Introduction to the Special Section on the 2013 Ieee Asian Solid-State Circuits Conference (A-Sscc)

Zhihua Wang

DOI: https://doi.org/10.1109/jssc.2014.2362359

IF: 5.4

2014-01-01

IEEE Journal of Solid-State Circuits

Abstract:The 14 papers in this special section were originally presented at the 2013 IEEE Asian Solid-State Circuits Circuit Conference (A-SSCC), held in Singapore on November 11-13, 2013.

What problem does this paper attempt to address?

Guest Editorial Introduction to the Special Section on the 2021 Asian Solid-State Circuits Conference (A-SSCC)

Jung-Hwan Choi,Po-Chiun Huang,Woogeun Rhee,Shouyi Yin

DOI: https://doi.org/10.1109/jssc.2022.3196310

IF: 5.4

2022-01-01

IEEE Journal of Solid-State Circuits

Abstract:The Special Issue of the IEEE Journal of Solid- State Circuits (JSSC) includes some of the highlights of the best papers presented at the 2021 Asian Solid-State Circuits Conference (A-SSCC). This year, the A-SSCC 2021 is held as a hybrid conference on November 7-10, 2021 with attendees having the option to join the in-person meeting in Busan, Korea, or participate virtually through on-line platform. As one of the five conferences fully sponsored by the IEEE Solid-State Circuits Society, the A-SSCC was in its 17th appearance in 2021 since its inauguration in 2005 in Taiwan. Rotating among Asian countries, the A-SSCC is quickly becoming one of the leading global forums for the presentation of advances in solid-state circuits and system-on-a-chip (SoC). From 2021, only two-page format articles are allowed for submission and publication.
Introduction to the Special Issue on the 2009 IEEE International Solid-State Circuits Conference

Vadim Gutnik,Nikolaus Klemmer,Zhihua Wang,Michael Green,Roland Thewes

DOI: https://doi.org/10.1109/jssc.2009.2032593

IF: 5.4

2009-01-01

IEEE Journal of Solid-State Circuits

Abstract:The 37 papers in this special issue were originally presented at the IEEE International Solid-State Circuits Conference (ISSCC) in San Francisco, CA, in February 2009. They were take from the best of the Analog, Data Converters, RF, Wireless Communications, Wireline Communications, and MEMS, Imagers, and Display sessions.
Introduction to the Special Section on the 2018 Custom Integrated Circuits Conference

Samuel Palermo,Nan Sun

DOI: https://doi.org/10.1109/jssc.2019.2893079

IF: 5.4

2019-01-01

IEEE Journal of Solid-State Circuits

Abstract:This Special Section of the IEEE Journal of Solid-State Circuits features expanded versions of key papers presented at the 2018 Custom Integrated Circuits Conference (CICC), held in the DoubleTree Mission Valley in San Diego, CA, USA, April 8–11.
A-SSCC 2021 Forward

Eun-Young Jung,Christopher J. Charles,Youngcheol Chae,Alioto Massimo,Changwoo Yoon,Woogeun Rhee

DOI: https://doi.org/10.1109/a-sscc53895.2021.9634178

2021-01-01

Abstract:Welcome to the IEEE Asian Solid-State Circuits Conference (A-SSCC) 2021.This year, the A-SSCC 2021 is held as a hybrid conference from Nov. 7th to Nov. 10th with attendees having the option to join the in-person meeting in Busan, Korea or participate virtually through on-line platform.Being one of the five conferences fully sponsored by the IEEE Solid-State Circuits Society, A-SSCC has grown to be a leading conference in the field of integrated circuits and systems design.The conference theme for this year is "Integrated Circuits and Systems for the Connection of Intelligent Things".The impact of COVID-19 has accelerated the trend of the mobile connectivity.Thereby, the role of integrated circuits has been more critical than ever to build an intelligent connection between human and human with high security and low power.The A-SSCC 2021 presents innovative silicon systems and circuit solutions to enrich our life with the Connection of Intelligent Things.This year, we received 249 submissions from 21 countries and regions around the world.Among all submissions, 94% of papers presented measurement results with silicon chips.After rigorous review process, the Technical Program Committee (TPC) selected 103 high quality papers with the acceptance rate of 41%.In addition, we invited 5 student papers from ESSCIRC 2021, having 108 technical paper presentations.From the A-SSCC 2021, the technical program is extended from a 3-day program to a 4-day program.Four plenary speeches are given by distinguished scholars and industry leaders.In the morning of Nov. 8,
Introduction to the Special Section on the 2019 RFIC Symposium

Hongtao Xu

DOI: https://doi.org/10.1109/jssc.2020.2982726

IF: 5.4

2020-01-01

IEEE Journal of Solid-State Circuits

Abstract:This Special Section of the IEEE Journal of Solid-State Circuits (JSSC) covers expanded articles from the 2019 Radio Frequency Integrated Circuits Symposium (RFIC Symposium), which was held on June 2–4, 2019, in Boston, MA, USA.
Guest editorial: Selected papers from IEEE/CIC ICCC2014

Liu, Jing,Chen, Jiming,Yao, Mingwu

DOI: https://doi.org/10.1109/CC.2015.7084378

2015-01-01

Abstract:Since its successful inauguration in Beijing, August, 2012, the IEEE international Conference on Communications (ICCC) has been globally recognized as one of the important annual international conferences held by the IEEE Communication Society (ComSoc) and China Institute of Communications (CIC). IEEE/CIC ICCC'14, the third ICCC held in Shanghai, China, 13–15 October, 2014, continued to expand its influence and had attracted distinguished scholars, key researchers, young investigators and ambitious students from dozens of countries and regions. The technical program of ICCC 2014 features 4 world-class plenary keynote speeches, 8 technical symposia, 5 tutorials, 4 industrial and academic panels and 1 workshop, covering from decades-long hot topics such as MIMO, interference coordination, heterogeneous networks and etc., to recent eye-catchers such as big data and social networks. The conference not only provided a forum and seminar for active researchers from every directions of this academia, but also attracted delegates from the main players in the industry.
Introduction to the Special Issue on the 2023 Symposium on VLSI Circuits

Mototsugu Hamada,Ron Kapusta

DOI: https://doi.org/10.1109/jssc.2024.3357259

IF: 5.4

2024-03-29

IEEE Journal of Solid-State Circuits

Abstract:This Special Issue of IEEE Journal of Solid-State Circuits highlights some of the outstanding circuit papers presented at the Symposium on VLSI Technology and Circuits. The Symposium was held in person, June 11–16, 2023, in Kyoto, Japan.

engineering, electrical & electronic
Circuits and Systems for Wireless Sensing

Xiongchuan Huang,Xiaopeng Yu,Chao Wang,Hao Gao

DOI: https://doi.org/10.1155/2017/4045780

IF: 2.336

2017-01-01

Journal of Sensors

Abstract:The concept of Wireless Sensor Networks (WSN) emerged in the last decade, with various applications proposed.It was envisioned that the ubiquitous sensing and communication devices would soon be integrated into our daily life, to provide information and convenience wherever and whenever we need.However, to date, we have yet to see mass adoption of such applications, mainly due to the lack of viable wireless sensing devices, as well as the fragmentation of the data storage, computing, and networking infrastructure.Recent advances in the field of artificial intelligence, big data, and cloud computing, as well as concurrent attempts in standardization in low-power wireless networking and security, are paving the way for the commercialization of WSN applications.With the commercial ecosystem getting in place and infrastructures becoming mature, the challenge lies in the research and development in low-cost, miniaturized, and self-sustaining circuits and systems, to realize sensing and wireless communication functionalities which are critical in the future WSN landscape.In this special issue, the latest research efforts on circuits and systems for wireless sensing are presented.10 research papers are published in this issue, covering a wide variety of topics including MAC and routing protocols for wireless sensor networks, integrated circuits, and devices for wireless sensors, as well as complete wireless sensor systems for real world applications.The highlights of these papers are summarized as follows."A 5 V-to-3.3V CMOS Linear Regulator with Three-Output Temperature-Independent Reference Voltages" by
Guest Editorial 2019 Custom Integrated Circuits Conference

Nan Sun,Jane Gu

DOI: https://doi.org/10.1109/jssc.2019.2961757

IF: 5.4

2020-01-01

IEEE Journal of Solid-State Circuits

Abstract:This Special Issue of the IEEE Journal of Solid-State Circuits features expanded versions of key articles presented at the 2019 Custom Integrated Circuits Conference (CICC) held at Hilton, Austin, TX, USA, from April 14 to April 17.
Guest editorial: Selected papers from IEEE ICCC'12

Zhisheng, N.,Molisch, A.F.,Junshan, Z.

DOI: https://doi.org/10.1109/CC.2013.6457525

2013-01-01

Abstract:The papers in this special issue were presetned at the First IEEE International Conference on Communications in China (ICCC'12) that was held in Beijing, China, 15-17 August, 2012.
International Conference on Solid State Physics 2013 Publication Chair's Preface

Dan Wei

DOI: https://doi.org/10.1109/tmag.2014.2333172

IF: 1.848

2014-01-01

IEEE Transactions on Magnetics

Abstract:On behalf of the Publication Committee of the International Conference on Solid State Physics 2013 (ICSSP'13), and of the Magnetism and Magnetic Materials (MMM) Section of ICSSP'13, I am pleased to present a selection of papers from the ICSSP'13-MMM held in at University of the Punjab, Lahore, Pakistan, on December 1–6, 2013. Among the 227 oral and poster presentations in ICSSP'13, the MMM section...
Guest Editorial Special Section on the 2013 International Conference on Automation Science and Engineering

Jingshan Li

DOI: https://doi.org/10.1109/TASE.2014.2372096

2015-01-01

Abstract:The 11 papers in this special section were originally presented at the 2013 International Conference on Automation Science and Engineering, held August 17-21, 2013, in Madison, Wisconsin, USA. The papers can be characterized in three categories: automation in robot systems, manufacturing systems, and healthcare systems.
Guest Editorial Introduction to the Special Section on the 2023 RFIC Symposium

Kenichi Okada

DOI: https://doi.org/10.1109/jssc.2024.3379608

IF: 5.4

2024-04-27

IEEE Journal of Solid-State Circuits

Abstract:This special section of the IEEE Journal of Solid-State Circuits presents the expanded versions of selected articles presented at the 2023 Radio Frequency Integrated Circuits Symposium (RFIC) held in San Diego, CA, USA, during June 11–13, 2023. The RFIC Symposium is the world's premier conference focused on RF and millimeter-wave (mmWave) integrated circuits and systems technology. In addition to showcasing state-of-the-art high-frequency IC design techniques, the conference has evolved to encompass a wide range of emerging technologies and applications, including wireless/wireline communication, cryogenic technology, and other innovations in RF, millimeter-wave, terahertz-wave, and analog/mixed-signal ICs. The collection of papers in this special Section reflects the diversity and multidisciplinary nature of the RFIC Symposium.

engineering, electrical & electronic
Highlight of ISSCC 2008 Papers in RF and Wireless Communication and the Progress of R&D on IC Design Community in Mainland China, Taiwan and Hong Kong

Zhihua Wang

DOI: https://doi.org/10.1109/rfit.2007.4443985

2007-01-01

Abstract:This article consists of a collection of slides from the author's conference presentation.
Introduction to the Special Section from the IEEE GLOBECOM 2017 Conference

Jianwei Huang,Yue Gao,K. P. Subbalakshmi

DOI: https://doi.org/10.1109/tccn.2018.2842358

IF: 6.359

2018-01-01

IEEE Transactions on Cognitive Communications and Networking

Abstract:We are delighted to introduce the readers to this special section of the IEEE Transactions on Cognitive Communications and Networking (TCCN), which is devoted to selected papers from the IEEE GLOBECOM 2017 Cognitive Radio and Networks Symposium.
International Solid-State Circuits Conference 2019 Aims at "envisioning the Future"

Haikun Jia,Baoyong Chi

DOI: https://doi.org/10.1007/s11432-019-9873-x

2019-01-01

Science China Information Sciences

Abstract:>The International Solid-State Circuits Conference(ISSCC) is well known as the best global forum with respect to solid-state circuits and systems-ona-chip. Held in San Francisco in January or February each year, the conference attracts more than
Guest Editors' Introduction: Special Section on IEEE PacificVis 2017

Tim Dwyer,Yingcai Wu

DOI: https://doi.org/10.1109/tvcg.2017.2677091

IF: 5.2

2017-01-01

IEEE Transactions on Visualization and Computer Graphics

Abstract:The papers in this special section were presented at the 2017 IEEE Paciﬁc Visualization Symposium (IEEE PaciﬁcVis’17) which was held at the Seoul National University, Seoul, Korea from April 18 to 21, 2017.
Guest Editorial: Special Issue on Selected Articles From IEEE BioCAS 2023

Chung-Chih Hung,Mohamed Atef,Vanessa Chen

DOI: https://doi.org/10.1109/tbcas.2024.3434009

2024-08-24

IEEE Transactions on Biomedical Circuits and Systems

Abstract:The 12 articles in this special issue were presented at the 2023 IEEE Biomedical Circuits and Systems Conference (BioCAS) in Toronto, Canada, from October 19–21, 2023. BioCAS 2023 was jointly sponsored by the IEEE Circuits and Systems (CAS) Society, IEEE Solid-State Circuits (SSC) Society, and the IEEE Engineering in Medicine and Biology (EMB) Society.

engineering, biomedical, electrical & electronic
Special Issue on Top Picks From the 2023 Computer Architecture Conferences

Yan Solihin

DOI: https://doi.org/10.1109/mm.2024.3431308

IF: 2.8212

2024-08-29

IEEE Micro

Abstract:It is our pleasure to introduce the IEEE Micro Special Issue on Top Picks from the 2023 Computer Architecture Conferences. This special issue includes 12 articles chosen by a selection committee (SC) as being the most significant research articles in computer architecture in 2023 in terms of their potential for long-term impact. The committee also selected an additional 12 articles to be recognized with an honorable mention (see "Honorable Mentions").

computer science, software engineering, hardware & architecture
Introduction to the Special Section on SOSP 2021

Sam H. Noh

DOI: https://doi.org/10.1145/3542850

2022-09-02

ACM Transactions on Storage

Abstract:No abstract available.

computer science, software engineering, hardware & architecture

Introduction to the Special Section on the 2013 Ieee Asian Solid-State Circuits Conference (A-Sscc)

Guest Editorial Introduction to the Special Section on the 2021 Asian Solid-State Circuits Conference (A-SSCC)

Introduction to the Special Issue on the 2009 IEEE International Solid-State Circuits Conference

Introduction to the Special Section on the 2018 Custom Integrated Circuits Conference

A-SSCC 2021 Forward

Introduction to the Special Section on the 2019 RFIC Symposium

Guest editorial: Selected papers from IEEE/CIC ICCC2014

Introduction to the Special Issue on the 2023 Symposium on VLSI Circuits

Circuits and Systems for Wireless Sensing

Guest Editorial 2019 Custom Integrated Circuits Conference

Guest editorial: Selected papers from IEEE ICCC'12

International Conference on Solid State Physics 2013 Publication Chair's Preface

Guest Editorial Special Section on the 2013 International Conference on Automation Science and Engineering

Guest Editorial Introduction to the Special Section on the 2023 RFIC Symposium

Highlight of ISSCC 2008 Papers in RF and Wireless Communication and the Progress of R&#x00026;D on IC Design Community in Mainland China, Taiwan and Hong Kong

Introduction to the Special Section from the IEEE GLOBECOM 2017 Conference

International Solid-State Circuits Conference 2019 Aims at "envisioning the Future"

Guest Editors' Introduction: Special Section on IEEE PacificVis 2017

Guest Editorial: Special Issue on Selected Articles From IEEE BioCAS 2023

Special Issue on Top Picks From the 2023 Computer Architecture Conferences

Introduction to the Special Section on SOSP 2021

Highlight of ISSCC 2008 Papers in RF and Wireless Communication and the Progress of R&D on IC Design Community in Mainland China, Taiwan and Hong Kong