Propagation Characteristics of High-T/sub C/ Superconducting Interconnect for VLSI Packaging Predicted by a Generalized Two-Fluid Model

JF Kang,RQ Han,XY Liu,YY Wang
DOI: https://doi.org/10.1109/77.585885
IF: 1.9489
1997-01-01
IEEE Transactions on Applied Superconductivity
Abstract:A generalized two-fluid model is used to analyze the propagation characteristics of high-Tc superconducting interconnects for very large scale integration (VLSI) packaging. The comparisons for surface impedance of YBa/sub 2/Cu/sub 3/O/sub 7-x/ (YBCO) single crystals and thin films show data are in good agreement with the generalized two-fluid model. Based on the generalized two-fluid model, the temperature- and frequency-dependences of the attenuation constant are calculated, the transient responses of a pulse transmitted on a high-Tc superconducting interconnect are simulated, and a simple semi-empirical expression for rise time is given. The results based on the generalized two-fluid model predict an optimum operation temperature range for YBCO interconnect near at liquid nitrogen temperature.
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