Cellular Spacing of Cu-Mn Alloy under Ultrahigh Temperature Gradient and Rapid Directional Solidification

杨森,黄卫东,张庆茂,刘文今,周尧和
DOI: https://doi.org/10.3321/j.issn:1004-0609.2001.z2.055
2001-01-01
The Chinese Journal of Nonferrous Metals
Abstract:Detailed laser surface remelting experiments of Cu 31.4% Mn alloy on a 5?kW CW CO 2 laser were carried out to study the effects of processing parameters (scanning velocity, laser output power) on the growth direction of microstructure in the molten pool and cellular spacing selection under ultrahigh temperature gradient and rapid directional solidification conditions. The experimental results show that growth direction of microstructure is strongly affected by laser processing parameters. Ultra high temperature gradient directional solidification can be realized on the surface of samples during laser surface remelting by controlling laser processing parameters, whose temperature gradient can reach 10 6 K/m and growth velocity can reach 24.1?mm/s, and the solidification microstructure grows along the laser beam scanning direction. There exists a distribution range in cellular spacing under laser rapid solidification condition, the average spacing decrease with increase of the growth rate. The maximum, λ max , minimum, λ min , and average primary spacing, λ- , as functions of growth rate v b, can be given by λ max = 1.25 ? v -0.61 b , λ min = 4.47 ? v -0.52 b , λ- = 9.09 ? v -0.62 b , respectively. The experimental results are compared with the current Hunt Lu model for rapid cellular/dendritic growth, and a good agreement is found.
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