Study Of Non-Contact Measurement Of The Thermal Expansion Coefficients Of Materials Based On Laser Feedback Interferometry

Fasong Zheng,Yidong Tan,Jing Lin,Yingchun Ding,Shulian Zhang
DOI: https://doi.org/10.1063/1.4917554
IF: 1.6
2015-01-01
Review of Scientific Instruments
Abstract:The noncooperative and ultrahigh sensitive length measurement approach is of great significance to the study of a high-precision thermal expansion coefficient (TEC) determination of materials at a wide temperature range. The novel approach is presented in this paper based on the Nd:YAG microchip laser feedback interferometry with 1064 nm wavelength, the beam frequency of which is shifted by a pair of acousto-optic modulators and then the heterodyne phase measurement technique is used. The sample is placed in a muffle furnace with two coaxial holes opened on the opposite furnace walls. The measurement beams are perpendicular and coaxial on each surface of the sample, the configuration which can not only achieve the length measurement of sample but also eliminate the influence of the distortion of the sample supporter. The reference beams inject on the reference mirrors which are put as possible as near the holes, respectively, to eliminate the air disturbances and the influence of thermal lens effect out of the furnace chamber. For validation, the thermal expansion coefficients of aluminum and steel 45 samples are measured from room temperature to 748 K, which proved measurement repeatability of TECs is better than 0.6 x 10(-6) (K-1) at the range of 298 K-598 K and the high-sensitive non-contact measurement of the low reflectivity surface induced by the oxidization of the samples at the range of 598 K-748 K. (C) 2015 AIP Publishing LLC.
What problem does this paper attempt to address?