Study on Deep Reactive Ion Etching of Commerical Polymethlmethacrylate Film

张丛春,杨春生,丁桂甫,毛海平,倪智萍

DOI: https://doi.org/10.3321/j.issn:1006-2467.2004.z1.029

2004-01-01

Abstract:A reactive ion etching process of commercial PMMA was developed to fabricate microstructures. The polymer decomposition in plasma was described. Ion bombardment of the polymer surface is characterized as the energetically dominant activation mechanism. The effect of process parameters on the etching rate and profile was discussed. It is demonstrated that the etching rate initially increases with the increasing gas pressure but decreases after 6.65 Pa, too high pressure is deleterious to the anisotropy etching. The etching rate increases continually with the increased power density, but the power can not surpass (50 W) to prevent sample from distorting. The microstructures with deep and smooth sidewall can be achieved by an optimum etching process.