Thermal properties analysis of MEMS sensors by micro-grid method

Haixia Shang,Huimin Xie,Fulong Dai,Satoshi Kishimoto
2003-01-01
Abstract:The thermal properties of the micro-electro-mechanical system (MEMS) are important for a number of applications. A double-layer micro-cantilever beam is prepared by the Focus Ion Beam (FIB) milling method. A 0.2 mum spacing grid is manufactured in this cantilever (60 mum long, 10 mum width, 2 mum thick). The structure is placed into a scanning electron microscope (SEM) system with a high temperature device. The observation and recording of the thermal deformation of the cantilever beam are realized in real-time as the temperature rising from the room temperature to 300degreesC with interval of 50degreesC, as well as the micro-grids on it. The temperature can be controlled precisely by the SEM system. The linear coefficients of thermal expansion of plolysilicon under different temperatures are obtained from calculating the deformation of micro-grids on the cantilever. A finite elemental model (FEM) is structured to test the results of experiments. The experiment can provide important data for design of MEMS sensors working under thermal condition.
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