Abstract:The rapid advancement of micro-nano machining technology has led to a decrease in the dimensions of microdevices and microchips, following the principles of Moore's law. In addition to conventional semiconductor materials like silicon, emerging nanoscale materials such as nanowires, nanotubes, and two-dimensional materials are being considered as promising alternative constituent materials. The mechanical properties of these materials have a significant impact on the performance and service life of these microdevices and microchips. However, conventional mechanical testing methods have difficulty in accurately measuring the properties of these materials at the nanoscale due to limitations in displacement control and microforce sensing. Consequently, there is an urgent need to develop a micromechanical device capable of testing nanoscale solid materials. In this study, we propose a concept based on high-resolution image sequences for the design of an integrated micromechanical device capable of synchronously measuring the force and deformation of tested specimens. The device has been fabricated using ultrafast femtosecond laser etching technology, which offers an efficient and cost-effective approach for manufacturing microstructures and is suitable for processing various materials such as metals and nonmetals. The stiffness of the device plays a crucial role in the design of the micromechanical device, and a stiffness-matching criterion is introduced to ensure appropriate design parameters. The fabricated device is employed to conduct in-situ tension experiments on SiC nanowires and multilayer molybdenum disulfide nanosheet within a scanning electronic microscope, enabling accurate measurement of their strength, modulus, and fracture strain.

Fabrication of a Novel Device by Release the Stress in a Reliable Way

Fabrication and characterization of SiO2 microcantilever for microsensor application

Fabrication of SiO $_{2}$ Microcantilever Using Isotropic Etching With ICP

Design of Piezoresistive Micro-Cantilever with Stress Concentration Regions

A Front-Side Released Single Crystalline Silicon Piezoresistive Microcantilever Sensor

A Silicon Microcantilever Biosensor Fabricated on SOI Wafers Using a Two-Step Releasing Approach

Fabrication of ultra-thin silicon stress sensor chips with high flexibility and high sensitivity

Process-Induced Stress and Hydrogen Effects on Monolithic Integrated CMOS-MEMS Micro-Bimaterial Cantilever Sensor Array

Design, Fabrication And Characterization Of A Two-Step Released Silicon Dioxide Piezoresistive Microcantilever Immunosensor

Tracking in-die mechanical stress through silicon embedded sensors for advanced packaging applications

An integrated push-to-pull micromechanical device: Design, fabrication, and in-situ experiment

The flexible package and applications of ultra-thin sensor chip

Fundamental Study of the Micro-Cantilever for More Sensitive Surface Stress-Based Biosensor

Research of Mechanism of Buried Oxide Layer Stress Impact on the Micro-cantilever Processing Breakage

Fabrication of Ultra-High-sensitivity Flexible Strain Sensor Based on Single ZnO Nanowire

FABRICATION AND PROPERTIES OF A MICROSTRAIN SENSOR BASED ON ZINC OXIDE NETWORK STRUCTURE

Design, Fabrication, and Calibration of a Piezoresistive Stress Sensor on SOI Wafers for Electronic Packaging Applications

A Novel Double-sided Fabric Strain Sensor Array Fabricated with a Facile and Cost-effective Process

Parylene-coated NMOSFET-embedded cantilevers for surface stress sensing in liquid environment.

Design of High-Sensitivity Cantilever and Its Monolithic Integration with CMOS Circuits

A Novel Fabrication Method for Flexible SOI Substrate Based on Trench Refilling with Polydimethylsiloxane