Abstract:Combinatorial sputtering of a compositionally complex Ag‐Au‐Pd‐Pt solid solution on pre‐sharpened Si microtip arrays enabled the investigation of interface reactions between the film and Si using a semi‐correlative atom probe tomography/transmission electron microscopy analysis for near atomic‐scale characterization without additional sample preparation. In the presence of native oxide, the interaction occurred at 400 °C, forming a Pd‐Pt‐Si ternary silicide with a crystal structure of Pd2Si. Studying the stability of polyelemental systems such as compositionally complex solid solutions (CCSS) on the atomic scale against thermal decomposition or reaction with other elements is necessary to evaluate their suitability for applications. For this, the combinatorial processing platform approach is used to report on the stability of an exemplary noble metal CCSS thin film system (Ag‐Au‐Pd‐Pt). The thin film is sputter‐deposited at room temperature on flat and pre‐sharpened Si microtip array surfaces, protected solely by their native oxide. The as‐deposited film is a fcc solid solution which is subjected to sequential annealing up to 400 °C. Up to 300 °C, the native Si oxide is a sufficient reaction barrier. However, after annealing at 400 °C solid‐state reactions between the noble metal film and the Si substrate occur, forming mainly a ternary Pd‐Pt‐Si silicide with a crystal structure of Pd2Si (space group P6̅m2), as revealed by a semi‐correlative APT/TEM analysis. Removal of Pd and Pt from the thin film causes partial decomposition of the initial fcc solid solution, with the formation of a Ag‐Au‐rich phase. Moreover, the interaction of the quaternary alloy system with Si is compared to that of pure Pt/Pd with Si. From this, information of preferential silicide formation is derived.

Investigation of Mixing Co in Ultra-Thin NiPt Silicide Films

Phase formation and morphological stability of ultrathin Ni-Co-Pt silicide films formed on Si(100)

Thermal stability improvement of ultrathin CoSi2 film formed by TiN capping layer and Co/Ti/Si ternary solid phase reaction

An atomic force microscopy study of thin CoSi2 films formed by solid state reaction

Extensive Raman spectroscopic investigation of ultrathin Co 1-xNi xSi 2 films grown on Si(100)

Homogenizing Effects of Co on Multi-Scale Elemental Distribution in Ru-containing Ni-based Single Crystal Superalloys

The Study of the Structural, Magnetic and Magneto-Optical Properties of (Pt3co)1-Xnix Alloy Films

Phase Formation and Film Morphology of Ultrathin Co1−xNixSi2 Films

Surface-energy Triggered Phase Formation and Epitaxy in Nanometer-Thick Ni1−xPtx Silicide Films

Investigation of Solid‐State Interface Reactions Between the Compositionally Complex Solid Solution Noble Metal Alloy Ag‐Au‐Pd‐Pt and Si

On the interdiffusion and precipitation of topologically close-packed phases in (Ni,Pt)Al coating/superalloy system: Effects of Pt and Ni contents in coating

Improvement Of The Thermal Stability Of Nisi Films By Using A Thin Pt Interlayer

Understanding Solid-State Interactions: Ultrathin Ni1-xPtx Silicide Films Formed on Si(100)

Effect of Pt Interlayer on Thermal Stability of NiSi Films

Influence of Ti Interlayer on Untrathin Ni Film Silicidation

The Influence of Ti and TiN on the Thermal Stability of CoSi2.

Investigation of Pt-Dy Co-Doping Effects on Isothermal Oxidation Behavior of (Co,ni)-Based Alloy

Morphological Stability and Specific Resistivity of Sub-10 Nm Silicide Films of Ni1−xPtx on Si Substrate

Film Thickness Dependence of the Nisi-To-Nisi2 Transition Temperature in the Ni/Pt/Si(100) System

Synthesis, Composition, Morphology, and Wettability of Electroless Ni-Fe-P Coatings with Varying Microstructures

Enhanced Thermal Stability of NiSi Films on Si(111) Substrates by a Thin Pt Interlayer