New Ultrasonic Elliptic Vibration Centerless Grinding Technique
FAN Yu-feng,TANG Kun,YIN Shao-hui,ZHU Yong-jian,WU Yong-bo
DOI: https://doi.org/10.3969/j.issn.1672-6030.2010.06.002
2010-01-01
Nanotechnology and Precision Engineering
Abstract:A novel centerless grinding method using an ultrasonic elliptic vibration shoe instead of the traditional regulating wheel was developed in this paper,in which the end face of the vibration shoe generated an elliptic motion at a high frequency and controlled the rotational speed of the workpiece when the alternative current(AC) voltages were applied to the piezoelectric ceramic device(lead zirconate titanate,PbZrTiO3,PZT).The ultrasonic elliptic vibration shoe was designed in the respects of vibration mode,excitation method,structure and dimensions.The relationship between the parameters of input signal,such as frequency,phase difference,and voltage amplitude,and the shapes and amplitudes of the ultrasonic elliptic vibration at the end of the shoe was also investigated.Experimental results show that the ultrasonic elliptic vibration shoe had a good performance and the ultrasonic elliptic vibration on the end face of the shoe could control the workpiece rotation precisely.Finally,grinding experiments were conducted on the micro cylindrical workpieces with the initial diameters of 1 mm—5 mm using a modified centerless grinder.Results indicate that the roundness error of the ground workpieces was decreased from 20 μm down to less than 3 μm with the minimum of 0.73 μm and the minimum diameter of the ground workpieces reached 130 μm,which has verified the validity of the proposed new method.