Abstract:Gold over Ni is one of the most common surface finishes for Cu soldering pads in ball-grid-array (BGA) and other electronic packages. The Au layer is for oxidation protection, and the Ni layer serves as a solderable diffusion barrier. In this study, eutectic Pb-Sn solder-balls were reflowed on the Au/Ni/Cu pads, and the chemical interactions between the solder and the surface finish were studied. Quenched-in microstructures at different stages of the reflow were carefully examined using the scanning electron microscopy. It was found that the solder melted locally along the solder/pad interface at the very early stages of the reflow before the whole solder ball had reached the Pb–Sn eutectic temperature. This was because a ternary eutectic reaction L = (Pb) + (Sn) + AuSn4 occurred at 177°C, six degrees below the Pb–Sn eutectic temperature. Four distinct stages were identified for the reflow process. The four stages are: 1)partial melting of solder balls and the initial reaction of Au with Sn; 2)complete reaction of Au with Sn; 3)separation of (Au${}_{x}$Ni${}_{1-x}$)Sn${}_{4}$ from the pad; 4)complete melting of solder balls and the reaction of Ni with Sn. After a typical reflow, with a 225°C peak reflow temperature and 115s reflow time, all the Au and Au-bearing intermetallic compounds left the interface and the only intermetallic compound at the interface was Ni3Sn4 with a thickness of about 2$\mu$m. partial melting of solder balls and the initial reaction of Au with Sn; complete reaction of Au with Sn; separation of (Au${}_{x}$Ni${}_{1-x}$)Sn${}_{4}$ from the pad; complete melting of solder balls and the reaction of Ni with Sn.

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Au-SN Flip-Chip Solder Bump for Microelectronic and Optoelectronic Applications

Interfacial reaction between Sn-Ag-Cu solder and Co-P films with various microstructures

Research on Ni3Sn4 Intermetallic Compound for 5 M Diameter Cu/Ni/Sn-3.0Ag Micro Bumps

Reaction of solder with Ni/Au metallization for electronic packages during reflow soldering

Interfacial reactions with and without current stressing at Sn–Co/Ag and Sn–Co/Cu solder joints

Interfacial Reactions in Sn–20In–2.8Ag/Cu Couples

Cu aggregation behavior on interfacial reaction of Sn-3.0Ag-0.5Cu/ENIG solder joints

Reactive Wetting of Eutectic Sn3.8Ag0.7Cu Solder on Electrodeposited Fe-Ni Alloy Layer

Study on the metallurgical reaction law and mechanism of the Ni-xCu alloys/pure Sn solid-liquid interface

Effect of the addition of Cu6Sn5 nanoparticles on the growth of intermetallic compounds at the interfaces of Sn3.0Ag0.5Cu solder joints

Interfacial Reactions in Sn-0.7wt.%Cu/Ni-V Couples at 250°C

Initial formation of CuSn intermetallic compounds between molten SnAgCu solder and Cu substrate

Interfacial Reactions In Sn-0.7wt.%Cu/Ni-V Couples At 250 Degrees C

A Cu Pillar Bump Bonding Method Using Au-Sn Alloy Cap as the Interconnection Layer

Evolution of CuSn Intermetallics Between Molten SnAgCu Solder and Cu Substrate

Low-Temperature Ultrasonic Bonding of Cu/Sn Microbumps with Au Layer for High Density Interconnection Applications

Interfacial Reactions of Sn-8wt.%Zn-3wt.%Bi Solder with Cu, Ag, and Ni Substrates

Interfacial reaction between Sn-Ag solder and electroless Ni-Fe-P diffusion barriers with different internal microstructure

Interfacial Reactions in the Sn-Ag/Au Couples

Influence of Al2O3 Nanoparticles on the Morphology and Growth Kinetics of Cu-Sn Intermetallic Compounds in Sn-Ag-Zn/Cu Solder Joints