Abstract:The 2.5D packaging technology is a high–performance method for electronic packaging. This study addresses the reliability issues of 2.5D packaging during the manufacturing process. A multi–physics field coupling Finite Element Method (FEM) has been developed, combined with sub–modeling techniques, to investigate the curing of underfill adhesive, the curing of Epoxy Molding Compound (EMC), and the reflow soldering between the interposer and substrate in a 2.5D packaging entity during various manufacturing procedures. The focus is on the thermo–mechanical–chemical behavior of viscoelastic components within the packaging structure, as well as the viscoplastic characteristics of the micro solder balls and microbumps. A systematic analysis is conducted on the warpage deformation and stress distribution of the 2.5D packaging at crucial time points. The results demonstrate that after curing, the overall warpage of the packaging exhibits a 'concave' warpage profile. Additionally, as the thickness of the EMC above the chip increases, the warpage value of the packaging also increases. The warpage value defined by linear elasticity is larger than that defined by viscoelasticity. The maximum Von Mises stress value in the key areas of the submodel is greater than the maximum Von Mises stress value in the corresponding key areas of the global model. After reflow soldering, the stress concentration in the micro solder balls occurs at the edge of the micro solder ball array. The maximum stress values for each component of the packaging are observed in the interface areas between the components. Packaging components that undergo the curing process have notably higher warpage and Von Mises stress values than those that do not undergo the curing process. The simulation method established in this study can accurately predict the warpage deformation and stress distribution state of 2.5D packaging, providing significant engineering application value for process optimization and reliability enhancement of 2.5D packaging in the production process.

Reliability analysis in IC package

Computational Analysis of Mechanical and Electromigration Reliability Problems

Actuality and Development of Fatigue Models of Solder Joints in Micro-Electronic Packaging

A Review of System-in-Package Technologies: Application and Reliability of Advanced Packaging

Researches on System Quality Control of Materials and Components for High Density Packaging

Design‐for‐reliability implementation in microelectronics packaging development

Design for Reliability with the Advanced Integrated Circuit(ic) Technology: Challenges and Opportunities

Failure Analysis Application in Semiconductor Device R_c Failures

Modern IC packaging trends and their reliability implications

Failure Mechanism Study for Flip Chip QFN Crack Issue under Temperature Cycling Test

Package and board level reliability modeling of advanced CSP pakages for telecommunication applications

Failure and Failure Characterization of QFP Package Interconnect Structure under Random Vibration Condition.

Reliability Evaluation Method for Electronic Device BGA Package Considering the Interaction Between Design Factors

Low Carbon-Oriented Optimal Reliability Design With Interval Product Failure Analysis And Grey Correlation Analysis

Finite element analysis of 2.5D packaging processes based on multi-physics field coupling for predicting the reliability of IC components

The Analysis of Delamination and Fracture in IC Packages

Dynamic Substructure Method for Prediction of Solder Joint Reliability of IC Package under Drop Test

Research progress in high-performance power device pack-aging and power cycle reliability

An Extensive Study of the Effects of Packaging Structure and Material Properties on Reliability of Advanced Packages by Charactering the Stress Singularities at Interface Corners

Failure Analysis on IC Chips Based on ESD

Discussion on influence of moisture absorption on the reliability of integrated circuit package