2D high temperature superconductor integration in contact printed circuit boards

Christian N. Saggau,Sanaz Shokri,Mickey Martini,Tommaso Confalone,Yejin Lee,Daniel Wolf,Genda Gu,Valentina Brosco,Domenico Montemurro,Valerii M. Vinokur,Kornelius Nielsch,Nicola Poccia

DOI: https://doi.org/10.1021/acsami.3c10564

2023-11-01

Abstract:Inherent properties of superconducting Bi2Sr2CaCu2O8+x films, such as the high superconducting transition temperature Tc, efficient Josephson coupling between neighboring CuO layers, and fast quasiparticle relaxation dynamics, make them a promising platform for advances in quantum computing and communication technologies. However, preserving two-dimensional superconductivity during device fabrication is an outstanding experimental challenge because of the fast degradation of the superconducting properties of two-dimensional flakes when they are exposed to moisture, organic sol vents, and heat. Here, to realize superconducting devices utilizing two-dimensional superconducting films, we develop a novel fabrication technique relying on the cryogenic dry transfer of printable circuits embedded into a silicon nitride membrane. This approach separates the circuit fabrication stage requiring chemically reactive substances and ionizing physical processes from the creation of the thin superconducting structures. Apart from providing electrical contacts in a single transfer step, the membrane encapsulates the surface of the crystal shielding it from the environment. The fabricated atomically thin Bi2Sr2CaCu2O8+x-based devices show high superconducting transition temperature Tc ~ 91 K close to that of the bulk crystal and demonstrate stable super conducting properties

Superconductivity,Materials Science

What problem does this paper attempt to address?

The paper aims to address the following issues:

1. **Maintaining 2D Superconductivity**: How to maintain the superconducting properties of 2D high-temperature superconductors (such as Bi2Sr2CaCu2O8+x films) during device fabrication without degradation. In traditional methods, these materials rapidly degrade when exposed to moisture, organic solvents, or high temperatures.

2. **Achieving Complex Circuit Integration**: How to integrate atomically thin high-temperature superconducting materials (such as BSCCO) into complex microelectronic circuits while ensuring their superconducting performance remains stable and unaffected by environmental factors.

To achieve the above goals, the research team developed a novel low-temperature dry transfer technique. By embedding printable circuits within an inorganic silicon nitride film, effective contact with high-temperature superconducting thin films was achieved. This method not only provides electrical contact in a single transfer step but also encapsulates the crystal surface, isolating it from external environmental influences, thereby protecting the superconducting material from damage. Experimental results show that the fabricated devices have a superconducting transition temperature as high as 91K and exhibit stable superconducting characteristics.