A Study on the Technical Method of Drilling Micro Holes on New CMC-SiC with Femtosecond Laser

Feng Wang,Jian Jun Luo,Ming Li,Yue Deng
DOI: https://doi.org/10.4028/www.scientific.net/amm.543-547.3924
2014-01-01
Applied Mechanics and Materials
Abstract:To solve the difficulties of processing micro holes on the CMC-SiC, femtosecond laser was used as the drilling tool in this paper. And a new type of laser beam scanning module was studied. The study confirms the feasibility of finishing the processing of micro holes whose diameter is less than 2mm on the new CMC-SiC. And the preliminary optimization of processing parameters is completed. According to the experimental results, the important factors affecting the quality of the micro holes were analyzed, and the factors are the processing power and the scanning speed. The results also show that the femtosecond laser processing technology can solve the difficulties of drilling mirco holes on the new CMC-SiC in our countrys aerospace field.
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