Investigation on femtosecond laser shock peening of commercially pure copper without ablative layer and confinement layer in air

Lei Chen,Zongshen Wang,Shan Gao,Lihua Zhu,Wenhui Yu,Hongyu Zheng

DOI: https://doi.org/10.1016/j.optlastec.2022.108207

2022-09-01

Abstract:A femtosecond pulse laser was employed to perform micro-scale laser shock peening (LSP) on commercially pure copper directly in air without any ablative layer or confinement layer. The effect of femtosecond LSP on surface morphology, microstructure, surface residual stress and microhardness was investigated. Regular dents are produced at the surface with low pulse energy of 12 μJ and 28 μJ, and a macro ripple structure begins to appear at 51 μJ. All samples exhibit residual compressive stress which increases from the untreated 23.0 ± 9.7 MPa to a maximum 108.3 ± 10.8 MPa at 51 μJ. The surface microhardness increases from the untreated 113.32 ± 1.45 HV to a maximum 127.34 ± 3.42 HV by 12.4% at 28 μJ. The affected thickness of femtosecond LSP is about 5 μm as indicated by the nano-indentation tests. With low pulse energy, plastic deformation, grain refinement and residual compressive stress contribute to the surface strengthening, which is inhibited by surface oxidation especially with high energy.

optics,physics, applied