Improving Microstructure and Corrosion Resistance of Cold Spraying Cu Coating Through Annealing

Mengyu Wang,Dongxu Chang,Baoyi Yu,Li Zheng

DOI: https://doi.org/10.1007/s12666-024-03293-0

2024-03-24

Transactions of the Indian Institute of Metals

Abstract:In order to improve the microstructure and corrosion resistance of the Cu coating prepared by low-pressure cold spraying, the Cu coating was annealed at different temperatures. The microstructure of Cu coating without and with annealing was experimentally investigated. Annealing at the appropriate temperature would make mutual diffusion polymerization between the Cu atoms, and the porosity in the coating decreases from 0.39 to 0.05% when the annealing temperature is 773 K. Meanwhile, annealing promotes recrystallization and grain growth of Cu coating. However, the excessive annealing temperature will make the grain grow abnormally, so that the tiny oxides that originally existed at the interface move along the grain boundaries and gather together, thus forming a larger spherical oxide. The results of the coating immersion experiments show that the corrosion rate of the Cu coating after annealing was reduced from 91.98 to 49.06 MPY compared to the coating without annealing, which is due to the reduced porosity of the coating.

metallurgy & metallurgical engineering