Abstract:Printing of electrical circuits and interconnects using isotropic conductive adhesives (ICAs) is of great interest due to their low-temperature processing and compatibility with substrates for applications in sensors, healthcare, and flexible devices. As a lower cost alternative to silver (Ag), copper (Cu)-filled ICAs are desirable but limited by the formation of high-resistivity Cu surface oxides. To overcome this limitation, self-assembled monolayers (SAMs) of octadecanethiol (ODT) have been demonstrated to reduce the oxidation of micrometer-scale Cu powder particles for use in ICAs. However, the deposition and function of the SAM require further investigation, as described in this paper. As part of this work, the stages of the SAM deposition process, which included etching with hydrochloric acid to remove pre-existing oxides, were studied using X-ray photoelectron spectroscopy (XPS), which showed low levels of subsequent Cu oxidation when ODT coated. The treated Cu powders were combined with one- or two-part epoxy resins to make Cu-ICAs, and the effect of the Cu surface condition and weight loading on electrical conductivity was examined. When thermally cured in an inert argon atmosphere, ICAs filled with Cu protected by ODT achieved electrical conductivity up to 20 × 105 S·m-1, comparable to Ag-ICAs, and were used to make a functional circuit. To understand the function of the SAM in these Cu-ICAs, scanning and transmission electron microscopy were used to examine the internal micro- and nano-structures along with the elemental distribution at the interfaces within sections taken from cured samples. Sulfur (S), indicative of the ODT, was still detected at the internal polymer-metal interface after curing, and particle-to-particle contacts were also examined. XPS also identified S on the surface of cured Cu-ICAs even after thermal treatment. Based on the observations, electrical contact and conduction mechanisms for these Cu-filled ICAs are proposed and discussed.

A new approach in measuring Cu-EMC adhesion strength by AFM [electronics packaging applications]

A New Approach in Measuring Cu-EMC Adhesion Strength by AFM

Adhesion improvement of Cu-based substrate and epoxy molding compound interface by hierarchical structure preparation

Effect of High-Frequency and High-Density Current on Adhesive Strength of Copper Thin Film

The Role of Self-Assembled Monolayers in the Surface Modification and Interfacial Contact of Copper Fillers in Electrically Conductive Adhesives

Measurement of Adhesive Bonding Strength with an EMAT in the Resonant Mode

In situ differential atomic force microscopy (AFM) measurement for ultra-thin Thiol SAM patterns by area-selective deposition technique

Study on Interfacial Interaction Energy of Cu–SAM–epoxy Systems in a Hot and Humid Environment

Precise Quantification of the Adhesion Between Metallic Thin Films and Silicon Wafer

Study on the adhesion and reliability of Epoxy Molding Compound and shaped Pd Preplated leadframes

Research progress of interfacial adhesion force of copper plating on Ajinomoto build-up films for chip substrates

Effect of Substrate Surface Roughness on Interfacial Reaction at Sn-3.0Ag/(001)Cu Interface

Surface composition and adhesion strength of copper leadframes for electronic packaging

Quantitative interfacial energy measurements of adhesion-promoted thin copper films by supercritical fluid deposition on barrier layers

Adhesion improvement of Epoxy Molding Compound - Pd Preplated leadframe interface using shaped nickel layers.

Electronic Interaction of Epoxy Resin with Copper at the Adhered Interface

Study on Shear Strength and Jc of EMC/Cu Interface with Cu Oxidation and Moisture Absorption

Study on Low-Temperature Bonding and Reliability of Nano-Twin Copper Micro-Cone Array

Analysis the Interface Delamination of Cu and Emc Adhesive Material in the Cutting Process of Electronic Chip Based on Cohesive Zone Modeling

Microstructure of AuSn Wafer Bonding for RF-MEMS Packaging