Crosstalk of octagonal TSV array arrangement based on differential signal

Jiang Han,Ziyu Liu,Ziyuan Zhu,Lin Chen,Qingqing Sun
DOI: https://doi.org/10.1109/EDTM50988.2021.9420892
2021-01-01
Abstract:In this work, the electromagnetic crosstalk of the TSV array was investigated to find the efficient way of reducing signal integrity. Three types of common TSV array including mesh and staggered array were designed and the coupling noise was used to characterize the signal crosstalk. The TSV mesh array with the staggered arrangement of differential signal and ground TSV could greatly depress the coupling noise compared with the mesh array without differential signal. In order to decrease ground TSV number and save substrate area, we proposed a octagon TSV array layout with differential signal, which could reduce coupling noise by 40% compared to staggered mesh array with signal.
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