Abstract:<span class="a-plus-plus abstract-section id-a-sec1"><p class="a-plus-plus">Thermal treatment is an effective way to decrease the resistivity and internal stress by inducing grain growth accompanied with redistribution of embedded impurities. With the narrowing of Cu interconnects in IC packaging, the increased resistance is becoming the main issue that hindering the electrical performance of IC. Herein, a laser annealing method by liner scanning (LALS) to anneal the Cu interconnects were reported which provide a gradient thermal field for the crystallographic/microstructure transition. The impacts of laser annealing on the sheet resistance of the electroplating Cu films were investigated in aspects of microstructure and phase field simulation. Cu films treated by LALS owned larger average grain size, better recrystallization fraction, and significantly higher average grain aspect ratio than conventional annealing, which indicated the increased driving force for grain boundaries evolution by LALS method. This study exhibited the direct evidence on the impacts of laser annealing process on the resistance of electroplated Cu films. The laser annealing process with a local temperature gradient caused a significant decline in Cu electrical resistance compared to the conventional annealing process, indicating its extraordinary potential in improving Cu wire conductivity. This work will provide a scientific basis for selecting the post-treatment process for electrodeposited Cu films to achieve ideal electrical properties and microstructure in electronics industry applications.</p></span><span class="a-plus-plus abstract-section id-a-sec2 outputmedium-all"><h3 class="a-plus-plus">Graphic </h3></span>

Study on Laser Micro Shock Effect on Electrical Resistivity of Nanometer Copper Film

Experiment Study of Laser Thermal Enhanced Electrochemical Deposition

Experimental Investigation on Laser Shock Micro Hydraulic Bulging of Copper Foil

The Effect of Laser Surface Remelting on the Surface Properties of Copper

Investigation on femtosecond laser shock peening of commercially pure copper without ablative layer and confinement layer in air

A Study on the Electrical Conductivity and Thermal Behavior of Laser Treated Copper Joints

Effects of Laser Irradiation in High-Speed Gas Flow for Surface Treatments of Copper

Surface Morphology and Deformation Mechanism of Single Crystal Copper Treated by Laser Shock Peening

The Evolution of Microstructure and Resistance in Electroplated Copper Films by Linear Integrated Laser Scanning Annealing

Laser Shock Induced Deformation of Copper Foil on Diverse Molds and the Cross-Sectional Microstructure Changes

Towards obtaining high-quality surfaces with nanometric finish by femtosecond laser ablation: A case study on coppers

The microstructural mechanism for mechanical property of LY2 aluminum alloy after laser shock processing

Improvement of Wear Resistance in Laser Shock-Peened Copper Contacts

Experimental Analysis of Microscale Laser Shock Processing on Metallic Material Using Excimer Laser

Investigation on initial grain size and laser power density effects in laser shock bulging of copper foil

Nanocrystallization in single-crystal copper under laser shock compression: A molecular dynamics study

The Influence of Laser Remelting Parameters on the Surface Quality of Copper

Study of Photo-Ionization and Thermal Effects on the Interaction of a Nanosecond Extreme Ultraviolet Laser with Copper

Research on Light Absorption Enhancement of Copper by Nanosecond Laser

A STUDY OF LASER-ENHANCED ELECTRODEPOSITION PROCESS OF COPPER

Effect of Shock Compression Method on the Defect Substructure in Monocrystalline Copper