Abstract:Nanoscale metallic multilayers (NMMs) have attracted significant attention owing to their enhanced mechanical properties and excellent thermal stability. However, the underlying deformation mechanisms of the high-temperature annealed microstructures have not been well clarified. In this study, the effect of annealing temperatures (50 0, 60 0, 70 0, 80 0, and 10 0 0 degrees C) on the microstructural evolution and mechanical properties of Cu/Nb NMMs was investigated systematically. The results show that when the annealing temperature is lower than 800 degrees C the Cu/Nb NMMs maintain their initial continuous nanolayered structure. As the annealing temperature reaches 10 0 0 degrees C, a thermal instability, driven by thermal grain boundary grooving and a Rayleigh instability, leads to the pinching off of the nanolayered structure and even a complete disintegration into an equiaxed grain structure. Uniaxial tensile tests show that 10 0 0 degrees C annealed samples exhibit an enhanced strain hardening capability compared to as-rolled NMMs and this imparts superior ultimate tensile strength ( -492 MPa) and a high elongation ( -20%). TEM observations demonstrate that high-density entangled dislocations exist in the Cu-Nb interface and layers after tensile testing of the high-temperature annealed samples. The dislocation tangles lead to stable and progressive strain hardening which is the dominant factor in determining the superior combination of strength and ductility of the high-temperature annealed samples. Thus, this study offers a promising strategy for evading the strength-ductility dilemma and instead promotes a more in-depth understanding of the deformation mechanisms of heterostructured materials.(c) 2023 Published by Elsevier Ltd on behalf of The editorial office of Journal of Materials Science & Technology.

Annealing-induced highly-conductive and stable Cu–organic composite nanoparticles with hierarchical structures

Managing Mechanical and Electrical Properties of Nanostructured Cu-Fe Composite by Aging Treatment

Thermal Analysis of Cu-Organic Composite Nanoparticles and Fabrication of Highly Conductive Copper Films

The Effect of Annealing on Microstructure and High Temperature Erosion Property of Arc-Spraying Coatings Containing Nanosized Ceramic Powders

Effects of pre-annealing process on microstructure and properties of the Cu-12%Ag composite wire

Study of Annealing Effect Upon the Structural and Solar- Selective Properties of C/Ni/NiO Composite Coatings Prepared by Sol–gel Method

The Enhanced Strength and Electrical Conductivity in Ag/Cu Multilayers by Annealing Process

Annealing Hardening and Softening of an Ultrafine Grained Cu-4.5vol.%Al2O3 Nanocomposite

Effect of annealing processes on microstructure, mechanical properties and conductivity of Cu-12%Ag alloy composite-reinforced by fibers

Stabilization of Nano-Al<sub>2</sub>O<sub>3p</sub>/Cu Composite after High Temperature Annealing Treatment

Stabilization of nano-Al2O3p/Cu composite after high temperature annealing treatment

Stabilization of Nano-Al<sub>2</sub>O<sub>3p</sub>/Cu Composite after High Temperature Annealing Treatment

Achieving high strength and high conductivity synergy through hierarchical precipitation stimulated structural heterogeneities in a Cu-Ag-Zr alloy

The thermal instability mechanism and annealed deformation behavior of Cu/Nb nanolaminate composites

The effect of annealing on trapped copper oxides in particle-particle interfaces of cold-sprayed Cu coatings

Effects of Annealing on the Ferromagnetism and Photoluminescence of Cu-Doped Zno Nanowires

Microstructure, mechanical properties and electrical conductivity of Cu–12wt.% Fe microcomposite annealed at different temperatures

Microstructure, Mechanical Properties and Electrical Conductivity of Cu–12 Wt.% Ag Wires Annealed at Different Temperature

Improvement of Interface and Electrical Properties in Carbon Nanotube/nanocrystalline Copper Composite Films

Enhanced Hardness Via Interface Alloying in Nanoscale Cu/Al Multilayers

Enhanced shear strength and microstructure of Cu–Cu interconnection by low-temperature sintering of Cu nanoparticles

Annealing-induced highly-conductive and stable Cu–organic composite nanoparticles with hierarchical structures

Managing Mechanical and Electrical Properties of Nanostructured Cu-Fe Composite by Aging Treatment

Thermal Analysis of Cu-Organic Composite Nanoparticles and Fabrication of Highly Conductive Copper Films

The Effect of Annealing on Microstructure and High Temperature Erosion Property of Arc-Spraying Coatings Containing Nanosized Ceramic Powders

Effects of pre-annealing process on microstructure and properties of the Cu-12%Ag composite wire

Study of Annealing Effect Upon the Structural and Solar- Selective Properties of C/Ni/NiO Composite Coatings Prepared by Sol–gel Method

The Enhanced Strength and Electrical Conductivity in Ag/Cu Multilayers by Annealing Process

Annealing Hardening and Softening of an Ultrafine Grained Cu-4.5vol.%Al2O3 Nanocomposite

Effect of annealing processes on microstructure, mechanical properties and conductivity of Cu-12%Ag alloy composite-reinforced by fibers

Stabilization of Nano-Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3p&lt;/sub&gt;/Cu Composite after High Temperature Annealing Treatment

Stabilization of nano-Al2O3p/Cu composite after high temperature annealing treatment

Stabilization of Nano-Al<sub>2</sub>O<sub>3p</sub>/Cu Composite after High Temperature Annealing Treatment

Achieving high strength and high conductivity synergy through hierarchical precipitation stimulated structural heterogeneities in a Cu-Ag-Zr alloy

The thermal instability mechanism and annealed deformation behavior of Cu/Nb nanolaminate composites

The effect of annealing on trapped copper oxides in particle-particle interfaces of cold-sprayed Cu coatings

Effects of Annealing on the Ferromagnetism and Photoluminescence of Cu-Doped Zno Nanowires

Microstructure, mechanical properties and electrical conductivity of Cu–12wt.% Fe microcomposite annealed at different temperatures

Microstructure, Mechanical Properties and Electrical Conductivity of Cu–12 Wt.% Ag Wires Annealed at Different Temperature

Improvement of Interface and Electrical Properties in Carbon Nanotube/nanocrystalline Copper Composite Films

Enhanced Hardness Via Interface Alloying in Nanoscale Cu/Al Multilayers

Enhanced shear strength and microstructure of Cu–Cu interconnection by low-temperature sintering of Cu nanoparticles

Stabilization of Nano-Al<sub>2</sub>O<sub>3p</sub>/Cu Composite after High Temperature Annealing Treatment