STRESS ANALYSIS OF CRACKED PLATE WITH ADHESIVELY BONDING

Yong-qiang CHEN,Shu-xun SUN,Qing WANG,Zhen-han YAO
DOI: https://doi.org/10.3969/j.issn.1000-4750.2000.03.008
2000-01-01
Abstract:In this paper, Body Force Method (BFM) with special fundamental solutions and resultant boundary conditions is employed to analyze the problem of an adhesively bonded cracked plate. A shear spring model, which satisfies the continuous displacement conditions of the adhesive layer, is adopted to render the problem into the analysis of the cracked plate and the patch, under the action of distributed forces along boundaries and the adhesive shear stresses. Since the special solutions satisfy the tractive-free conditions of the surface of the crack, the discretizations of the crack surface are not required and the exact distribution of stress near the crack tip is obtained. With the analytical solutions of the Stress Intensity Factors at the crack tip due to a point force, the adhesively bonding effect represented by the reduction of SIF at the crack tip is obtained easily and accurately with less computational effort. As an example of crack patching, a center-cracked plate with a bonded patch subjected to remote in-plane forces is studied. The SIF of the crack tip after repairing is calculated to verify the effect of the adhesively patching method. The distribution of adhesive shear stress in the patched domain is given. The influences of the thickness, elastic constants and size of the patch on the SIF are discussed.
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