Reaction of solder with Ni/Au metallization for electronic packages during reflow soldering

C. E. Ho,S. Y. Tsai,C. R. Kao,C.E. Ho,S.Y. Tsai,C.R. Kao

DOI: https://doi.org/10.1109/6040.982835

2001-01-01

IEEE Transactions on Advanced Packaging

Abstract:Gold over Ni is one of the most common surface finishes for Cu soldering pads in ball-grid-array (BGA) and other electronic packages. The Au layer is for oxidation protection, and the Ni layer serves as a solderable diffusion barrier. In this study, eutectic Pb-Sn solder-balls were reflowed on the Au/Ni/Cu pads, and the chemical interactions between the solder and the surface finish were studied. Quenched-in microstructures at different stages of the reflow were carefully examined using the scanning electron microscopy. It was found that the solder melted locally along the solder/pad interface at the very early stages of the reflow before the whole solder ball had reached the Pb–Sn eutectic temperature. This was because a ternary eutectic reaction L = (Pb) + (Sn) + AuSn4 occurred at 177°C, six degrees below the Pb–Sn eutectic temperature. Four distinct stages were identified for the reflow process. The four stages are: 1)partial melting of solder balls and the initial reaction of Au with Sn; 2)complete reaction of Au with Sn; 3)separation of (Au${}_{x}$Ni${}_{1-x}$)Sn${}_{4}$ from the pad; 4)complete melting of solder balls and the reaction of Ni with Sn. After a typical reflow, with a 225°C peak reflow temperature and 115s reflow time, all the Au and Au-bearing intermetallic compounds left the interface and the only intermetallic compound at the interface was Ni3Sn4 with a thickness of about 2$\mu$m. partial melting of solder balls and the initial reaction of Au with Sn; complete reaction of Au with Sn; separation of (Au${}_{x}$Ni${}_{1-x}$)Sn${}_{4}$ from the pad; complete melting of solder balls and the reaction of Ni with Sn.