Thermal Positive-Ionic and Electronic Emissions from Iridium Heated in Vacua

H Kawano,YF Zhu
DOI: https://doi.org/10.1109/27.964474
IF: 1.368
2001-01-01
IEEE Transactions on Plasma Science
Abstract:To clarify the thermionic property of a polycrystalline iridium filament surface heated in vacua (10/sup -5/-10/sup -3/ Pa), the emission current (I/sup +/) of positive ion (M/sup +/) produced from alkali halide molecule (MX) impinging upon the filament was measured as a function of surface temperature (T), incident sample beam flux (N) or residual gas pressure (P/sub r/). The current of thermal electron (e/sup -/) was also measured under the same conditions. Theoretical analysis of the experimental data thus obtained yields the following conclusions: (1) in a low-temperature range (T/sub 1//spl les/1200 K), the ionization efficiency (e/sup -/) of MX decreases steeply with a decrease in T because the work function (/spl phi//sup +/) effective for the ionization is decreased by adsorption of MX; (2) in a middle temperature range (T/sub 1/-T/sub 2//spl ap/1200-1300 K), /spl beta//sup +/=1 is attained, thereby yielding I/sup +//spl ap/10/sup -5/ A/cm/sup 2/ when N is 10/sup 14/ molecules/cm/sup 2/ s; (3) in a high temperature range (T/sub 3//spl ges/1500 K), the surface is kept virtually clean, and /spl phi//sup +/ is constant at 5.73/spl plusmn/0.03 eV while the work function (/spl phi//sup e/) effective for emitting e remains at 5.15/spl plusmn/0.03 eV; (4) as T decreases from T/sub 3/ to T/sub 2/, both /spl phi//sup +/ and /spl phi//sup e/ are increased by up to /spl sim/0.5 eV; (5) as P/sub r/ increases, T/sub 2/ and T/sub 3/ increase while T/sub 1/ decreases, indicating that /spl phi//sup +/ is increased by adsorption of residual gases (especially of oxygen); (6) the thermionic contrast (/spl phi//sup +/-/spl phi//sup e/) is kept constant at 0.57/spl plusmn/0.03 eV without depending upon T, N and P/sub r/; and (7) Ir is useful for effectively ionizing those elements whose ionization energy is less than /spl sim/6 eV.
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