Abstract:Fractal-inspired designs represent an emerging class of strategy for stretchable electronics, which have been demonstrated to be particularly useful for various applications, such as stretchable batteries and biointegrated electrophysiological electrodes. The fractal-inspired constructs usually undergo complicated, nonlinear deformations under mechanical loading, because of the highly complex and diverse microstructures inherent in high-order fractal patterns. The underlying relations between the nonlinear mechanical responses and microstructure geometry are essential in practical applications, which require a relevant mechanics theory to serve as the basis of a design approach. Here, a theoretical model inspired by the mechanism of ordered unraveling is developed to study the nonlinear stress–strain curves and elastic stretchability for a class of fractal-inspired horseshoe microstructures. Analytic solutions were obtained for some key mechanical quantities, such as the elastic modulus and the tangent modulus at the beginning of each deformation stage. Both the finite-element analyses (FEA) and experiments were carried out to validate the model. Systematic analyses of the microstructure–property relationship dictate how to leverage the various geometric parameters to tune the multistage, J-shaped stress–strain curves. Moreover, a demonstrative example shows the utility of the theoretical model in design optimization of fractal-inspired microstructures used as electrophysiological electrodes, aiming to achieve maximum elastic stretchability for prescribed filling ratios. The results indicate a substantial enhancement (e.g., >4 times) of elastic stretchability by using fractal designs, as compared to traditional horseshoe designs. This study can serve as design guidelines of fractal-inspired microstructures in different stretchable electronic systems.

Fractal design concepts for stretchable electronics

A hierarchical computational model for stretchable interconnects with fractal-inspired designs

Lateral Buckling and Mechanical Stretchability of Fractal Interconnects Partially Bonded Onto an Elastomeric Substrate

Stretchable silicon electronics and their integration with rubber, plastic, paper, vinyl, leather and fabric substrates

Design of Strain-Limiting Substrate Materials for Stretchable and Flexible Electronics

Mechanics of Stretchable Electronics

Stretchable, Curvilinear Electronics Based on Inorganic Materials

Stretchability of Encapsulated Electronics

Mechanics of Fractal-Inspired Horseshoe Microstructures for Applications in Stretchable Electronics

Mechanics of stretchable inorganic electronic materials

Soft Elastomers with Programmable Stiffness As Strain-Isolating Substrates for Stretchable Electronics.

Designing Thin, Ultrastretchable Electronics with Stacked Circuits and Elastomeric Encapsulation Materials.

Stretchable and Foldable Silicon Integrated Circuits

Optimized Structural Designs for Stretchable Silicon Integrated Circuits

Soft elastomeric composite materials with skin-inspired mechanical properties for stretchable electronic circuits.

Mechanics and Thermal Management of Stretchable Inorganic Electronics.

Flexible Electronics: Ultrathin Silicon Circuits with Strain‐Isolation Layers and Mesh Layouts for High‐Performance Electronics on Fabric, Vinyl, Leather, and Paper (adv. Mater. 36/2009)

Ultrathin Silicon Circuits with Strain‐Isolation Layers and Mesh Layouts for High‐Performance Electronics on Fabric, Vinyl, Leather, and Paper

Three-dimensional Integrated Stretchable Electronics

Mechanically-Guided Structural Designs in Stretchable Inorganic Electronics.

Fabric-based stretchable electronics with mechanically optimized designs and prestrained composite substrates