Microstructure Evolution of Cu-Mn Alloy under Laser Ultra-High Temperature Gradient and Rapid Solidification Condition

杨森,钟敏霖,张庆茂,黄卫东,刘文今,周尧和
DOI: https://doi.org/10.3969/j.issn.1005-5053.2001.02.001
2001-01-01
Abstract:Laser rapid solidification experiments have been performed on Cu 26.6wt%Mn,Cu 27.3wt%Mn and Cu 31.4wt%Mn alloys to investigate their microstructures evolution with growth rate under ultra high temperature gradient, respectively. The experimental results showed that the microstructure of Cu 26.6wt%Mn alloy changed from cellular to dendrite, super fine cellular and segregation free solid with the increase of growth rate; no dendrite growth appeared in the whole growth rate range for Cu 27.3 wt%Mn and Cu 31.4wt%Mn alloy, whereas fully grew in the form of cellular. The critical rates of absolute stability for Cu 31.4 wt%Mn,Cu 27.3wt%Mn and Cu 26.6wt%Mn alloys were 113.3, 212.6 and 260.5mm/s, respectively, which is reasonable agreement with that of the predicted by M S theory.
What problem does this paper attempt to address?