Abstract:The development of radio-frequency integrated circuits (RF-IC) necessitates higher requirements for the size of microtransformers. This paper describes millimeter-scale 3D transformers in millimeter-scale, solenoidal, and toroidal transformers manufactured using Micro-electromechanical Systems (MEMS). Two through-silicon via (TSV) copper coils with a high aspect ratio are precisely interleaved on a reserved air core (magnet core cavity) with a vertical height of over 1 mm because of the thickness of the substrate, which increases the performance while reducing the footprint. The effects of the wire width, coil turns, magnetic core, and substrate on the performance of the two transformers are discussed through numerical simulations. When an air core is present, solenoidal transformers are better than toroidal transformers in terms of performance and footprint; however, the gap decreases when the size is reduced. Additionally, the magnetic core significantly improves the performance of the toroidal transformer compared to that of the solenoid. Thus, the toroidal transformer has a higher potential for further size reduction. The two types of transformers were then manufactured completely using MEMS and electroplating. This paper discusses the influence of various parameters on millimeter-scale 3D transformers and realizes processing in silicon, which provides the foundation for integrating transformers in a chip.

Design and Characterization of SOI Spiral Coil RF Monolithic Transformers

Three-solenoid Windings Transformer Baluns on CMOS-grade Silicon Substrate

Performance Characterization of Circular Silicon Transformers

Experimental Characterization of Hybrid Temperature and Frequency Effects on the Performance of Transformers on Silicon Substrate

Modelling On-Chip Circular Double-Spiral Stacked Inductors for RFICs

Experimental Characterisation Of On-Chip Octagonal Double-Helix Inductors On Silicon Substrates

Design and Fabrication of the Star Coupler Based on SOI Material

Design of Millimeter-Wave Transformer Balun with Isolation Circuit in Silicon Based Technology

Implementation of New CMOS Differential Stacked Spiral Inductor for VCO Design

Comparative investigation on various on-chip center-tapped interleaved transformers: Research Articles

Characterization of symmetrical spiral inductor in 0.35 μm CMOS technology for RF application

Design and Manufacture of Millimeter-Scale 3D Transformers for RF-IC

Simulation and Optimization of High Performance On-Chip Solenoid MEMS Inductor

One And Two-Dimensional Mmi Device With Strong Confinement Structure On Soi

Fabrication and Performance of Novel RF Spiral Inductors on Silicon

Applications of SOI in RF Circuits

The Design of a New Spiral Inductor Balun Used in RF/MW Based on 0.13&#x03bc;m CMOS Process

High Q-factor CMOS-MEMS inductor

Design and Fabrication of LDMOS Power Device on SOI Substrate

Study on self-aligned silicide CMOS/SOI technology

Fabrication and Characterization of High Speed SOI MOS Devices and Ring-Oscillators