Abstract:In spite of a high market share of plastic IC packaging, there are still reliability issues, especially for the effects of moisture. The mechanism between moisture and epoxy polymer is still obscure. A multi-step cross-linking approach was used to mimic the cross-linking process between the DGEBA resin and JEFFAMINE®-D230 agent. Based on the molecular dynamics method, the thermo-mechanical properties and microstructure of epoxy polymer were analyzed. In this paper, the degree of cross-linking ranged from 0% to 85.4% and the moisture concentration ranged from 0 wt.% to 12 wt.%. The hydrogen bonds were investigated in the moisture invaded epoxy polymer. Although most of the hydrogen bonds were related to water molecules, the hydrogen bonds between the inside of epoxy polymer were reduced only a little as the concentration of moisture increased. The diffusion coefficient of the water molecules was found to increase with the increase of moisture concentration. When the moisture concentration was larger than 12 wt.% or smaller than 1.6 wt.%, the diffusion coefficient was less affected by the epoxy polymer. In addition, the free volume and the thermal conductivity of the epoxy polymer were considered. It was found that the moisture could increase the thermal conductivity from 0.24 to 0.31 W/m/K, identifying a coupling relationship between moisture and thermal properties. Finally, the mechanical properties of epoxy polymer were analyzed by uniaxial tensile simulation. The COMPASS and DREIDING force fields were used during the uniaxial tensile simulation. A better result was achieved from the DREIDING force field compared with the experiment. The degree of cross-linking was positively correlated with mechanical properties. For the system with the largest degree of cross-linking of 85.4%, the Young’s modulus was 2.134 ± 0.522 GPa and the yield strength was 0.081 ± 0.01 GPa. There were both plasticizing and anti-plasticizing effects when the water molecules entered the epoxy polymer. Both the Young’s moduli and yield strength varied in a large range from 1.38 to 2.344 GPa and from 0.062 to 0.128 GPa, respectively.

Moisture Absorption in Uncured Underfill Materials

Influence of moisture absorption in uncured underfill materials

Study on effect of coupling agents on underfill material in flip chip packaging

The Moisture Absorption Properties of Liquid Type Epoxy Molding Compound for Chip Scale Package According to the Change of Fillers

Effect of curing agent polarity on water absorption and free volume in epoxy resin studied by PALS

Effects of Moisture Ingress on the Mesoscale Mechanical Properties of Epoxy Adhesives under Elevated Temperature

Molecular Dynamics Investigation of the Thermo-Mechanical Properties of the Moisture Invaded and Cross-Linked Epoxy System

Moisture absorption process of epoxy resin and mechanical properties of its fiber composites

Study on the Hygrothermal Reliability of Underfill/Passivation Layer Interface Using the Silane Coupling Agent as Adhesion Promoter

Moisture Absorption and Desorption in a UV Cured Urethane Acrylate Adhesive Based on Radiation Source

Water Absorption and Compressibility of Solid Buoyancy Materials Based on Epoxy Resins

Wet property of a new wet/hot-resisting epoxy resin

Characterization of moisture effect on static and fatigue performance of epoxy resin using thin-film specimen on dynamic mechanical analyzer

Moisture Diffusion and Hygroscopic Swelling of Adhesives in Electronics Packaging

Effect of Condensed Water at an Alumina/Epoxy Resin Interface on Curing Reaction

Effect of curing agents n‐octylamine and m‐xylene diamine on the mechanical and memory properties of E51 epoxy resin

Study on EP adhesive cured by m-PDA/low molecular PA

Effect of Silane Coupling Agents on the Underfill Adhesion undergoing Heat Aging Test

Study on the Curing Reaction, Dielectric and Thermal Performances of Epoxy Impregnating Resin with Reactive Silicon Compounds As New Diluents

Preparation of Heat‐moisture Resistant Epoxy Resin Based on Phosphazene

Contributions of the Side Groups to the Characteristics of Water Absorption in Cured Epoxy Resins