A unified multi-axial sub-micron fatigue tester with applications to electronic packaging materials

Minfu Lu,Ren, Wei,Sheng Liu,Dongkai Shangguan
DOI: https://doi.org/10.1109/ECTC.1997.606159
1997-01-01
Abstract:A recently developed multi-axial sub-micron thermomechanical fatigue tester has been used for investigating the behaviors of small specimens, particularly in the field of electronic packaging materials and structures. Materials tested include a copper wire, polycarbonate and polyimide films and a lead-free solder alloy. An active alignment monitoring and adjustment has been found to be important for realistic characteristics of tiny points
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