Failure and Failure Characterization of QFP Package Interconnect Structure under Random Vibration Condition.
Hu Jiaxing,Jing Bo,Sheng Zengjin,Lu Fang,Chen Yaojun,Zhang Yulin
DOI: https://doi.org/10.1016/j.microrel.2018.08.011
IF: 1.6
2018-01-01
Microelectronics Reliability
Abstract:Electronics installed in modern complex systems, like automotive and aircraft systems, are mainly subjected to mechanical vibrations in applications. The interconnection structure, as the mechanical fixing and electrical interconnection between the electrical device and the printed circuit board, is a key part in electronics. Presently, there are few researching articles on reliability of QFP interconnect structure under random vibration. In this paper, eight specimens of QFP100 with the self-testing real-time circuit have been tested to failure by subjecting to a narrow-band random vibration at its first natural frequency. The charging time of external capacitor in the self-test circuit has been extracted as the monitoring signal. Failure modes of interconnect structure have been analyzed in statistics. Then, the relationship between the monitoring signal and interconnect failure has been investigated. Finally, failure data, conforms to a two-parameter Weibull distribution, has been used to establish the life distribution of interconnect structure. Results show that there are four failure modes and three failure places in interconnect structure under random vibration, which is consistent with simulation results by FEM, and the charging time can characterize the failure and failure process of interconnect structure well.