Enhancement of Interfacial Adhesion Between Carbon Nanotube Thin Film and Substrate Using a Gold-Nickel Buffer Layer

Qingan Liang,Yu Zhang,Yanlin Ke,Jun Chen,Ningsheng Xu,Shaozhi Deng
DOI: https://doi.org/10.1109/ivnc.2016.7551496
2016-01-01
Abstract:A gold-nickel buffer layer is used to improve the adhesion of VACNT and silicon substrate. The VACNTs exhibit an excellent adhesive behavior after a post-annealing process. The interfacial morphology and structure are characterized by SEM. The physical mechanism is also discussed.
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