Interfacial reactions between high-Pb solders and Ag
Chi-Pu Lin,Chih-Ming Chen,Yee-Wen Yen,Hsin-Jay Wu,Sinn-Wen Chen
DOI: https://doi.org/10.1016/j.jallcom.2010.12.135
IF: 6.2
2011-01-01
Journal of Alloys and Compounds
Abstract:Research highlights ▶ Interfacial reactions between molten high-Pb solders and Ag are significantly affected by the Sn concentration of the solders. ▶ The Ag 3 Sn phase is the reaction product at the solder/Ag interface when the solder has a Sn concentration of 10 wt.%, but the Ag 4 Sn phase is formed instead of the Ag 3 Sn phase when the Sn concentration reduces to 5 wt.%. ▶ When the Sn concentration is only 3 wt.%, the Ag 4 Sn phase is formed first but it disappears after long-term reaction and only the (Ag) phase exists at the interface. ▶ Remarkable phase transformation due to the solder concentration change can be explained by the Sn–Pb–Ag isothermal section. Abstract Interfacial reactions between high-Pb solders (Pb–10Sn, Pb–5Sn, and Pb–3Sn, in wt.%) and immersion Ag layer at 350 °C are investigated. Upon decreasing the Sn concentration from 10 wt.% to 5 wt.%, the reaction product formed at the solder/Ag interface changes from the Ag 3 Sn phase to the Ag 4 Sn phase. When the Sn concentration reduces to only 3 wt.%, the reaction product is the Ag 4 Sn phase at the initial stage of reaction but transforms to the (Ag) phase dissolved with Sn at the later stage of reaction. Pb penetrates across the (Ag) phase via grain boundary and forms a continuous Pb-rich layer between the (Ag) phase and the bottom Cu layer. The correlation between the phase transformation and the solder composition is discussed based on the calculated Sn–Pb–Ag isothermal section. Keywords Intermetallics Metals and alloys Liquid–solid reactions Diffusion Microstructure 1 Introduction Development of lead (Pb)-free solders is an urgent issue in the electronic packaging industries due to the concerns of Pb toxicity on the environment and human health [1] . Tin–silver–copper (SnAgCu)-based solders are currently the representatives of the Pb-free solders used for consumer electronics [2,3] . However, the SnAgCu-based solders are not qualified for some specific applications, like high-end microprocessors, because the melting point (∼217 °C) is not high enough that can withstand high-temperature operation environment and multiple reflow conditions. High-Pb solders with a Pb content higher than 90 wt.% possess higher melting point (∼300 °C) and have been used as the high temperature solders for a long period of time [4,5] . Although efforts have been made to develop high-temperature Pb-free solders like gold–tin, tin–zinc, and bismuth–silver alloys, none of them is fully comparable to the high-Pb solders [6–10] . Therefore, the development of high-temperature Pb-free solders remains a challenge and an incomplete task. At present, the high-Pb solders are still the most reliable high-temperature solders for practical applications. To fabricate the solder joints, the high-Pb solders are joined with the metallization layers by means of a reflow process. During reflow, the high-Pb solders melt and wet the metallization layers. Interfacial reactions usually take place and then the joining completes. Understanding the interfacial reactions between solders and metallization layers is helpful to gain reliable solder joints. Copper (Cu) and nickel (Ni) are two common metallization layers and their interfacial reactions with high-Pb solders have been investigated [11–15] . Different from those in the cases of eutectic SnPb and Pb-free solders, only one intermetallic compound, Cu 3 Sn, was formed in the interfacial reaction between 95Pb5Sn (in wt.%) solder and Cu-based metallization layers [16–18] . The Cu 3 Sn compound even spalled off the underlying Cu metallization after long-term solid-state annealing [11] . These unusual phenomena were attributed to the insufficient supply of Sn in the high-Pb solders for the interfacial reaction. For another Ni metallization, when the 99Pb1Sn solder was reflowed on an electroless Ni(P) layer, the Ni 3 Sn 2 phase was formed first at the solder/Ni(P) interface, followed by the formation of the Ni 3 Sn phase at the Ni 3 Sn 2 /Ni(P) interface [16,19] . As the Sn content in solder increased to 5 wt.% (95Pb5Sn), the Ni 3 Sn 2 phase was formed first as well, but the Ni 3 Sn 4 phase instead of the Ni 3 Sn phase was the intermetallic compound next formed [20] . Spalling of the Ni 3 Sn 4 compound off the underlying Ni metallization was also observed after long-term reflow [12,15] . Ag is also a common metallization used for electronic packaging, such as the immersion Ag used for the surface finish layer [21–23] . However, to the best of our knowledge, the interfacial reactions between the high-Pb solders and Ag are not yet reported in the literatures. This present study investigates the interfacial reactions of three high-Pb solders (90Pb10Sn, 95Pb5Sn,and 97Pb3Sn, all in wt.%) and Ag reflowed at 350 °C. In general, typical reflow soldering takes only a few minutes. In this present study, we performed the reflow experiments from 5 min to 180 min to gain a better understanding of the interfacial reaction of the high-Pb solder with Ag. Formation of intermetallic compounds and morphological evolution at the solder/Ag interface were examined. 2 Experimental A Ta/Cu bilayer was deposited on an oxidized Si substrate using electron beam evaporation, where the thicknesses of Ta and Cu were 200 Å and 4000 Å, respectively. The Ta/Cu bilayer was then patterned to a square pad with a dimension of 600 μm × 600 μm using photolithography technique. Using the electroplating technique, the Cu layer was grown to 10 μm thick. An immersion Ag layer of 10 μm thickness was deposited on the Cu layer by immersing the Si substrate in a commercial plating solution at 58 °C. Solder alloys of three different compositions, 97Pb3Sn, 95Pb5Sn, and 90Pb10Sn, were prepared. Proper amounts of Sn and Pb shots, both 99.99% purity, were weighted and sealed in a vacuum (2.3 × 10 −2 Torr) quartz tube. The quartz tube was then put into a furnace at 500 °C to make the Sn and Pb shots melt and mix together. After 72 h, the quartz tube was removed from the furnace and quenched in ice water. A small piece of solder (∼0.16 mg) was cut from the solidified ingot. The solder piece was cleaned and then placed on the flux-coated (rosin mildly activated (RMA) flux) Ag immersion layer. The reflow reaction was conducted by placing the sample on a 350 °C hot plate for 5–180 min. After the predetermined reflow durations, the samples were removed from the hot plate and treated by metallographic examinations. The samples were mounted in epoxy resin, followed by grinding and polishing with sandpapers and fine Al 2 O 3 powders in the direction perpendicular to the solder/Ag interface. For clear observation, some samples were dipped into an etching solution of 95 vol.% CH 3 OH and 5 vol.% HCl for a few seconds to remove the solder portion. A scanning electron microscope (SEM) was used to observe the microstructure of the solder/Ag interface. The composition analysis was carried out using a field-emission electron probe microanalyzer (FE-EPMA). 3 Results and discussion 3.1 Interfacial reaction between 90Pb10Sn solder and Ag Fig. 1 (a) and (b) shows the cross-sectional microstructures in backscattered electron mode of the 90Pb10Sn/Ag interface reacted at 350 °C for 5 and 180 min, respectively. The only intermetallic compound formed at the interface after reaction for 5 min was scallop-shaped and was identified as the Ag 3 Sn phase according to the EPMA analysis (24.14 at.% Sn–75.86 at.% Ag). When the reaction was extended to 180 min, coarsening of the Ag 3 Sn phase was found as seen in Fig. 1 (b). In order to observe the morphological change of the Ag 3 Sn phase during reaction, the solder portion was totally removed by etching to expose the surface of the Ag 3 Sn phase, as seen in Fig. 2 (a) and (b). The Ag 3 Sn grains attached to each other very densely, and they coarsened with increasing the reaction time, resulting in an increase in the grain size but a decrease in the grain number. From a thermodynamic viewpoint, the occurrence of phase coarsening is to reduce the total amount of the interfacial areas, so that the total interfacial energy can be minimized. 3.2 Interfacial reaction between 95Pb5Sn solder and Ag Fig. 3 (a)–(d) shows the cross-sectional microstructures in backscattered electron mode of the 95Pb5Sn/Ag interface reacted at 350 °C for 5–120 min. There was only intermetallic compound formed at the interface. EPMA analysis revealed its composition was 19.53 at.% Sn–80.47 at.% Ag, which was identified as the Ag 4 Sn phase. Similar to the above-mentioned Ag 3 Sn phase at the 90Pb10Sn/Ag interface, coarsening of the Ag 4 Sn phase was also observed with increasing the reaction time. When the reaction was prolonged to 60 min, the solder/Ag 4 Sn interface became very irregular and the Ag/Cu interface appeared to be filled by other substance. According to the EPMA analysis, this gray substance was the Pb-rich phase dissolved with small amounts of Sn and Ag. Due to the Pb-rich phase penetration, the Ag and Cu layers partially dissolved. Extending the reaction to 120 min, the Ag layer was completely consumed to form the Ag 4 Sn phase with a composition of 13.5 at.% Sn–86.5 at.% Ag. More Pb-rich phase penetrated into the Ag 4 Sn/Cu interface. 3.3 Interfacial reaction between 97Pb3Sn solder and Ag Fig. 4 (a)–(d) shows the cross-sectional microstructures in backscattered electron mode of the 97Pb3Sn/Ag interface reacted at 350 °C for 5–180 min. Similar to the 95Pb5Sn/Ag interfacial reaction, the Ag 4 Sn phase was the only intermetallic compound formed at the 97Pb3Sn/Ag interface after reaction for only 5 min, as seen in Fig. 4 (a). When the reaction time reached 60 min, it was surprising that the Ag 4 Sn phase disappeared but only the (Ag) phase (94.7 at.% Ag–5.3 at.% Sn) existed at the interface, as seen in Fig. 4 (b). The identification of the (Ag) phase is based on its composition and the binary Sn–Ag phase diagram [24] . According to the phase diagram, the (Ag) phase (solid solution) can dissolve with Sn up to 10 at.% at 350 °C. Therefore, the detected composition is referred to the (Ag) phase. It seemed that the Ag 4 Sn phase underwent a phase transformation and transformed to the (Ag) phase. The Pb-rich phase penetration into the (Ag)/Cu interface was also observed. Owing to etching, a grain boundary across the entire (Ag) layer was clearly seen, and was very likely to be the channel for the Pb penetration. The Pb-rich phase penetration became more pronounced after reaction for 120 and 180 min, as seen in Fig. 4 (c) and (d), resulting in the spalling of the (Ag) layer off the Cu substrate. A low magnification micrograph inserted in Fig. 4 (c) showed that the spalling of the (Ag) layer off the Cu substrate took place across the entire interface. Fig. 5 (a) and (b) shows the top-view microstructures of the interfaces with the solder portion totally removed. It was found that the Ag 4 Sn grains attached to each other very closely after reaction for 5 min. However, after reaction for 180 min, the attachment among the (Ag) grains was not as close as that among the Ag 4 Sn grains. Therefore, many channels were formed among the (Ag) grains for the Pb penetration from the solder side to the Ag/Cu interface. In order to make sure only the (Ag) phase existed at the interface after long-term reaction and no any other intermetallic compound coexisted with it, the EPMA element mapping of the (Ag) phase was conducted and the result was shown in Fig. 6 . It was clear that the Ag and Sn distribution in the (Ag) phase were very uniform, confirming it was indeed the (Ag) phase dissolved with Sn. Additionally, no other intermetallic compound was observed, indicating that the initially formed Ag 4 Sn phase had transformed to the (Ag) phase. From the element mapping of Pb, the Pb penetration through the grain boundary was clearly observed. 3.4 Phase transformation at the interface due to the change of solder composition Based on the above results, the solder concentration plays an important role in the type of the reaction product formed in the molten high-Pb solder/Ag interfacial reaction. When the Sn concentration is 10 wt.%, only the Ag 3 Sn phase was formed at the interface (see Fig. 1 ). When the Sn concentration decreases to 5 wt.%, the intermetallic compound formed at the interface transformed into the Ag 4 Sn phase (see Fig. 3 ). With only 3 wt.% Sn concentration, the Ag 4 Sn phase was formed first at the interface but eventually transformed into the (Ag) phase after longer reaction (see Fig. 4 ). To rationalize the phase transformation due to the solder concentration change, the equilibrium phase diagram is a useful tool. However, the Sn–Pb–Ag isothermal section obtained experimentally at 350 °C is not available in the literatures. So, a Sn–Pb–Ag isothermal section at 350 °C, as shown in Fig. 7 , calculated by a commercial software Pandat [25–28] is employed. The point “A” (in at.%) shows the composition of the 90Pb10Sn (in wt.%) solder. Linking point “A” to the Ag phase is the mass balance line. Because the Ag 3 Sn phase is formed at the 90Pb10Sn/Ag interface as mentioned above, the diffusion path can be drawn as the line “X” and is 90Pb10Sn/Ag 3 Sn/Ag. It shows that a tie-line is built up between the molten solder (dissolved with about 5 at.% Ag, as marked by the point “M”) and the Ag 3 Sn phase, which also confirms that the Ag 3 Sn phase is an equilibrium reaction product at the interface. When the solder concentration decreases to 95Pb5Sn, as marked by the point “B”, a possible diffusion path is drawn as the line “Y”. At this moment, the solder concentration adjacent to the interface shifts from “M” to “N”, and is in equilibrium with the Ag 4 Sn phase by a tie line. Therefore, the Ag 4 Sn phase is the equilibrium reaction product at the interface, which is in good agreement with the experimental results. The point “C” indicates the composition of 97Pb3Sn, and its corresponding diffusion path is drawn as the line “Z”. The Ag 4 Sn phase is thus also the equilibrium reaction product at the interface, which is in good agreement with the experimental result of early stage of reaction, as seen in Fig. 4 (a). However, very interestingly, the Ag 4 Sn phase disappeared after longer reaction time but the (Ag) phase appeared at the interface instead, as seen in Fig. 4 (b)–(d). This remarkable phase transformation is attributed to the change of the solder composition due to interfacial reaction. Strictly speaking, it is a combined effect of the solder composition and solder amount. Because the 97Pb3Sn solder contains less Sn and the solder amount (∼0.16 mg) is limited, the Sn content of solder decreases at a faster rate due to the formation of the Ag 4 Sn phase at the interface. Based on the EPMA analysis, the solder composition very close to the solder/Ag 4 Sn interface was 0.15 at.% Sn–6.65 at.% Ag–93.2 at.% Pb with nearly negligible Sn concentration after 90 min of reaction. The consumption of Sn in the solder makes the diffusion path to shift to the line “W”, where the solder is in equilibrium with only the (Ag) phase. Therefore, the initially formed Ag 4 Sn phase transformed into the (Ag) phase as experimentally observed. 4 Conclusions The interfacial reactions between molten high-Pb solders and Ag at 350 °C are significantly affected by the solder composition. The Ag 3 Sn phase is formed at the molten solder/Ag interface when the Sn concentration of the solder is 10 wt.%. When the Sn concentration of the solder decreases to 5 wt.%, the reaction product becomes the Ag 4 Sn phase. When the Sn concentration of the solder is only 3 wt.%, the Ag 4 Sn phase is also formed first, but it disappears and the entire Ag layer converts to the (Ag) phase dissolved with Sn with increasing the reaction time. The Pb penetration through the grain boundary of the (Ag) phase occurs and the (Ag)/Cu interface is replaced by the (Ag)/Pb-rich/Cu interface. Due to the Pb penetration, the (Ag) layer spalls off the Cu substrate. The phase transformation due to the change of the solder composition is well explained by the calculated Sn–Pb–Ag isothermal section. Acknowledgements The authors gratefully acknowledge the financial support of the National Science Council of Taiwan under grants NSC 96-2221-E-005-064-MY3 and NSC 99-2628-E-005-006. This work is supported in part by the Ministry of Education, Taiwan, ROC under the ATU plan. References [1] M. Abtew G. Selvaduray Mater. Sci. 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Liquid-state interfacial reaction of Sn-10Sb-5Cu high temperature lead-free solder and Cu substrate
Qiulian Zeng,Jianjun Guo,Xiaolong Gu,Xinbing Zhao
DOI: https://doi.org/10.1109/ICEPT.2008.4607093
2008-01-01
Abstract:Sn-Sb alloys are potential solders for replacement of high-Pb solders because of their high melting temperature in lead-free solders. However, Cu substrate is extremely dissolved by the Sn-Sb binary alloy during the high temperature soldering process, which will cause serious reliability problem of the solder joint. Based on this critical issue, we designed a new high temperature lead-free Sn-10Sn-5Cu ternary solder to prevent the dissolution of Cu substrate. In this study, liquid-state interfacial reaction between the high temperature lead-free solder and the Cu substrate was investigated. The liquid-state interfacial reaction of the solder on the Cu substrate was carried out at the different temperature of 280degC, 320degC,360degC and 400degC, and the reaction time was 1min, 10mins, 30mins and 60mins, respectively. Microstructure of the Sn-Sb-Cu bulk solder and the solder joint was observed by scattered electron microscope (SEM). The identification of phase composition was determined by Energy Dispersive X-ray Detector (EDX) and electron probe microscopy analysis (EPMA). During the four reaction temperatures, the interfacial reaction products included a scallop Cu6Sn5 intermetallic compound (IMC) layer and a flat Cu3Sn layer adjacent to Cu substrate. IMCs thickness with the reaction time was measured by the area of interface IMCs layer divided by the interface length. The IMCs thickness increased with the reaction temperature and reaction time, and the relationship between IMC thickness and reaction time was linear with square root of time, which signified that the IMC growth dynamics was diffusion controlled. The diffusion coefficient was calculated by the IMC growth rate, which increased with the higher temperature, corresponding to be 2.30 times 10-14, 6.84 times 10-14, 1.63 times 10-13, 1.99 times 10-13 m2/s for the temperatures of 280degC, 320degC, 360degC and 400degC, res- - pectively. And then the diffusion activation energy was determined to be 57.8 KJ/mol by fitting the four diffusion coefficients at various temperatures, which indicated that the diffusion mechanism was grain boundary diffusion. Between lower temperature of 280degC and higher temperature of 400degC, huge differences existed on the microstructure of IMC in the interior solder of the solder joint.
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Interfacial Reactions in Sn–20In–2.8Ag/Cu Couples
Shih-kang Lin,Che-wei Hsu,Sinn-wen Chen,Chia-ming Hsu
DOI: https://doi.org/10.1016/j.matchemphys.2013.07.014
IF: 4.778
2013-01-01
Materials Chemistry and Physics
Abstract:Interfacial reactions between Sn-20 wt.%In-2.8 wt.%Ag (Sn-20In-2.8Ag) Pb-free solder and Cu substrate at 250, 150, and 100 C were investigated. A scallop-type eta-Cu6Sn5 phase layer and a planar epsilon-Cu3Sn phase layer formed at the interface at 250 degrees C. The indium content in the molten solder near the interface was increased with the formation of the eta-Cu6Sn5 phase; and the eta-Cu6Sn5, Ag2In, Cu2In3Sn, and gamma-InSn4 phases formed from the solidification of the remaining solder. At 100 and 150 degrees C, only the eta-Cu6Sn5 phase was found at the interface. However, unusual liquid/solid reaction-like interfacial morphologies, such as irregular elongated intermetallic layers and isolated intermetallic grains, were observed in the solid-state reactions. These eta phase layers had less Sn content than the Sn-20In-2.8Ag alloy, resulting in an excess Sn-rich gamma-InSn4 phase accumulating at the interface and forming porous eta layers on top of the initially formed dense eta layers at 150 degrees C. At 100 degrees C, large elongated eta grains were formed, whereas the interfacial layers remained almost unchanged after prolonged reaction. Based on the experimental evidence, the growth of the eta phase was proposed to follow a diffusion-controlled mechanism at 250, 150 and 100 degrees C, while that of the epsilon phase was probably controlled by the reaction. (C) 2013 Elsevier B.V. All rights reserved.
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Interfacial Reactions in the Pb-Free Composite Solders with Indium Layers
Sinn-Wen Chen,Shih-Kang Lin,Ching-Feng Yang
DOI: https://doi.org/10.1007/s11664-006-0186-x
IF: 2.1
2006-01-01
Journal of Electronic Materials
Abstract:A Pb-free composite solder is prepared with a Pb-free solder substrate and a plated-indium layer. The indium layer melts during the soldering process, wets the substrates, and forms a sound solder joint. Since the melting temperature of indium is 156.6°C, lower than that of the eutectic Sn-Pb, which is at 183°C, the soldering process can be carried out at a temperature lower than that of the conventional soldering process. Composite solder joints with three different Pb-free solders, Sn, Sn-3.5 wt.% Ag, and Sn-3.5 wt.% Ag-0.5 wt.% Cu, and two substrates, Ni and Cu, are prepared. The interfaces between the indium layer, Pb-free solder, and Ni and Cu substrate are examined. A good solder joint is formed after a 2-min reflow at 170°C. A very thick reaction zone at the indium/Pb-free solder interface and a thin reaction layer at the indium/substrate interface are observed.
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Effects of High-Temperature Treatment on the Reaction Between Sn-3%Ag-0.5%Cu Solder and Sputtered Ni-V Film on Ferrite Substrate
Xiaohu Shen,Hao Jin,Shurong Dong,Hei Wong,Jian Zhou,Zhaodi Guo,Demiao Wang
DOI: https://doi.org/10.1007/s11664-012-2238-8
IF: 2.1
2012-01-01
Journal of Electronic Materials
Abstract:We have demonstrated a novel sputtering method for lead-free thin metal films on ferrite substrates for surface-mount inductor applications. In a surface-mounting process, the cladding of enameled wire needs to be burnt off at high temperature, which requires the devices to withstand a high-temperature reliability test at 420°C for 10 s. There are no reports that a sputtered film of thickness less than 6 μm can withstand this test. In this work, we used Ag/Ni-7 wt.%V double metal layers for the metallization. The dissolution of Ni-7 wt.%V in Sn-3%Ag-0.5%Cu lead-free solder at various temperatures was studied in detail. Scanning electron microscopy with energy-dispersive x-ray spectroscopy was used to investigate the interfacial reaction between the sputtered films and the solder. The intermetallic compounds are mainly (Cu,Ni)6Sn5 at 250°C; however, (Ni,Cu)3Sn4 becomes the predominant composition at 420°C. In addition, although outdiffusion of V atoms from the Ni-V layer was observed, its effect on the intermetallic compound (IMC) was insignificant. We further confirmed that the proposed metallization is able to pass the aforementioned high-temperature reliability test.
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Sn–0.7wt.%Cu/Ni Interfacial Reactions at 250°C
CH Wang,SW Chen
DOI: https://doi.org/10.1016/j.actamat.2005.09.006
IF: 9.4
2005-01-01
Acta Materialia
Abstract:Sn–0.7wt.%Cu alloy is a promising Pb-free solder, and Ni is a commonly used barrier layer material. Sn–0.7wt.%Cu/Ni couples are prepared and reacted at 250°C. The interfacial reactions are examined, reaction mechanisms are proposed, and solder size effects upon the interfacial reactions are investigated. The Cu6Sn5 phase forms and grows with longer reaction time in the initial stage. Then the Cu6Sn5 phase layer fractures and part of the layer detaches. Microstructural analysis indicates that the detached and the attached layers have finer and larger grains, respectively, and the Cu6Sn5 phase has a near hexagonal prism shape. The freshly exposed Cu6Sn5 phase layer continues to grow and then the reaction layer thickness reaches a plateau. The Ni3Sn4 phase forms and the Cu6Sn5 phase layer disintegrates in the later stage of the reactions. The transition timing of the different stages is affected by the amounts of solder used.
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Kinetics of interfacial reaction between Sn-3.0Ag-0.5Cu solder and Co-4.0P or Co-8.0P metallization
donghua yang,guoshuai yang,jian cai,qian wang,jingwei li,yang hu,liangliang li
DOI: https://doi.org/10.1109/ICEPT.2015.7236622
2015-01-01
Abstract:Co-4.0 at.% P and Co-8.0 at.% P metallization layers with a thickness of 3.5 µm were electroplated on printed circuit boards as surface finishes. Ball grid array Sn-3.0Ag-0.5Cu (SAC305) solder balls were connected with Co-P metallization by reflow, and solid-state interfacial reaction in the solder joints aged at 110 and 150°C up to 1000 h was systematically investigated. CoSn3 and (Cu,Co)
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Sn
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interfacial intermetallic compounds (IMCs) were observed at the interface of SAC/Co-4.0P joints, while Co-Sn-P IMC was found at the interface of SAC/Co-8.0P joints. The growth of three IMCs was all governed by diffusion-controlled mechanism according to the analysis on kinetics. The growth coefficients K of the combination of CoSn
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and (Cu,Co)
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Sn
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were 1.23×10
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and 24.03×10
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m
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/s at 110 and 150°C, respectively, while the K values of Co-Sn-P IMC were 0.75×10
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and 2.42×10
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m
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/s at 110 and 150°C, respectively. For comparison, SAC/Cu joints were prepared and analyzed, and the K values of the combination of Cu
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Sn
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and Cu
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Sn interfacial IMCs were 19.88×10
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and 76.18×10
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m
<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup>
/s at 110 and 150°C, respectively. Therefore, the Co-Sn-P IMC in SAC/Co-8.0P joints had the smallest growth rate. The activation energy E
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for CoSn
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plus (Cu,Co)
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Sn
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and Co-Sn-P was calculated to be 100.2 and 39.5 kJ/mol, respectively. In addition, the shear strength of SAC/Co-P and SAC/Cu joints was measured. SAC/Co-8.0P joints had the largest shear strength after being annealed at 150°C, which was about 20% larger than that of SAC/Cu joints. In summary, electroplated Co-P film with an optimal composition is a promising candidate for metallization used in lead-free soldering.
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Interfacial Reactions of Sn-8wt.%Zn-3wt.%Bi Solder with Cu, Ag, and Ni Substrates
Ching-Feng Yang,Sinn-Wen Chen,Kuan-Hsien Wu,Tsung-Shune Chin
DOI: https://doi.org/10.1007/s11664-007-0255-9
IF: 2.1
2007-01-01
Journal of Electronic Materials
Abstract:Sn-Zn-Bi alloys are promising Pb-free solders. Interfacial reactions between the Sn-8wt.%Zn-3wt.%Bi (Sn-13.80at.%Zn-1.62at.%Bi) alloy and the Cu, Ag, and Ni substrates are examined. Two different kinds of substrates, the bulk plate and the electroplating layer, are used, and the reactions are carried out at 250°C and 220°C. Although the Zn content is only 13.8 at.%, two Zn-Cu compounds, γ-Cu5Zn8 and ε-CuZn5 phases, are formed in the Sn-13.80at.%Zn-1.62at.%Bi/Cu couples. The ε-CuZn5 phase is scallop shaped, and the γ-Cu5Zn8 phase is planar. In the Sn-13.80at.%Zn-1.62at.%Bi/Ag couples, three Zn-Ag compounds are observed, and they are ε-AgZn3, γ-Ag5Zn8, and ζ-AgZn phases. In the Sn-13.80at.%Zn-1.62at.%Bi/Ni couples, a Zn-Ni compound, γ-Ni5Zn21 phase, is formed. Similar results are found in the couples prepared with an electroplating layer: the reaction phases are the same, but the growth rates are different.
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Interfacial reaction between Sn-Ag-Cu solder and Co-P films with various microstructures
Nianduan Lu,Donghua Yang,Liangliang Li
DOI: https://doi.org/10.1016/j.actamat.2013.04.027
IF: 9.4
2013-01-01
Acta Materialia
Abstract:We electroplated Co–P films with nanocrystalline, amorphous and nanocrystalline/amorphous mixed structures and used them as under-bump metallization (UBM) joined with Sn–Ag–Cu lead-free solder. We systematically investigated the interfacial reaction between the Sn–Ag–Cu solder and the Co–P UBM and analyzed the growth mechanisms of the intermetallic compounds formed at the interfaces of the Sn–Ag–Cu/Co–P joints through multiple reflows. Among the three kinds of Co–P films, the film with a mixed structure shows the best diffusion-barrier properties and is a good candidate for the UBM joined with the Sn–Ag–Cu solder. For the nanocrystalline Co–P UBM, Co diffuses quickly toward the solder and Sn does not diffuse into the UBM, whereas for the amorphous Co–P film not only does Co diffuse into the solder, but also Sn diffuses into the Co–P film with a large diffusion rate. In addition, the first-principles calculation shows that the exchange coupling between Co(3d74s2) and Sn(5s25p2) electrons and between Sn(5s25p2) and P(3s23p3) electrons results in the formation of CoSn and SnP3, which originate from the diffusion and reaction of Co and Sn atoms, respectively; this is consistent with the experimental data of transmission electron microscopy characterization.
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Dissolution and Interfacial Reactions of Fe in Molten Sn-Cu and Sn-Pb Solders
Huang Yu-chih,Chen Sinn-wen,Gierlotka Wojcieh,Chang Chia-hua,Wu Jen-chin
DOI: https://doi.org/10.1557/jmr.2007.0361
2007-01-01
Abstract:Solder pots used in wave soldering are usually made using different kinds of steel. Dissolution and interfacial reactions of the Fe substrate in molten Sn-Pb and Sn-Cu solders are investigated in this study. FeSn2 phase is formed in the Sn-0.7wt%Cu/Fe couples reacted at 250, 400, and 500 °C, as well as in the Sn-37wt%Pb/Fe couples reacted at 250 and 400 °C. The activation energies of formation are 123 and 121 kJ/mol in the Sn-Cu/Fe and Sn-Pb/Fe couples, respectively. FeSn phase is the reaction product in the Sn-37wt%Pb/Fe couples reacted 500 °C. The dissolution rates of Fe in the Sn-0.7wt%Cu melt are much higher than those in-the Sn-37wt%Pb melt. The FeSn2 phase layer in the Sn-Cu/Fe couple is not as dense as that in the Sn-Pb/Fe couple and accounts for the very different dissolution rates. Detachment of the reaction FeSn2 phase into the solder matrix is observed in the Sn-Cu/Fe couples, and is a potential contaminant source in wave soldering.
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Influence of Ag content on the formation and growth of intermetallic compounds in Sn–Ag–Cu solder
Bai Hailong,Long Zan,Chen Junyu,Gu Xing,Lv Jinmei,Zhao Lingyan,Chen Dongdong,Yan Jikang
DOI: https://doi.org/10.1007/s10854-020-03556-8
2020-05-13
Abstract:The interfacial reactions and growth kinetics of Sn–Ag–Cu were investigated during solid-state aging. The effects of chemical composition on the interface structure and the growth of interface under high temperature and high humidity were experimentally and numerically studied. Three solders Sn–0.4Ag–0.7Cu, Sn–0.7Ag–0.7Cu, and Sn–1.0Ag–0.7Cu were used to conduct several experiments. In order to determine the long-term reliability of the solder joints, thermally accelerated aging tests were performed for 0, 10, 30, 50, 100, and 350 h at 85 °C and 85% relative humidity. The surface morphology, thickness, and distribution of compounds were observed by scanning electron microscopy. The results showed that with increasing Ag content, the growth of Cu<sub>6</sub>Sn<sub>5</sub> layer suppressed. The growth kinetics of intermetallic compound (IMC, Cu<sub>6</sub>Sn<sub>5</sub> + Cu<sub>3</sub>Sn) remained a diffusion-controlled process during the isothermal aging, and Cu<sub>6</sub>Sn<sub>5</sub> gradually transformed into a Cu<sub>3</sub>Sn IMC. The scallop-like shape disappeared at later aging stages, suggesting a change in the growth mechanism to the steady growth in the perpendicular direction to the interface. In addition, the results revealed that Ag effectively slowed the growth kinetics of Cu<sub>6</sub>Sn<sub>5</sub>. The apparent activation energy <i>Q</i> for Cu<sub>6</sub>Sn<sub>5</sub> + Cu<sub>3</sub>Sn IMC of interfaces at Sn–0.4Ag–0.7Cu/Cu, Sn–0.7Ag–0.7Cu/Cu, and Sn–1.0Ag–0.7Cu/Cu was calculated to be 69.11, 88.90, and 56.61 kJ/mol, respectively.
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Reaction of solder with Ni/Au metallization for electronic packages during reflow soldering
C. E. Ho,S. Y. Tsai,C. R. Kao,C.E. Ho,S.Y. Tsai,C.R. Kao
DOI: https://doi.org/10.1109/6040.982835
2001-01-01
IEEE Transactions on Advanced Packaging
Abstract:Gold over Ni is one of the most common surface finishes for Cu soldering pads in ball-grid-array (BGA) and other electronic packages. The Au layer is for oxidation protection, and the Ni layer serves as a solderable diffusion barrier. In this study, eutectic Pb-Sn solder-balls were reflowed on the Au/Ni/Cu pads, and the chemical interactions between the solder and the surface finish were studied. Quenched-in microstructures at different stages of the reflow were carefully examined using the scanning electron microscopy. It was found that the solder melted locally along the solder/pad interface at the very early stages of the reflow before the whole solder ball had reached the Pb–Sn eutectic temperature. This was because a ternary eutectic reaction L = (Pb) + (Sn) + AuSn4 occurred at 177°C, six degrees below the Pb–Sn eutectic temperature. Four distinct stages were identified for the reflow process. The four stages are: 1)partial melting of solder balls and the initial reaction of Au with Sn; 2)complete reaction of Au with Sn; 3)separation of (Au${}_{x}$Ni${}_{1-x}$)Sn${}_{4}$ from the pad; 4)complete melting of solder balls and the reaction of Ni with Sn. After a typical reflow, with a 225°C peak reflow temperature and 115s reflow time, all the Au and Au-bearing intermetallic compounds left the interface and the only intermetallic compound at the interface was Ni3Sn4 with a thickness of about 2$\mu$m. partial melting of solder balls and the initial reaction of Au with Sn; complete reaction of Au with Sn; separation of (Au${}_{x}$Ni${}_{1-x}$)Sn${}_{4}$ from the pad; complete melting of solder balls and the reaction of Ni with Sn.
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Interfacial reactions with and without current stressing at Sn–Co/Ag and Sn–Co/Cu solder joints
Chia-ming Hsu,Sinn-wen Chen
DOI: https://doi.org/10.1007/s10853-013-7464-9
IF: 4.5
2013-01-01
Journal of Materials Science
Abstract:Sn–Co alloys are promising Pb-free solders, while plating layers and substrates of Ag and Cu are commonly encountered in electronic products. This study examines the interfacial reactions between Sn–0.25 wt% Co/Ag and Sn–0.25 wt% Co/Cu at 180 and 210 °C, with and without current stressing. CoSn 3 precipitates are found in the solder matrix in the as-prepared condition. In Sn–0.25 wt% Co/Ag couples, a continuous Ag 3 Sn reaction phase layer is observed at the interface and Ag 3 Sn phase particles are dispersed in the matrix, with and without current stressing. When there is a 500 A/cm 2 electrical current, the growth rate of the Ag 3 Sn phase is not affected at either the cathode side or the anode side. However, the passage of an electrical current leads to the formation of needle-like Ag 3 Sn phase particles in the solder matrix. In Sn–0.25 wt% Co/Cu couples, both Cu 6 Sn 5 and Cu 3 Sn reaction phases are formed at the interface, with and without current stressing. Cu 6 Sn 5 precipitates, with a higher Co content, are found in the matrix, mostly nucleated on CoSn 3 precipitates. When there is a 500 A/cm 2 electrical current stressing, all the reaction phase layers are thicker and the anode interfaces are nonplanar. It is observed that there is cracking and that there are discontinuous Cu 6 Sn 5 layers at the interface and that a significant amount of Cu 6 Sn 5 phase in the matrix accompanies 500 A/cm 2 electrical current stressing.
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Wetting Behaviors and Interfacial Reaction Between Sn-10Sb-5Cu High Temperature Lead-free Solder and Cu Substrate
Qiulian Zeng,Jianjun Guo,Xiaolong Gu,Xinbing Zhao,Xiaogang Liu
DOI: https://doi.org/10.1016/s1005-0302(10)60026-6
2010-01-01
Abstract:Sn-10Sb-5Cu lead-free solder was fabricated for high temperature application in electronic package. Wetting behaviors and interfacial reaction between such a high temperature lead-free solder and Cu substrate were investigated and compared with those of 95Pb-Sn solder. The results showed that the wetting properties of Sn-10Sb-5Cu solder are superior to those of 95Pb-Sn solder in maximum wetting force, wetting time and wetting angle in the temperature range of 340-400 degrees C. However, the surface of the Sn-10Sb-5Cu solder sample after wetting balance tests was rougher than that of 95Pb-Sn solder at the temperature lower than 360 degrees C. In static liquid-state interfacial reaction, the types and thickness of the intermetallic compounds (IMCs) of both solders were different from each other. The wetting kinetics in the Sn-10Sb-5Cu/Cu system was more rapid than that in 95Pb-Sn/Cu system, and the higher formation rate of IMCs in the former system was considered as the reason.
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Microstructure and kinetic analysis of the properties and behavior of nickel (Ni) nano-particle doped tin–zinc–bismuth (Sn–8Zn–3Bi) solders on immersion silver (Ag)-plated copper (Cu) substrates
Tama Fouzder,Qingqian Li,Y. C. Chan,Daniel K. Chan
DOI: https://doi.org/10.1007/s10854-014-1906-2
2014-04-06
Abstract:AbstractIn order to identify the effect on the properties and behavior of tin–zinc–bismuth (Sn-8 wt% Zn-3 wt% Bi or Sn-13.6 at.% Zn-1.6 at.% Bi) based solders produced by adding nickel (Ni) nano-particles, the interfacial microstructure between plain and composite solders with newly developed immersion silver (Ag) plated copper (Cu) substrates has been investigated as a function of reaction time, at various temperatures. For plain Sn–8Zn–3Bi solder joints, a scallop-shaped Cu–Zn–Ag intermetallic compound layer was found to adhere to the surface of the immersion Ag-plated Cu substrate. However, after addition of Ni nano-particles into the Sn–8Zn–3Bi solder, Cu–Zn–Ag (at the bottom) and (Cu, Ni)–Zn (at the top) intermetallic compound layers were observed at the interfaces. In addition, these intermetallic compound layer thicknesses increased substantially with increases in the temperature and reaction time. In the solder ball region, needle-shaped α-Zn rich phase and spherically-shaped Bi-particles appeared to be homogeneously distributed throughout a beta-tin (β-Sn) matrix. However, after the addition of Ni nano-particles, needle-shaped α-Zn rich phase appeared that exhibited a fine microstructure, due to the heterogeneous nucleation of the Ni nano-particles. The calculated activation energy for the Cu–Zn–Ag intermetallic compound layer for the plain Sn–8Zn–3Bi solder/immersion Ag-plated Cu system was 29.95 kJ/mol—while the activation energy for the total [Cu–Zn–Ag + (Cu, Ni)–Zn] intermetallic compound layers formed in the Sn–8Zn–3Bi–0.5Ni (Sn-13.6 at.% Zn-1.6 at.% Bi ~1 at.% Ni) composite solder/immersion Ag-plated Cu system was 27.95 kJ/mol. Addition of Ni nano-particles reduces the activation energy which enhanced the reaction rate as we know that lower the activation energy indicates faster the reaction rate.
engineering, electrical & electronic,materials science, multidisciplinary,physics, condensed matter, applied
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Microstructural Evolution and Phase Transformation on Sn‐Ag Solder Alloys under High‐Temperature Conditions focusing on Ag3Sn phase
Jayesh Shanthi Bhavan,Ashwath Pazhani,Mohamed Amer,Nikunj Patel,TG Unnikrishnan
DOI: https://doi.org/10.1002/adem.202400660
IF: 3.6
2024-05-17
Advanced Engineering Materials
Abstract:This study investigates the microstructural and phase transformations in Sn‐Ag solder alloys under high‐temperature conditions, utilizing X‐Ray Diffraction (XRD), Scanning Electron Microscopy (SEM), and Electron Backscatter Diffraction (EBSD) analyses. The research addresses the shift from lead‐based solders to lead‐free alternatives, particularly the Sn‐3.5Ag variant, to meet environmental directives. Analytical techniques were employed pre‐ and post‐controlled thermal cycling from 30°C to 180°C, aimed at emulating solder reflow processes. The XRD analysis at room temperature demonstrated pronounced crystalline peaks, suggesting a preferred orientation within the crystal structure. Additionally, the stability in peak positions (2θ values) indicated low lattice strain in the material. Upon heating, peak broadening suggested grain growth and the onset of recrystallization. SEM and EDS analyses corroborated these findings, displaying a fine‐grained, well‐distributed microstructure with a homogenous composition of Sn and Ag elements. EBSD provided insights into the orientation and texture of grains, revealing a weak to moderate texture across the phases. Post‐experiment data indicated a dominant presence of larger grains and significant variation in grain size, with an area‐weighted mean grain size of 68.47 microns and a standard deviation of 8.68 microns, this suggests significant grain growth and coarsening of the Ag3Sn intermetallic compounds. These structural evolutions have crucial implications for the mechanical properties and reliability of the solder alloy in electronic assemblies, underscoring the need for further exploration of lead‐free solder materials in the electronics industry. This article is protected by copyright. All rights reserved.
materials science, multidisciplinary
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Interfacial Reactions between Sn-Based Solders and n-Type Bi2(Te,Se)3 Thermoelectric Material
Chao-Hong Wang,Chun-Wei Chiu,Mei-Hau Li
DOI: https://doi.org/10.3390/ma17092158
IF: 3.4
2024-05-05
Materials
Abstract:This study investigated the interfacial reactions between n-type Bi2(Te,Se)3 thermoelectric material, characterized by a highly-oriented (110) plane, and pure Sn and Sn-3.0Ag-0.5Cu (wt.%) solders, respectively. At 250 °C, the liquid-state Sn/Bi2(Te,Se)3 reactions resulted in the formation of both SnTe and BiTe phases, with Bi-rich particles dispersed within the SnTe phase. The growth of the SnTe phase exhibited diffusion-controlled parabolic behavior over time. In contrast, the growth rate was considerably slower compared to that observed with p-type (Bi,Sb)2Te3. Solid-state Sn/Bi2(Te,Se)3 reactions conducted between 160 °C and 200 °C exhibited similar interfacial microstructures. The SnTe phase remained the primary reaction product, embedded with tiny Bi-rich particles, revealing a diffusion-controlled growth. However, the BiTe layer had no significant growth. Further investigation into growth kinetics of intermetallic compounds and microstructural evolution was conducted to elucidate the reaction mechanism. The slower growth rates in Bi2(Te,Se)3, compared to the reactions with (Bi,Sb)2Te3, could be attributed to the strong suppression effect of Se on SnTe growth. Additionally, the interfacial reactions of Bi2(Te,Se)3 with Sn-3.0Ag-0.5Cu were also examined, showing similar growth behavior to those observed with Sn solder. Notably, compared with Ag, Cu tends to diffuse towards the interfacial reaction phases, resulting in a high Cu solubility within the SnTe phase.
materials science, multidisciplinary,metallurgy & metallurgical engineering,physics, applied,chemistry, physical, condensed matter
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Interfacial Reactions in Sn-Pb/Ni-8.0 at.%V Couples
Sinn-wen Chen,Yu-ren Lin,Hsin-jay Wu,Ru-Bo Chang
DOI: https://doi.org/10.1007/s11664-011-1636-7
IF: 2.1
2011-01-01
Journal of Electronic Materials
Abstract:The Ni-8.0 at.%V (Ni-7.0 wt.%V) substrate is an important diffusion barrier layer material in flip-chip technology. This study examines interfacial reactions in couples prepared using Ni-8.0 at.%V substrate and Sn-6.0 at.%Pb, Sn-27.6 at.%Pb, and Sn-83.8 at.%Pb solders, at temperatures between 210°C and 450°C. In the Sn-27.6 at.%Pb/Ni-8.0 at.%V and Sn-83.8 at.%Pb/Ni-8.0 at.%V couples, the reaction products are the Ni 3 Sn 4 phase and a T phase with limited Pb solubility, being similar to those in the Sn/Ni-8.0 at.%V couples. However, the Ni 3 Sn 4 phase is formed at an earlier stage and the T phase is formed later. The phase formation sequences are different from those in Sn/Ni-8.0 at.%V couples. In Sn-6.0 at.%Pb/Ni-8.0 at.%V couples, a “Pb-rich” phase is formed, in addition to the T phase and the Ni 3 Sn 4 phase, and the T phase and Ni 3 Sn 4 phase are formed almost simultaneously. Although Pb does not participate actively in the interfacial reactions, the phase formation sequences are changed when Pb alloys in the solder, due to the reduced Sn flux from the solder into the Ni-8.0 at.%V substrate.
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The impact of intermetallic compound on microstructure, mechanical characteristics, and thermal behavior of the melt-spun Bi-Ag high-temperature lead-free solder
Rizk Mostafa Shalaby,Musaeed Allzeleh
DOI: https://doi.org/10.1108/ssmt-03-2022-0015
2022-06-27
Abstract:Purpose This study aims to study the impact of intermetallic compound on microstructure, mechanical characteristics and thermal behavior of the melt-spun Bi-Ag high-temperature lead-free solder. Design/methodology/approach In this paper, a new group of lead-free high-temperature Pb-free solder bearing alloys with five weight percentages of different silver additions, Bi-Ag x (x = 3.0, 3.5, 4.0, 4.5 and 5.0 Wt.%) have been developed by rapidly solidification processing (RSP) using melt-spun technique as a promising candidate for the replacement of conventional Sn-37Pb common solder. The effect of the addition of a small amount of Ag on the structure, microstructure, thermal and properties of Bi-Ag solder was analyzed by means of X-ray diffractometer, scanning electron microscopy, differential scanning calorimetry and Vickers hardness technique. Applying the RSP commonly results in departures from conventional microstructures, giving an improvement of grain refinement. Furthermore, the grain size of rhombohedral hexagonal phase Bi solid solution and cubic IMC Bi 0.97 Ag 0.03 phase is refined by Ag addition. Microstructure analysis of the as soldered revealed that relatively uniform distribution, equiaxed refined grains of secondary IMC Bi 0.97 Ag 0.03 particles about 10 μm for Bi-Ag 4.5 dispersed in a Bi matrix. The addition of trace Ag led to a decrease in the solidus and liquidus temperatures of solder, meanwhile, the mushy zone is about 11.4°C and the melting of Sn-Ag 4.5 solder was found to be 261.42°C which is lower compared with the Sn-Ag 3 solder 263.60°C. This means that the silver additions into Bi enhance the melting point. The results indicate that an obvious change in electrical resistivity (?) at room temperature was noticed by the Ag addition. It was also observed that the Vickers microhardness (H v ) was increased with Ag increasing from 118 to 152 MPa. This study recommended the use of the Bi-Ag lead-free solder alloys for higher temperature applications. Findings Silver content is very important for the soldering process and solder joint reliability. Based on the present investigations described in this study, several conclusions were found regarding an evaluation of microstructural and mechanical deformation behavior of various Bi-Ag solders. The effect of Ag and rapid solidification on the melting characteristics, and microstructure of Bi-Ag alloys were studied. In addition, the mechanical properties of Bi with different low silver were investigated. From the present experimental study, the following conclusions can be drawn. The addition of Ag had a marked effect on the melting temperature of the lead-free solder alloys, it decreases the melting temperature of the alloy from 263.6 to 261.42°C. Bi-Ag solders are comprised of rhombohedral Hex. Bi solid solution and cubic Ag 0.97 Bi 0.03 IMC is formed in the Bi matrix. The alloying of Ag could refine the primary Bi phase and the Bi 0.97 Ag 0.03 IMC. With increasing Ag content, the microstructure of the Bi-Ag gradually changes from large dimples into tiny dimple-like structures. The refinement of IMC grains was restrained after silver particles were added into the matrix. The inhibition effect on the growth of IMC grains was most conspicuous when solder was doped with Ag particles. As a result, the Vickers microhardness of the Bi-Ag lead-free solder alloys was enhanced by more than 100% ranging from 118.34 to 252.95 MPa. Bi-Ag high-temperature lead-free solders are a potential candidate for replacing the tin-lead solder (Sn-37Pb) materials which are toxic to human and the environment and has already been banned. Originality/value This study recommended the use of the Bi-Ag lead-free solder alloys for high-temperature applications.
materials science, multidisciplinary,engineering, electrical & electronic,metallurgy & metallurgical engineering, manufacturing
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Electromigration Effect Upon the Sn–0.7 Wt% Cu/Ni and Sn–3.5 Wt% Ag/Ni Interfacial Reactions
CM Chen,SW Chen
DOI: https://doi.org/10.1063/1.1380219
IF: 2.877
2001-01-01
Journal of Applied Physics
Abstract:This study investigates the effect of electromigration upon the interfacial reactions between the promising lead-free solders, Sn–Cu and Sn–Ag, with Ni substrate. Sandwich-type reaction couples, Sn–0.7 wt% Cu/Ni/Sn–0.7 wt% Cu and Sn–3.5 wt% Ag/Ni/Sn–3.5 wt% Ag, were reacted at 160, 180, and 200 °C for various lengths of time with and without the passage of electric currents. Without passage of electric currents through the couples, only one intermetallic compound Ni3Sn4 with ∼7 at. % Cu solubility was found at both interfaces of the Sn–0.7 wt% Cu/Ni couples. With the passage of an electric current of 500 A/cm2 density, the Cu6Sn5 phase was formed at the solder/Ni interface besides the Ni3Sn4 phase. Similar to those without the passage of electric currents, only the Ni3Sn4 phase was found at the Ni/solder interface. Directions of movement of electrons, Sn, and Cu atoms are the same at the solder/Ni interface, and the growth rates of the intermetallic layers were enhanced. At the Ni/solder interface, the electrons flow in the opposite direction of the Sn and Cu movement, and the growth rates of the intermetallic layers were retarded. Only the Ni3Sn4 phase was formed from the Sn–3.5 wt% Ag/Ni interfacial reaction with and without the passage of electric currents. Similar to the Sn–0.7 wt% Cu/Ni system, the movement of electrons enhances or retards the growth rates of the intermetallic layers at the solder/Ni and Ni/solder interfaces, respectively. Calculation results show the apparent effective charge za* decreases in magnitude with raising temperatures, which indicates the electromigration effect becomes insignificant at higher temperatures.
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Interfacial reaction on different solder composition after laser solderingGrenzflächenreaktion auf unterschiedliche Lotzusammensetzungen nach dem Laserstrahllöten
F. Muhamad Razizy,O. Saliza Azlina,Y. Farazila
DOI: https://doi.org/10.1002/mawe.202200320
2024-11-10
Materialwissenschaft und Werkstofftechnik
Abstract:The intermetallic compound layer is formed between the layer surface mounting and solder joint formation. The intermetallic compound layer affected the solder joint′s strength. Electroless nickel‐immersion gold is the most popular surface finish used in the industry. Intermetallic compound layer thickness increases during thermal ageing due to the solid‐state reaction at the solder joint formation. This study used electroless nickel‐immersion gold surface finish. The lead free solder used are tin‐silver‐copper 305 and tin‐silver‐copper 307 solder alloys. The difference in copper composition will affect the intermetallic compound′s microstructure after the laser soldering process. The intermetallic compound formation analysis reveals that only (Cu, Ni)6Sn5 was observed at the solder joint interface for both solders after laser soldering. The grain microstructure of tin‐silver‐copper 305 formed is rounded‐shaped and bar‐shaped, while tin‐silver‐copper 307 shapes are oval‐shaped and flake‐like. However, for cross‐sectioned analysis, the intermetallic compound grain microstructure formed at the solder joint formation was (Ni, Cu)3Sn4 and (Cu, Ni)6Sn5 presented in dendrite‐like and scale‐like shapes. This result shows that copper content in solder composition is directly affected the intermetallic compound grain microstructure. When exposed to the ageing process, the intermetallic compound thickness will increase directly with ageing time. The intermetallic compound thickness for tin‐silver‐copper 305 was increased from 0.98 μm to 8.34 μm while tin‐silver‐copper 307 was increased from 1.54 μm to 8.76 μm. The result also shows that nano‐sized of Ag3Sn grain particle was formed on the intermetallic compound surface after an ageing process for both samples, tin‐silver‐copper 305 and tin‐silver‐copper 307.
materials science, multidisciplinary