Water Vapor Treatment for Decreasing the Adhesion Between Vertically Aligned Carbon Nanotubes and the Growth Substrate

Yagang Yao,Kyoung-Sik Moon,Andrew McNamara,Ching-ping Wong
DOI: https://doi.org/10.1002/cvde.201304319
2013-01-01
Chemical Vapor Deposition
Abstract:A simple way to decrease the adhesion between vertically aligned carbon nanotubes and the growth substrate is reported. The decreased adhesion helps the transfer of VACNTs grown from the BM CVD system onto specific substrates. Using this method, a CNT-based thermal interface material, which is a Si/CNT/Cu tri-layer structure, is made. A low thermal resistance of ∼10.5 mm2 K W−1 is achieved.
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