Abstract:Using air-gaps instead of conventional silicon dioxide as the insulations of TSV has the potential to improve the electrical performance and solve some thermal reliability issues of TSV. Problems regarding the air-gap TSV process are studied and solutions for electrical parameters and reliability are investigated. Thanks to large difference of dielectric constant between air and silicon dioxide, the capacitance of air-gap TSV is considerably reduced to 48 fF, and the leakage current is quiet low (1.22 pA at 20 V). Finite element analysis (FEA) shows the stresses in the substrate and insulations are reduced significantly by air-gaps, evaluating the temperature stresses and deformation on the air-gap liner. Because of the air-gap, the Cu plugs are free from shear constraint and stress interaction from the sidewalls. The thermal shock test (TST) shows satisfactory barrier integrity and good stability of air-gap liner, since sudden changes of temperature stresses didn't deteriorate the insulation ability of air-gaps. Thermal variation underlines an impact of temperature on the electrical parameters of air-gap TSV, where the C-V and I-V characteristics are measured from 25 °C to 100 °C with 25 °C increment. A typical hysteresis occurred, which is considered to be attributed to the interface states and traps in the insulator adjacent to the interface. Those simulation and electrical tests demonstrate good thermo-mechanical stability and intrinsic dielectric property, fulfilling the requirement of applications.

Air-gap/SiO<inf>2</inf> liner TSVs with improved electrical performance

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Thermal Reliability Tests of Air-Gap TSVs with Combined Air-SiO2Liners

Thermal and electrical tests of air-gap TSV

Development of Ultra-Low Capacitance Through-Silicon-vias (tsvs) with Air-Gap Liner

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Thermal and Electrical Reliability Tests of Air-Gap Through-Silicon Vias

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Electrical Characterization of Shielded TSVs With Airgap Isolation for RF/mmWave Applications

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High-Frequency Characterization of Through-Silicon-Vias With Benzocyclobutene Liners