Abstract:In flip-chip packaging, an underfill is dispensed on one or two adjacent sides of the die. The underfill is driven by a capillary flow to fill the gap between the die and substrate. The application of an underfill reduces the stress to solder bumps and enhances the reliability of the solder joints. Underfill materials consist of epoxy or cyanate ester resins, catalyst, crosslinker, wetting agent, pigment, and fillers. Underfill materials are highly filled with the filler loading ranging from 40% to 70%. In terms of underfill material processing, fast flow and curing are desired for high throughput. The viscosity, surface tension, and contact angle are key material properties affecting the gap filling process. In order to achieve fast filling, it is required that an underfill material has low viscosity and low contact angle at dispensing temperatures. Due to curing of an underfill material at dispensing temperature, the viscosity increases with time, which complicates the underfill flow process. The rheological behavior of several underfill materials was experimentally studied. All the underfill materials showed strong temperature dependence in viscosity before the curing. The time dependent viscosity and curing of underfill materials were examined by a dynamic time sweep test. The effects of viscosity and curing behavior of underfill materials on underfill material processing were investigated. The material with a longer gel time had more stable viscosity at room temperature, and therefore longer pot life. Experimental methods were developed to measure the surface tension and the contact angle of underfills at temperatures over 100 °C. Results showed that the contact angle for underfill on a substrate was time dependent. The interaction between underfill and substrate affects not only gap filling, but also filleting. The effect of surface energies of flip-chip substrates on wetting angles was also studied. Experiment results showed that for the same underfill, the higher the surface energy of substrate, the better the filleting.

Study on effect of coupling agents on underfill material in flip chip packaging

Enhancement of underfill encapsulants for flip‐chip technology

Effect of coupling agents on thermal, flow, and adhesion properties of epoxy/silica compounds for capillary underfill applications

Effect of Silane Coupling Agents on the Underfill Adhesion undergoing Heat Aging Test

Study on the Hygrothermal Reliability of Underfill/Passivation Layer Interface Using the Silane Coupling Agent as Adhesion Promoter

Influence of moisture absorption in uncured underfill materials

The Investigation of Interface Effect on the Properties of Nanosilica-Based Underfill

Effect of the Presence of a Silane Coupling Agent on Reaction Kinetics of Cationic Thermopolymerization of Epoxy Resin Adhesive

Underfill Filler Settling Effect on the Adhesive Force of Flip Chip Packages

Study of the effects of coupling agents on the property of Al2 O3-epoxy resin casting system

Effect of coupling agents on the dielectric properties of aluminum particles reinforced epoxy resin composites

Synthesis and Characterization of Compound Coupling Agent-Modified Hollow Glass Microspheres/Epoxy Composites

Surface Treatment of Micron Silver Flakes with Coupling Agents for High-Performance Electrically Conductive Adhesives

Effect of the toughening agent and coupling agent on the Liquid Epoxy Molding Compound

Effects of Silane Coupling Agent Treatment on Properties SiO2/Epoxy Nanocomposites

Influence of Coupling Agents on the Chemical Compatibility Between Ultrafine Si3n4 Powders and Organic Binders

Underfill of flip chip on organic substrate: viscosity, surface tension, and contact angle

Moisture Absorption in Uncured Underfill Materials

Effect of compound coupling agent treatment on mechanical property and water absorption of hollow glass microspheres/epoxy composite

Effect of sulfur-containing silane couping agent on filler network structure and rheological behavior of silica filled natural rubber compounds

Effect of siloxane quantity and ph of silane coupling agents and contact angle of resin bonding agent on bond durability of resin cements to machinable ceramic.