Study on Te Inclusions Distributions of Different Solid–liquid Interface Shapes Within CdZnTe Crystals
Xiao-yan Liang,Jia-hua Min,Liu-qing Yang,Ji-jun Zhang,Lin-jun Wang,Yue Zhao,Wei-min Shi
DOI: https://doi.org/10.1016/j.mssp.2015.07.012
IF: 4.1
2015-01-01
Materials Science in Semiconductor Processing
Abstract:CdZnTe crystals were fabricated by modified vertical Bridgman method with three-stage growth rates, and the solid–liquid interfaces of concave, convex and slight convex shapes were estimated owing to the Zn component mapping. Detail interface shapes and Te inclusion distributions of different interfaces have been investigated, comprising by effects of Te inclusions on the crystal performance of different interfaces. The results indicated that the interface fluctuations were visible at the initial and the end of the ingots with concave and convex interfaces, and the potential emergence of Te inclusion aggregates on serious concave interfaces reducing Te inclusion density. The variable-speed reflow process was conducive to release thermal stress and eliminate the interface fluctuation, depressing the produce of Te inclusions. Therefore, Te inclusions presented on slight convex/flat interface with smaller dimension and lower density (almost one order lower than concave/convex interfaces), which attributing to optimize the structural, electrical and optical properties of CdZnTe crystal.