Abstract:The through silicon via (TSV) is one of the important enabling technologies of stacked 3-D ICs. However, the crosstalk is generated when signals are transmitted through the closely clustered TSVs due to the coupling effect. The crosstalk avoidance code (CAC) techniques have attracted great concerns in recent years, for the TSV-to-TSV crosstalk deteriorates the signal integrity. Nevertheless, the CAC techniques usually require specific shape of the TSV array, e.g., $3\times N$ array. This work proposes a crosstalk suppression scheme combining the CAC method and the static shielding technique, named Mosaic-3C1S. The proposed scheme is able to be applied to arbitrary rectangular TSV arrays. In the proposed scheme, the $2\times 2$ TSV subarray, which contains three signal TSVs and one shielding TSV, is used as the basic unit to tile the rectangular TSV array. The CAC method is applied to the signal TSVs in the $2\times 2$ subarrays, and the raw data are transmitted by the rest boundary TSVs, if any. In order to further reduce the bit overhead, a triangular numeral system (TNS)-based CAC, named TNS-CAC, is proposed and applied. The simulation results show that the proposed TNS-CAC has advantages on bit overhead and codec area. The proposed Mosaic-3C1S scheme with TNS-CAC is able to suppress the crosstalk between TSVs to 6C level. The bit overhead of the proposed scheme is between 25% and 45%, which is lower than that of the previous CAC methods for TSV arrays for the most cases.

A Crosstalk Avoidance Scheme Based on Re-Layout of Signal TSV.

A Crosstalk Avoidance Method Combining Crosstalk Avoidance Code with Shielding Wire Technique

Crosstalk Reduction in TSV Arrays with Direct Ohmic Contact Between Metal and Silicon-Substrate

Mosaic-3C1S: A Low Overhead Crosstalk Suppression Scheme for Rectangular TSV Array

Crosstalk Noise of Octagonal TSV Array Arrangement Based on Different Input Signal

An exhaustive search of the 6C level crosstalk avoidance codes for TSV array

Different designs of TSVs for 3D IC: Signal integrity analysis with cascaded scattering matrix

An Enhancement of Crosstalk Avoidance Code Based on Fibonacci Numeral System for Through Silicon Vias

An Exhaustive Search Of The Optimal 6c Level Static Shielding Scheme For Rectangle Tsv Arrays

Transmission Characteristics Of A Coaxial Through-Silicon Via (C-Tsv) Interconnect

3DCAM: A Low Overhead Crosstalk Avoidance Mechanism for TSV-Based 3D ICs

A Shielding Structure for Crosstalk Reduction in Silicon Interposer

TSV-to-TSV Crosstalk Induced Delay Analysis for 3D ICs

Crosstalk of octagonal TSV array arrangement based on differential signal

Crosstalk and Congestion Driven Layer Assignment Algorithm

Shielding Area Optimization under the Solution of Interconnect Crosstalk

Priority-Based Routing Resource Assignment Considering Crosstalk.

Fast time domain crosstalk analysis of through silicon vias based on equivalent circuit model

Dynamic Data Split: A Crosstalk Suppression Scheme in TSV-based 3D IC.

Characterization of corner/edge effects of through silicon via arrays and layout optimization in 3D integrated circuits

Research on Crosstalk Issue of Through Silicon Via for 3d Integration