passive Electronic Cooling Devices.

Monolithic Three‐dimensional Integration of Aligned Carbon Nanotube Transistors for High‐performance Integrated Circuits

Thermo-physical properties of water-based single-walled carbon nanotube nanofluid as advanced coolant

High Water-Absorbent and Phase-Change Heat Dissipation Materials Based on Super-Aligned Cross-Stack CNT Films

Package heat dissipation with integrated carbon nanotube micro heat sink

Aligned Carbon Nanotube Composite Films for Thermal Management

Design and Test of Carbon Nanotube Biwick Structure for High-Heat-Flux Phase Change Heat Transfer

Pool Boiling Heat Transfer During Quenching in Carbon Nanotube (Cnt)-Based Aqueous Nanofluids: Effects of Length and Diameter of the CNTs

Tunable Anisotropic Thermal Transport in Super-Aligned Carbon Nanotube Films

Thermal Management for Purification of Aligned Arrays of Single-Walled Carbon Nanotubes Based on Thermocapillary Flow by Pulsed Heating

Application of CNTs/H2O nanofluid and the wavy fin with dimples in thermal management of CPU: A numerical modeling of hybrid passive cooling

Thermal Properties of Carbon Nanotube Array Used for Integrated Circuit Cooling

Characterize the Thermal Properties of the Vertical Aligned Carbon Nanotubes Array Used for IC Cooling with Photothermal Method

Nanoscale Heat Transport of Vertically Aligned Carbon Nanotube Bundles for Thermal Management Applications

An Experimental Study of Boiling Heat Transfer During Quenching of Nanofluids with Carbon Nanotubes of Various Sizes

Efficient natural-convective heat transfer properties of carbon nanotube sheets and their roles on the thermal dissipation.

Carbon Nanotubes Grown on Graphite Films as Effective Interface Enhancement for an Aluminum Matrix Laminated Composite in Thermal Management Applications

Hard Carbon Nanotube Sponges for Highly Efficient Cooling via Moisture Absorption–Desorption Process

Interface Engineering for High-Performance Thermoelectric Carbon Nanotube Films

Highly Thermally Conductive Super-Aligned Boron Nitride Nanotube Films for Flexible Electronics Thermal Management