Abstract:Abstract The rapid development of various micro-electro-mechanical systems (MEMS) over the past few decades has served as a cornerstone for precisely probing thermal transport in a rich variety of nanomaterials and nanostructures. However, numerous materials that are macroscopic (millimeter scale and above) at least in one dimension, such as metal wires, carbon fibers, and polymer fibers/films, have remained largely inaccessible by MEMS-based approaches. Considering the great fundamental and technological value of these materials, we propose the concept of “big MEMS” here as an effort to fill this notable gap. The idea is to create macroscopic measurement devices through standard MEMS techniques. For demonstration, we present a novel process that enables silicon-based suspended devices of millimeter to centimeter dimensions to be fabricated reliably, reconfigurably, and at low cost. In particular, the beam thermal conductance of our big-MEMS devices can be tuned from around 1.1 to 0.2 mW/K. Combined with a temperature resolution down to ~20 µK, these devices are suitable for characterizing materials spanning a broad range of thermal conductivity. As an example, the thermal conductivity of platinum wires with a diameter of 20 µm and lengths up to 3.5 mm are measured. Moreover, intriguing transport phenomena such as divergent thermal conductivity and heat flow mediated by surface polaritons can be explored considering their inherent need for multiscale analysis. In principle, our concept of big-MEMS can also be applied to the study of thermal diffusivity, heat capacity, charge transport, and beyond.

Measuring coefficient of thermal expansion of materials of micrometre size using SEM/FIB microscope with in situ MEMS heating stage

Micron-Scale Measurements of the Coefficient of Thermal Expansion by Time-Domain Probe Beam Deflection

Simple Nanoindentation-Based Method for Determining Linear Thermal Expansion Coefficients of Micro-Scale Materials

Evaluation of thermal expansion coefficient of carbon fiber reinforced composites using electronic speckle interferometry

Determination of the Coefficient of Thermal Expansion with Embedded Long-Gauge Fiber Optic Sensors

Thermal Conductivity Imaging at Micrometre-Scale Resolution for Combinatorial Studies of Materials

High‐throughput, High‐accuracy Determination of Coefficient of Thermal Expansion of Carbon Fibre–epoxy Composites Using Digital Image Correlation

An Experimental Research on the CTE Measurement of Metal Composite Leads Using Laser Speckle Interferometry

Study on the influence of manufacturing defects on coefficient of thermal expansion of plain weave C/SiC

In-Situ Determination Of The Coefficient Of Thermal Expansion Of Polysilicon Thin Films Using Micro-Rotating Structures

A Micro-Test Structure for the Thermal Expansion Coefficient of Metal Materials

An Electrical Probe for Measuring Thermal Expansion Coefficients of Micromachined Polysilicon Thin Films

Study Of Non-Contact Measurement Of The Thermal Expansion Coefficients Of Materials Based On Laser Feedback Interferometry

Determining thermal expansion coefficients of thin films using micromachined cantilevers

Big MEMS for Thermal Measurement

A novel method for in situ thermal expansion coefficient measurement of polysilicon thin films [MEMS materials applications]

Determining the thermal expansion coefficient of thin films for a CMOS MEMS process using test cantilevers

Thermal properties analysis of MEMS sensors by micro-grid method

Probing thermal expansion coefficients of monolayers using surface enhanced Raman scattering

Research on Sub-Micron Measurement Methods of M55J Carbon Fibre/cyanate Ester Composites

A systematic study on linear thermal expansion coefficient of metals based on interferometric measurement with Fresnel bimirror