Abstract:In spite of a high market share of plastic IC packaging, there are still reliability issues, especially for the effects of moisture. The mechanism between moisture and epoxy polymer is still obscure. A multi-step cross-linking approach was used to mimic the cross-linking process between the DGEBA resin and JEFFAMINE®-D230 agent. Based on the molecular dynamics method, the thermo-mechanical properties and microstructure of epoxy polymer were analyzed. In this paper, the degree of cross-linking ranged from 0% to 85.4% and the moisture concentration ranged from 0 wt.% to 12 wt.%. The hydrogen bonds were investigated in the moisture invaded epoxy polymer. Although most of the hydrogen bonds were related to water molecules, the hydrogen bonds between the inside of epoxy polymer were reduced only a little as the concentration of moisture increased. The diffusion coefficient of the water molecules was found to increase with the increase of moisture concentration. When the moisture concentration was larger than 12 wt.% or smaller than 1.6 wt.%, the diffusion coefficient was less affected by the epoxy polymer. In addition, the free volume and the thermal conductivity of the epoxy polymer were considered. It was found that the moisture could increase the thermal conductivity from 0.24 to 0.31 W/m/K, identifying a coupling relationship between moisture and thermal properties. Finally, the mechanical properties of epoxy polymer were analyzed by uniaxial tensile simulation. The COMPASS and DREIDING force fields were used during the uniaxial tensile simulation. A better result was achieved from the DREIDING force field compared with the experiment. The degree of cross-linking was positively correlated with mechanical properties. For the system with the largest degree of cross-linking of 85.4%, the Young’s modulus was 2.134 ± 0.522 GPa and the yield strength was 0.081 ± 0.01 GPa. There were both plasticizing and anti-plasticizing effects when the water molecules entered the epoxy polymer. Both the Young’s moduli and yield strength varied in a large range from 1.38 to 2.344 GPa and from 0.062 to 0.128 GPa, respectively.

Influence of moisture absorption in uncured underfill materials

Moisture Absorption in Uncured Underfill Materials

Study on effect of coupling agents on underfill material in flip chip packaging

The Moisture Absorption Properties of Liquid Type Epoxy Molding Compound for Chip Scale Package According to the Change of Fillers

Underfill of flip chip on organic substrate: viscosity, surface tension, and contact angle

Warpage behavior of the flip chip package in underfill curing process: in situ characterization and numerical simulation

Study on the Hygrothermal Reliability of Underfill/Passivation Layer Interface Using the Silane Coupling Agent as Adhesion Promoter

Enhancement of underfill encapsulants for flip‐chip technology

Moisture Desorption and Hygro-Vapor-Thermal Induced Interfacial Delamination in Underfilled FCBGA Package During Reflow Process

Effect of Silane Coupling Agents on the Underfill Adhesion undergoing Heat Aging Test

Underfill Filler Settling Effect on the Adhesive Force of Flip Chip Packages

Effects of Filler Configuration and Moisture on Dissipation Factor and Critical Electric Field of Epoxy Composites for HV-ICs Encapsulation

Rheology Study of Wafer Level Underfill

Application of Underfill for Flip-Chip Package Using Ultrasonic Bonding

The delamination of solder ball involving moisture and thermal effect in IC package

Moisture Diffusion and Hygroscopic Swelling of Adhesives in Electronics Packaging

Discussion on influence of moisture absorption on the reliability of integrated circuit package

Effects of Moisture Diffusion on a System-in-Package Module by Moisture–Thermal–Mechanical-Coupled Finite Element Modeling

Investigation Of Characteristics Of The Capillary-Driven Underfill Flow

Advanced underfill for high thermal reliability

Molecular Dynamics Investigation of the Thermo-Mechanical Properties of the Moisture Invaded and Cross-Linked Epoxy System