Interfacial Stresses Analyses of Anisotropic Conductive Adhesive Bonding Under Thermal and Humidity Loads

yongcheng lin,xinli wei,xu chen,jun zhang
DOI: https://doi.org/10.1166/jctn.2008.820
2008-01-01
Journal of Computational and Theoretical Nanoscience
Abstract:The reliability of anisotropic conductive adhesive films (ACFs) bonding under thermal and humidity loads has been carried out by means of the interfacial stresses analysis. Beam theory models were used to derive the integral equation through the beam element analysis. The shear stresses and normal stresses of the interface was obtained by solving the integral equations. The simulated results of finite element analysis well agree with the calculated ones by beam theory models. The effects of the material and geometry parameters on the interfacial stresses were also investigated.
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