The Moisture Absorption Properties of Liquid Type Epoxy Molding Compound for Chip Scale Package According to the Change of Fillers

W. Kim
DOI: https://doi.org/10.5012/JKCS.2010.54.5.594
2010-10-20
Abstract:ABSTRACT. Since the requirement of the high density integration and thin package technique of semiconductor have been increas-ing, the main package type of semiconductor will be a chip sc ale package (CSP). The changes of diffusion coefficient and moistu recontent ratio of epoxy resin systems according to the change of liquid type epoxy resin and fillers for CSP applications were i nvestigat-ed. The epoxy resins used in this study are RE-304S, RE310S, and HP-4032D, and Kayahard MCD as hardener and 2-methylimidazoleas catalyst were used in these epoxy resin systems. The micro- sized and nano-sized spherical type fused silica as filler were u sedin order to study the moisture absorption properties of these epoxy molding compound (EMC) according to the change of filler si ze.The temperature of glass transition (Tg) of these EMC was measured using Dynamic Scanning Calorimeter (DSC), and the moistureabsorption properties of these EMC according to the change of time were observed at 85 o C and 85% relative humidity condition using a thermo-hygrostat. The diff usion coefficients in these EMC were calculated in terms of modified Crank equation based o nFicks' law. An increase of diffusion coefficient and maximum moisture absorption ratio with Tg in these systems without filler can be observed, which are attributed to the increase of free volu me with Tg. In the EMC with filler, the changes of Tg and max i-mum moisture absorption ratio with the filler content can be ha rdly observed, however, the diffusion coefficients of these syst emswith filler content show the outstanding changes according to the filler size. The diffusion via free volume is dominant in the EMCwith micro-sized filler; however, the diffusion with the interaction of absorption according the increase of the filler surface area is dominant in the EMC with nano-sized filler.
Engineering,Materials Science
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