Ni Schottky Barrier Diodes on n-type 4H-Silicon Carbide

xu jun,xie jiachun,dong xiaobo,wang keyan,li yao,yi bo
DOI: https://doi.org/10.3969/j.issn.0253-2778.2002.03.011
2002-01-01
Abstract:With microelectronics plane technology, the electron beam evaporation is used to deposit metal Ni to form the Schottky contact and alloys Ni, Ti, Ag to form ohmic contact in high vacuum ambient, and grow silicon oxide insulating ring around the periphery of the diodes to reduce the electric filed crowding at the diode edges. The experimentally obtained values of breakdown voltage for Ni/4H-SiC Schottky diodes have been found to be higher than 450V, and the leakage current is 6×10 -6 A. The measurements of the I-V characteristics of these diodes have been analyzed and simulated and the ideality factor has been found at 1.73 and the Schottky barrier height at 1.25 V. The diodes show good rectifier property and a low leakage current.
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