Measurement of Thermal Expansion at Low Temperatures Using the Strain Gage Method

Ke Tang,Long Sha,Yi-jian Li,Tao Jin,Shu-juan Liu

DOI: https://doi.org/10.1631/jzus.a1400051

2014-01-01

Journal of Zhejiang University SCIENCE A

Abstract:Accurate thermal expansion data of material at low temperatures are important in material selection and structural design for a cryogenic system. In this study, an experimental setup with a proportional-integral-derivative (PID) temperature control system was developed to measure the thermal expansion of solid materials at low temperatures (77–293 K), using the strain gage method. To avoid the impact of the varied sensitivity coefficient of the strain gage with the temperature to ensure an accurate measurement, we corrected the sensitivity coefficient in the temperature range of 77–293 K, by comparing the measured thermal expansion data for 304 stainless steel with the source data from the National Institute of Standards and Technology, USA. With the corrected sensitivity coefficient of the strain gage, the measured linear contractions of oxygen-free copper become quite consistent with the NIST data (with a relative deviation of 2.37%) for the cooling-down process from 293 K to 80 K.