S1302-2-3 Workplace Rotation Motion in Centerless Grinding Using Surface Grinder

Weixing XU,Yongbo WU,Takashi SATO,Weimin LIN
DOI: https://doi.org/10.1299/jsmemecjo.2009.4.0_259
2009-01-01
The proceedings of the JSME annual meeting
Abstract:In our previous study, a new centerless grinding method using surface grinder was proposed. This paper studies the workpiece rotation motion during grinding process. The vibration characteristics of ultrasonic shoe were investigated at first to clarify the effect of applied voltage on the motion of shoe end-face. Then, the workpiece rotation test was carried out to measure the motion on the shoe end-face and predict the rotational speed of workpiece. Finally, the actual grinding operations were performed with and without a friction plate on the end-face of shoe, respectively. The results indicated that the workpiece rotational speed can be controlled exactly by the shoe ultrasonic vibration and a higher workpiece rotational speed results with a better roundness.
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