Pmma Deep Etching By O2rie

a yu,guifu ding,xiaoyun guo,changmin li,haiping mao,zhiping ni
DOI: https://doi.org/10.1117/12.408400
2000-01-01
Abstract:The microstructures that have relatively large height, high aspect ratio are very important for improving micro-devices' characteristics. In this paper reactive ion etching(RIE) of PMMA to create high aspect ratio micro-structures was described. We use Ni film as mask, which was patterned by usual photochemical etching, then use O2RIE technology to etch PMMA thick film(100 mum). During the etching process, O-2 pressure, etching power are very important for the etching results. There are grass-like residues remained on the etched surface until the PMMA was over etched, this phenomena is caused by the micro-mask effect. With over etched, the grass-like residues can be eliminated. The etched surface is very smooth and the side wall is vertical. The etching depth can get up to higher than 100 muM and the aspect ratios is 5.
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