Random Fatigue Semi - Experimental Model of SMT Solder Joint in Random Vibration Condition

Guo Qiang,Zhao Mei,Meng Guang

DOI: https://doi.org/10.3969/j.issn.1000-3835.2005.02.007

2004-01-01

Abstract:According random theory, a random fatigue semi - experimental model of SMT solder joint in random vibration condition is created. Compared with random vibration test results of Ref. Its results is good e-nough to predict solder joints' fatigue.

What problem does this paper attempt to address?

SMT solder joint's semi-experimental fatigue model

Qiang Guo,Mei Zhao,HongFang Wang

DOI: https://doi.org/10.1016/j.mechrescom.2004.03.011

IF: 2.749

2005-01-01

Mechanics Research Communications

Abstract:The low-cycle fatigue induced by thermal cycling is the major concern in the reliability of surface mounted technology (SMT) for electronic packaging; however, dynamic loading effects to solder joint fatigue life have not been thoroughly investigated. In fact, the high-cycling fatigue induced by vibration can also contribute a significant effect. In certain circumstances it can become the dominant failure case when semiconductor devices are used in a vibration environment. In this paper, according to random vibration theory, a random fatigue semi-experimental model of SMT solder joint in random vibration condition is created and a series of vibration fatigue experimental vehicles including PBGA256 assembly were conducted. Compared with random vibration test results, its results are good enough to predict solder joints' fatigue.
Actuality and Development of Fatigue Models of Solder Joints in Micro-Electronic Packaging

ZHOU Jun,HAO Wei-na,CHAI Guo-zhong

DOI: https://doi.org/10.3969/j.issn.1001-3997.2007.01.034

2007-01-01

Abstract:The thermal-mechanical reliability of solder joints has been a key issue in the design of electronic devices and the reliability assessment of electronic packaging.Numerous fatigue models have been proposed or developed for the evaluation of reliability of solder alloys under thermal-mechanics fatigue loading.A review of these models is presented here and their capabilities and limitations are identified.
Predicting fatigue life of Solder joint with submodel method for a BGA package

Li-na DAI,Guo-zhong CHAI,ZHOU-Jun,Yu-mei BAO,Wei-na HAO

DOI: https://doi.org/10.3969/j.issn.1006-4303.2007.04.003

2007-01-01

Abstract:A new method-submodel finite element is applied to analysis the deformation of BGA chip under accelerated temperature cycling conditions(-25～125 ℃).The commonly used modified Darveaux's approach is used to estimate the fatigue life.In this procedure,firstly,a coarse model with many solder bumps is setup and analyzed.A critical solder bump,easiest to fail,is identified through analyzing the deformation situation caused by mismatch of swell factor between the chip and substrate in the thermal cyclic loading.Then the results are used as the boundary conditions in the refined submodel in order to investigate deformation of the components surrounding solder bump.Finally,the number of thermal fatigue cycles is investigated.Compared with traditional methods,this submodel method can provide a relatively accurate solution under the limited computing power.
Vibration fatigue experiments of SMT solder joint

Hongfang Wang,Mei Zhao,Qiang Guo

DOI: https://doi.org/10.1016/j.microrel.2004.01.008

IF: 1.6

2004-01-01

Microelectronics Reliability

Abstract:The low-cycle fatigue induced by thermal cycling is the major concern in the reliability of SMT for electronic packaging; however, dynamic loading effects on solder joint fatigue life have not been thoroughly investigated. In fact, the high-cycling fatigue induced by vibration can also contribute a significant effect. In certain circumstances it can become a dominant failure case when semiconductor devices are used in vibration environment. In this paper, a series of vibration fatigue experimental vehicles including PBGA256 assembly and FCBGA1521 assembly were conducted. After these experiments, a new phenomenon of cracks of solder joints have been detected and given a reasonable reason, which could lead to a new concept of solder joints' fatigue.
Experimental and Statistical Study of the Fracture Mechanism of Sn96.5Ag3Cu0.5 Solder Joints via Ball Shear Test

Kun Liang,Yuexing Wang,Zhigang He

DOI: https://doi.org/10.3390/ma15072455

IF: 3.4

2022-03-26

Materials

Abstract:Ball shear testing is an efficient approach to investigate the mechanical reliability of solder joints at the structural level. In the present study, a series of low-speed ball shear tests were conducted to study the deformation and fracture characteristics of Sn96.5Ag3Cu0.5 solder joints at continuous speeds from 10 μm/s to 200 μm/s. In order to account for randomness, the quantity of tests was repeated for each shear rate. The relationship between mechanical properties and shear speeds was calculated in detail via effective statistical analysis. In addition, by utilizing SEM imaging and ingredient analysis the interfacial effect and fracture mechanism of solder balls were obtained and their fracture mode classified into two types, viz., bulk fracture and interface fracture. Furthermore, by means of statistical analysis and approximate calculation it was proven that bulk fracture balls have greater adhesive powers and reliability compared with interface fracture balls.

materials science, multidisciplinary,chemistry, physical,physics, applied, condensed matter,metallurgy & metallurgical engineering
Random Vibration Fatigue Life Prediction of Nano-Silver Solder Joint

Zhengbang Zhan,Guangping Zhan,Hui Yang

DOI: https://doi.org/10.1166/jno.2024.3617

2024-06-01

Journal of Nanoelectronics and Optoelectronics

Abstract:Nano-silver is a very potential electronic interconnection material. It’s excellent physical and chemical properties, high thermal conductivity and good electrical conductivity make it very suitable for high power electronic devices. In practical engineering, 20% of the failure of electronic products is caused by vibration load, so it is necessary to study the vibration reliability of interconnected materials. In this paper, the modal and random vibration finite element analysis of nano-silver solder joints were analyzed with workbench software. Predicting random vibration fatigue life of nano-silver solder joint by Coffin-Manson high cycle fatigue empirical formula, Miner’s linear cumulative damage theory and Steinberg model. The random vibration fatigue life of the nanosilver solder joint is 8342 h. It is found that the vibration reliability of nano-silver is inferior to Sn 3.0 Ag 0.5 Cu and Sn63Pb37 and the diameter of solder joints and PCB thickness are proportional to the vibration fatigue life, and the PCB thickness has a greater effect on the vibration life than the solder joint diameter. Solder joint height and pad thickness are inversely proportional to vibration fatigue life, and pad thickness has little effect on vibration fatigue life.

engineering, electrical & electronic,nanoscience & nanotechnology,physics, applied
Characterization and measuring methods on the high-cycling fatigue behavior of SnPb solder joint

Wang Xi-Shu,Yan Cheng-Kun,Zhao Hai-Yan

DOI: https://doi.org/10.3321/j.issn:0469-5097.2009.02.003

2009-01-01

Abstract:Electric circuits or packages in the large-scale integrated circuits and micro electro-mechanical systems are subjected to various effects of environmental conditions,such as mechanical or thermal fatigue impact loading etc.Therefore,the reliable evaluation technique of electric circuit is necessary to obtain enough experimental data of durability and reliability.The prediction of fatigue life,especially high-cycling fatigue life,of a solder joint is one of the most difficult problems in electronic industry.Successful fatigue life prediction of a solder joint depends on the ability of the modeling solder joint accurately.All accurate models have to be validated by experiments and practical applications.In this work,the experimental investigation and simulating analysis for the SnPb solder joint(SMT type)were carried out based on the scanning electron microscopy(SEM)in-situ technology.These results indicate that the fatigue crack initiation occurs at the heel or toe of SnPb solder joint,the fatigue crack propagates along about 20～45° titled to applied stress direction in substrate and the fatigue crack propagation has a small deflection to the applied stress direction with increasing of applied stress.At the same time,the fatigue crack propagation length is limited to within 150 μm because it is dependence on the geometrical size of solder joint.In addition,the response relation in solder alloy to applied stress in substrate was obtained based on the finite element(FE)analysis.Therefore,the prediction of fatigue life of solder joint was proposed based on the experimental data and simulation analysis and predication results agree good with the experimental data including to other literature.
Fatigue Life Prediction for Cbga under Random Vibration Loading by Finite Element Method

Shang Wang,Yanhong Tian,Xuguang Guo

DOI: https://doi.org/10.1109/icept.2014.6922712

2014-01-01

Abstract:In recent years, the reliability under vibration loading has become a very important problem of modern electronic devices. And existing researches have shown that the results of natural frequencies and modal shapes by FEA (Finite Element Analysis) fit that of modal test well. But it is challengeable to execute the vibration fatigue life analysis rapidly and accurately. In this paper, a predict method of fatigue life was used to calculate the random vibration life of CBGA, and the 1:1 finite model was built to obtain relevant data. And the results showed that the outmost corner solder balls were observed to have stress concentration along the interface by using the von Mises stress distributions of solder balls. So the outmost corner solder balls are the dangerous area and their random vibration life can be considered as whole device's life. Through the methods, the random vibration life was obtained and the CBGA model showed a better performance under vibration loading.
Random Vibration Reliability of BGA Lead-Free Solder Joint

Fang Liu,Guang Meng

DOI: https://doi.org/10.1016/j.microrel.2013.08.020

IF: 1.6

2014-01-01

Microelectronics Reliability

Abstract:Solder joint fatigue failure under vibration loading has been a great concern in microelectronic industry. High-cycle fatigue failure of lead-free solder joints has not been adequately addressed, especially under random vibration loading. This study aims to understand the lead-free solder joint behavior of BGA packages under different random vibration loadings. At first, non-contact TV Laser holography technology was adopted to conduct experimental modal analysis of the test vehicle (printed circuit board assembly) in order to understand its dynamic characteristics. Then, its first order natural frequency was used as the center frequency and narrow-band random vibration fatigue tests with different kinds of acceleration power spectral density (PSD) amplitudes were respectively carried out. Electrical continuity through each BGA package is monitored during the vibration event in order to detect the failure of package-to-board interconnects. The typical dynamic voltage histories of failed solder joints were obtained simultaneously. Thirdly, failed solder joints were cross-sectioned and metallurgical analysis was applied to investigate the failure mechanisms of BGA lead-free solder joints under random vibration loading. The results show that the failure mechanisms of BGA lead-free solder joint vary as the acceleration PSD amplitude increases. Solder joint failure locations are changed from the solder bump body of the PCB side to the solder ball neck, finally to the Ni/intermetallic compound (IMC) interface of the package side. The corresponding failure modes are also converted from ductile fracture to brittle fracture with the increase of vibration intensity. Crown Copyright (C) 2013 Published by Elsevier Ltd. All rights reserved.
Prediction of Variability in Vibration Durability of Oligocrystalline SnAgCu Solder Joints

Aniket Bharamgonda,Idowu Olatunji,Xiao Lin,Abhijit Dasgupta,Yaxiong Chen,Varun Thukral,Torsten Hauck

DOI: https://doi.org/10.1109/eurosime60745.2024.10491536

2024-01-01

Abstract:SnAgCu solder joint has oligocrystalline (few large grains) structure and due to body-centered tetragonal (BCT) structure, each grain shows strongly anisotropic behavior. Modelling anisotropic behavior of grain scale solder joints has been extensively researched by this group. In this paper, anisotropic grain-scale plasticity model is used to predict variability of solder joint fatigue durability under sine sweep vibration excitation. Solder experiences different levels of cyclic stress for different grain orientations. Stress-based high cycle fatigue (HCF) model (Basquin’s model) and Miner’s rule are used for determining the variability of vibration durability of solder joints for different orientations and compared with experimental results.
Research on Reliability of SMT Solder Joint in Dynamic Tensile Load

王勇,雷永平,林健,张志政,赵海燕

DOI: https://doi.org/10.3969/j.issn.1001-3474.2009.02.001

2009-01-01

Abstract:Two groups of SMT assemblies are investigated in mechanical fatigue test of dynamic tensile load,the results show that the fatigue lifetime of Sn37Pb solder joints is better than SnAgCu305.When the stress value is 40 MPa,life distance arrives to the maximum,and the former is the latter's 2-3 times.Meanwhile,the S-N life lines of two kinds of solder joints are obtained under 50% and 10% failure rate.Trough the optical microscope of cross-section of two kinds of solder joints,three crack positions can be found both in the two kind of solder joint,and the crack goes through the whole solder joint with the increase of fatigue cycles.
Fatigue of SMT Solder Joint Including Torsional Curvature and Chip Location Optimization

Qiang Guo,Mei Zhao

DOI: https://doi.org/10.1007/s00170-003-2044-9

2005-01-01

Abstract:The objective is to find whether fatigue of the solder joint or the location of the chip is related to the curvature and torsional curvature when SMT solder joints are under vibration or shock condition. However, the torsional curvature is always omitted. In this paper the relationship of curvature and torsional curvature is argued, and it is found that the quantity of the curvature is closer to that of the torsional curvature and shows that omitting the torsional curvature is not accurate. Also, the fatigue of the solder joint including torsional curvature is obtained. One kind of SMT printed circuit board (PCB) used in aviation and spaceflight has been obtained to test its modes. According to the modal results, the location of the SMT assembly is not very suitable and the reliability of SMT solder joints will decrease, which will make an unreasonable catastrophe appear. Meanwhile, the location optimization including curvature and torsional curvature is considered and four areas are obtained in the PCB to locate the chip for increasing the fatigue of solder joints. In this paper the results obtained by assuming the PCB is simply supported in its four boundary. The other fixed condition will be calculated using a similar method.
Thermal Fatigue Process of Novel Sn-Zn System Lead-Free Solder Joint

Geng Zhiting,He Qing,Chen Guohai,Ma Jusheng

2012-01-01

Rare Metal Materials and Engineering

Abstract:Thermal fatigue failure is the main form of electronic package solder failure. In this paper, by means of establishing experimental model, the solder stress-strain changes of Pb-Sn eutectic solder and the novel Sn-Zn system lead-free solder joint in thermal fatigue process were studied, and the rule of solder joint mechanical properties parameters changed with thermal fatigue times was obtained. The experimental result can provide the accurate boundary conditions for finite element analysis estimation of the solder joint reliability.
Low cycle fatigue performance of ball grid array structure Cu/Sn–3.0Ag–0.5Cu/Cu solder joints

H.B. Qin,W.Y. Li,M.B. Zhou,X.P. Zhang

DOI: https://doi.org/10.1016/j.microrel.2014.07.052

IF: 1.6

2014-01-01

Microelectronics Reliability

Abstract:•A plastic strain energy density (PSED) method is used to develop fatigue life model of BGA joints.•A fatigue life prediction model based on PSED is proposed to evaluate fatigue life of BGA joints.•Fatigue crack growth depends strongly on stress triaxiality relating to joint geometry and load mode.•The model prevents effect of plastic strain energy concentration on joint fatigue life prediction.
Device Architecture Optimization of Solder Ball Joints Fatigue Lifetime under Random Vibration Frequencies

Yang Gao,Fuwei Wang,Shaohu Ding,Bin Yang,Lin Liu,Mohammad Salmani

DOI: https://doi.org/10.1108/ssmt-05-2020-0020

IF: 1.494

2020-01-01

Soldering & Surface Mount Technology

Abstract:Purpose This study aims to investigate the vibration effects on ball grid array lifetime. Design/methodology/approach Several finite element method simulations and experiments were performed. Findings An optimized circuit configuration was found. Originality/value The originality of paper is confirmed by authors.
Fatigue Damage Behavior of A Surface-Mount Electronic Package under Different Cyclic Applied Loads

Ren Huai-Hui,Wang Xi-Shu

DOI: https://doi.org/10.1088/1674-1056/23/4/044601

2014-01-01

Chinese Physics B

Abstract:This paper studies and compares the effects of pull–pull and 3-point bending cyclic loadings on the mechanical fatigue damage behaviors of a solder joint in a surface-mount electronic package. The comparisons are based on experimental investigations using scanning electron microscopy（SEM） in-situ technology and nonlinear finite element modeling, respectively. The compared results indicate that there are different threshold levels of plastic strain for the initial damage of solder joints under two cyclic applied loads; meanwhile, fatigue crack initiation occurs at different locations, and the accumulation of equivalent plastic strain determines the trend and direction of fatigue crack propagation. In addition, simulation results of the fatigue damage process of solder joints considering a constitutive model of damage initiation criteria for ductile materials and damage evolution based on accumulating inelastic hysteresis energy are identical to the experimental results.The actual fatigue life of the solder joint is almost the same and demonstrates that the FE modeling used in this study can provide an accurate prediction of solder joint fatigue failure.
The Stress-Strain Behaviors Of Solder Joints During Thermal Fatigue Process

Zhiting Geng, Heqing,Guohai Cheng,Jusheng Ma

DOI: https://doi.org/10.1109/ICEPT.2011.6066944

2011-01-01

Abstract:By means of establishing experimental model, the mechanical behavior and changes in basic parameters of new Sn-Zn system lead-free solder joint in thermal fatigue process were studied, and using the result to evaluate the performance of this new type of lead-free solder, providing the accurate boundary conditions for the reliability estimation methods (finite element analysis) of solder. This study of solder joint reliability and life assessment in thermal fatigue process has very important theoretical and practical significance.
Three-dimension Finite Element Simulation for a PCB Assembly under Random Vibration Loading

Guang Meng

2012-01-01

Abstract:Three-dimension finite element model was established by using ABAQUS software,and the base-excitation method was adopted to carry out random power spectral analysis of a PCB assembly.Through comparison,simulation results had a very good correlation with experimental measurement ones for the center displacement responses of the PCB assembly.The correctness and effectivenesess of the FE model were verified.It was shown that(1) there is a larger peeling stress at the solder joints locating at the outermost corners of the package,these solder balls at the outermost corners are critical solder joints,and are very vulnerable to crack;(2) when the fixed screws become loose,the natural frequencies of the PCB assembly decrease,and the root mean square values of the critical solder joints' peeling stresses increase;the bigger the peeling stress of a solder joint,the more vulnerable the solder joint;thus,these critical solder joints are more easily damaged.
Thermal Fatigue Modelling and Simulation of Flip Chip Component Solder Joints under Cyclic Thermal Loading

Liangyu Wu,Xiaotian Han,Chenxi Shao,Feng Yao,Weibo Yang

DOI: https://doi.org/10.3390/en12122391

IF: 3.2

2019-06-21

Energies

Abstract:Thermal Fatigue of flip chip component solder joints is widely existing in thermal energy systems, which imposes a great challenge to operational safety. In order to investigate the influential factors, this paper develops a model to analyze thermal fatigue, based on the Darveaux energy method. Under cyclic thermal loading, a theoretical heat transfer and thermal stress model is developed for the flip chip components and the thermal fatigue lives of flip chip component solder joints are analyzed. The model based simulation results show the effects of environmental and power parameters on thermal fatigue life. It is indicated that under cyclic thermal loading, the solder joint with the shortest life in a package of flip chip components is located at the outer corner point of the array. Increment in either power density or ambient temperature or the decrease in either power conversion time or ambient pressure will result in short thermal fatigue lives of the key solder joints in the flip chip components. In addition, thermal fatigue life is more sensitive to power density and ambient temperature than to power conversion time and ambient air pressure.

energy & fuels
Study of Package-on-Package Solder Joints under Random Vibration Load Based on Patran

Long Zhang,Chun-yue Huang,Wei Huang,Tian-ming Li,Jianwei Hua

DOI: https://doi.org/10.1109/icept.2016.7583172

2016-01-01

Abstract:The 3D finite element analysis model of Package-on-Package solder joints was set up based on Patran software. The natural frequency, vibration mode of the model was analyzed under the condition of random vibration, the stress and strain distribution and the strain power spectrum density of response curves of the Package-on-Package solder joints were obtained, and the random vibration fatigue life of the Package-on-Package solder joints were also calculated out based on the power spectrum and rain flow count method; the influence of pad diameter on the random vibration fatigue life of the Package-on-Package solder joints were analyzed. The results show that the Package-on-Package solder joints of the model in this paper has the random vibration fatigue life of 997 hours; on the condition of the pad diameter of the second-layer solder joints increases from 0.15 mm to 0.30mm, the Package-on-Package solder joints vibration fatigue life increases with the increase of the pad diameter.

Random Fatigue Semi - Experimental Model of SMT Solder Joint in Random Vibration Condition

SMT solder joint's semi-experimental fatigue model

Actuality and Development of Fatigue Models of Solder Joints in Micro-Electronic Packaging

Predicting fatigue life of Solder joint with submodel method for a BGA package

Vibration fatigue experiments of SMT solder joint

Experimental and Statistical Study of the Fracture Mechanism of Sn96.5Ag3Cu0.5 Solder Joints via Ball Shear Test

Random Vibration Fatigue Life Prediction of Nano-Silver Solder Joint

Characterization and measuring methods on the high-cycling fatigue behavior of SnPb solder joint

Fatigue Life Prediction for Cbga under Random Vibration Loading by Finite Element Method

Random Vibration Reliability of BGA Lead-Free Solder Joint

Prediction of Variability in Vibration Durability of Oligocrystalline SnAgCu Solder Joints

Research on Reliability of SMT Solder Joint in Dynamic Tensile Load

Fatigue of SMT Solder Joint Including Torsional Curvature and Chip Location Optimization

Thermal Fatigue Process of Novel Sn-Zn System Lead-Free Solder Joint

Low cycle fatigue performance of ball grid array structure Cu/Sn–3.0Ag–0.5Cu/Cu solder joints

Device Architecture Optimization of Solder Ball Joints Fatigue Lifetime under Random Vibration Frequencies

Fatigue Damage Behavior of A Surface-Mount Electronic Package under Different Cyclic Applied Loads

The Stress-Strain Behaviors Of Solder Joints During Thermal Fatigue Process

Three-dimension Finite Element Simulation for a PCB Assembly under Random Vibration Loading

Thermal Fatigue Modelling and Simulation of Flip Chip Component Solder Joints under Cyclic Thermal Loading

Study of Package-on-Package Solder Joints under Random Vibration Load Based on Patran