International Solid-State Circuits Conference 2019 Aims at "envisioning the Future"

Haikun Jia,Baoyong Chi

DOI: https://doi.org/10.1007/s11432-019-9873-x

2019-01-01

Science China Information Sciences

Abstract:>The International Solid-State Circuits Conference(ISSCC) is well known as the best global forum with respect to solid-state circuits and systems-ona-chip. Held in San Francisco in January or February each year, the conference attracts more than

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Through the Looking Glass—The 2023 Edition: Trends in solid-state circuits from ISSCC

Shahriar Mirabbasi,Laura C. Fujino,Kenneth C. Smith

DOI: https://doi.org/10.1109/mssc.2022.3222727

2023-01-01

IEEE Solid-State Circuits Magazine

Abstract:The International Solid-State Circuits Conference (ISSCC) is the flagship conference of the IEEE Solid-State Circuits Society. The theme for ISSCC 2023 is Building on 70 Years of Innovation in Solid-State Circuit Design. The IC design community has proved to be agile and resilient in a world scarred by the worldwide pandemic, and this years ISSCC commemorates the 70th anniversary of ISSCC with an edition that is more than ever focused on innovation. To enhance our lives and support increasingly more innovative developments, ISSCC promotes and shares new circuit ideas with potential to advance the state of the art for IC design and enable systems with ever-improving functionality and efficiency.

English Else
Through the Looking Glass-2020 Edition: Trends in Solid-State Circuits From ISSCC

Denis C. Daly,Laura C. Fujino,Kenneth C. Smith

DOI: https://doi.org/10.1109/mssc.2019.2952282

2020-01-01

Abstract:The International Solid-State Circuits Conference (ISSCC) is the flagship conference of the IEEE Solid-State Circuits Society. The theme for ISSCC 2020 is "Integrated Circuits Powering the Artificial Intelligence (AI) Era." Advances in solid-state circuits and systems have brought ever more powerful communication and computational capabilities into mobile form factors. Such ubiquitous smart devices lie at the heart of a revolution shaping how we connect, collaborate, build relationships, and share information. These social technologies enable people to maintain connections and support networks not otherwise possible; they provide the ability to access information instantaneously and from any location, thereby helping to shape world events and culture, empower citizens of all nations, and create social networks that help worldwide communities develop and form bonds based on common interests.

English Else
Through the Looking Glass—The 2022 Edition: Trends in solid-state circuits from ISSCC

Shahriar Mirabbasi,Laura C. Fujino,Kenneth C. Smith

DOI: https://doi.org/10.1109/mssc.2021.3128243

2022-01-01

Abstract:The International Solid-State Circuits Conference (ISSCC) is the flagship conference of the IEEE Solid-State Circuits Society. The theme for ISSCC 2022 is Intelligent Silicon for a Sustainable World. This theme further highlights the fact that to cope with strong environmental changes, the circuit design community is evolving more than ever to support a more sustainable world. Given their widespread use in our everyday lives, without change, ICs will become the dominant energy consumer and source of carbon emissions in the (near) future. Despite phenomenal advances in solid-state circuits and systems, low-power circuit design is becoming increasingly more sophisticated in all application areas, from digital computation and machine learning to analog design. In the context of data communications, advances in wireless and wireline circuits will help optimize local and global communications energy. Various sensors can be deployed to measure environmental data and optimize energy consumption. Power management techniques continue to be an essential aspect of a majority of circuits and systems to extend their lifetime and battery longevity. Furthermore, new technologies are providing opportunities to develop innovative circuits, reduce fabrication impacts, and improve recyclability.

English Else
A-SSCC 2021 Forward

Eun-Young Jung,Christopher J. Charles,Youngcheol Chae,Alioto Massimo,Changwoo Yoon,Woogeun Rhee

DOI: https://doi.org/10.1109/a-sscc53895.2021.9634178

2021-01-01

Abstract:Welcome to the IEEE Asian Solid-State Circuits Conference (A-SSCC) 2021.This year, the A-SSCC 2021 is held as a hybrid conference from Nov. 7th to Nov. 10th with attendees having the option to join the in-person meeting in Busan, Korea or participate virtually through on-line platform.Being one of the five conferences fully sponsored by the IEEE Solid-State Circuits Society, A-SSCC has grown to be a leading conference in the field of integrated circuits and systems design.The conference theme for this year is "Integrated Circuits and Systems for the Connection of Intelligent Things".The impact of COVID-19 has accelerated the trend of the mobile connectivity.Thereby, the role of integrated circuits has been more critical than ever to build an intelligent connection between human and human with high security and low power.The A-SSCC 2021 presents innovative silicon systems and circuit solutions to enrich our life with the Connection of Intelligent Things.This year, we received 249 submissions from 21 countries and regions around the world.Among all submissions, 94% of papers presented measurement results with silicon chips.After rigorous review process, the Technical Program Committee (TPC) selected 103 high quality papers with the acceptance rate of 41%.In addition, we invited 5 student papers from ESSCIRC 2021, having 108 technical paper presentations.From the A-SSCC 2021, the technical program is extended from a 3-day program to a 4-day program.Four plenary speeches are given by distinguished scholars and industry leaders.In the morning of Nov. 8,
Introduction to the Special Issue on the 2009 IEEE International Solid-State Circuits Conference

Vadim Gutnik,Nikolaus Klemmer,Zhihua Wang,Michael Green,Roland Thewes

DOI: https://doi.org/10.1109/jssc.2009.2032593

IF: 5.4

2009-01-01

IEEE Journal of Solid-State Circuits

Abstract:The 37 papers in this special issue were originally presented at the IEEE International Solid-State Circuits Conference (ISSCC) in San Francisco, CA, in February 2009. They were take from the best of the Analog, Data Converters, RF, Wireless Communications, Wireline Communications, and MEMS, Imagers, and Display sessions.
Guest editorial: Selected papers from IEEE/CIC ICCC2014

Liu, Jing,Chen, Jiming,Yao, Mingwu

DOI: https://doi.org/10.1109/CC.2015.7084378

2015-01-01

Abstract:Since its successful inauguration in Beijing, August, 2012, the IEEE international Conference on Communications (ICCC) has been globally recognized as one of the important annual international conferences held by the IEEE Communication Society (ComSoc) and China Institute of Communications (CIC). IEEE/CIC ICCC'14, the third ICCC held in Shanghai, China, 13–15 October, 2014, continued to expand its influence and had attracted distinguished scholars, key researchers, young investigators and ambitious students from dozens of countries and regions. The technical program of ICCC 2014 features 4 world-class plenary keynote speeches, 8 technical symposia, 5 tutorials, 4 industrial and academic panels and 1 workshop, covering from decades-long hot topics such as MIMO, interference coordination, heterogeneous networks and etc., to recent eye-catchers such as big data and social networks. The conference not only provided a forum and seminar for active researchers from every directions of this academia, but also attracted delegates from the main players in the industry.
Guest Editorial Introduction to the Special Section on the 2021 Asian Solid-State Circuits Conference (A-SSCC)

Jung-Hwan Choi,Po-Chiun Huang,Woogeun Rhee,Shouyi Yin

DOI: https://doi.org/10.1109/jssc.2022.3196310

IF: 5.4

2022-01-01

IEEE Journal of Solid-State Circuits

Abstract:The Special Issue of the IEEE Journal of Solid- State Circuits (JSSC) includes some of the highlights of the best papers presented at the 2021 Asian Solid-State Circuits Conference (A-SSCC). This year, the A-SSCC 2021 is held as a hybrid conference on November 7-10, 2021 with attendees having the option to join the in-person meeting in Busan, Korea, or participate virtually through on-line platform. As one of the five conferences fully sponsored by the IEEE Solid-State Circuits Society, the A-SSCC was in its 17th appearance in 2021 since its inauguration in 2005 in Taiwan. Rotating among Asian countries, the A-SSCC is quickly becoming one of the leading global forums for the presentation of advances in solid-state circuits and system-on-a-chip (SoC). From 2021, only two-page format articles are allowed for submission and publication.
Introduction to the Special Section on the 2018 Custom Integrated Circuits Conference

Samuel Palermo,Nan Sun

DOI: https://doi.org/10.1109/jssc.2019.2893079

IF: 5.4

2019-01-01

IEEE Journal of Solid-State Circuits

Abstract:This Special Section of the IEEE Journal of Solid-State Circuits features expanded versions of key papers presented at the 2018 Custom Integrated Circuits Conference (CICC), held in the DoubleTree Mission Valley in San Diego, CA, USA, April 8–11.
Introduction to the Special Section on the 2013 Ieee Asian Solid-State Circuits Conference (A-Sscc)

Zhihua Wang

DOI: https://doi.org/10.1109/jssc.2014.2362359

IF: 5.4

2014-01-01

IEEE Journal of Solid-State Circuits

Abstract:The 14 papers in this special section were originally presented at the 2013 IEEE Asian Solid-State Circuits Circuit Conference (A-SSCC), held in Singapore on November 11-13, 2013.
ICCAD Tutorial Session Paper Ferroelectric FET Technology and Applications: From Devices to Systems

Hussam Amrouch,Di Gao,Xiaobo Sharon Hu,Arman Kazemi,Ann Franchesca Laguna,Kai Ni,Michael T. Niemier,Mohammad Mehdi Sharifi,Simon Thomann,Xunzhao Yin,Cheng Zhuo

DOI: https://doi.org/10.1109/ICCAD51958.2021.9643578

2021-01-01

Abstract:The rapidly increasing volume and complexity of data is demanding the relentless scaling of computing power. With transistor feature size approaching physical limits, the benefits that CMOS technology can provide is diminishing. For future energy efficient computing systems, researchers aim to exploit various emerging nanotechnologies to replace conventional CMOS technology. In particular, ferroelectric FETs (FeFETs) appear to be a promising candidate to continue improving energy efficiency for data-intensive applications. Advances in FeFET scalability and FeFET compatibility with CMOS have sparked growing interest in device, circuit, and system communities. While FeFET is still evolving, many researchers and developers are already cautiously optimistic about its future. This paper provides a review on FeFET's recent technology advances, challenges, and opportunities, with a particular emphasis upon device modeling and circuit design of FeFET content addressable memory, as well as their applications in machine learning.
The 44th Annual IEEE Custom Integrated Circuits Conference (CICC 2023) [conference Reports]

Eric Soenen,Nan Sun,Arijit Raychowdhury,Samuel M. Palermo,Fa Foster Dai,Hua Wang,Christophe Antoine

DOI: https://doi.org/10.1109/mssc.2023.3285369

2023-01-01

IEEE Solid-State Circuits Magazine

Abstract:Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.
EE4: Eureka! the Best Moments of Solid-State Circuit Design in the 2000S.

Woogeun Rhee,Eric A. M. Klumperink,Hossein Hashemi

DOI: https://doi.org/10.1109/isscc.2016.7418132

2016-01-01

Abstract:Eureka moments are exciting, but do the resulting ideas also work out as hoped for? Do they have impact on the field? Well-known experts from various fields will share their ups and downs related to recent innovations in solid-state circuits and put them in a historical perspective with earlier developments. This panel features six entertaining presentations given by leading experts in the areas of power conversion, digital clock generation, mm-Wave, wireless, biomedical SoC, and wireline systems.
Guest Editorial 2019 Custom Integrated Circuits Conference

Nan Sun,Jane Gu

DOI: https://doi.org/10.1109/jssc.2019.2961757

IF: 5.4

2020-01-01

IEEE Journal of Solid-State Circuits

Abstract:This Special Issue of the IEEE Journal of Solid-State Circuits features expanded versions of key articles presented at the 2019 Custom Integrated Circuits Conference (CICC) held at Hilton, Austin, TX, USA, from April 14 to April 17.
IEEE SSCS Beijing Chapter Organizes Five ISSCC Promotion Seminars [Chapters]

Milin Zhang,Liyuan Liu,Xiyuan Tang,Zhijie Chen

DOI: https://doi.org/10.1109/mssc.2023.3269356

2023-01-01

IEEE Solid-State Circuits Magazine

Abstract:The IEEE Solid-State Circuits Society (SSCS) Beijing Chapter, together with the SSCS Tsinghua Student Chapter, organized five International Solid-State Circuits Conference (ISSCC) promotion seminars from late March to April, at Tsinghua University, Peking University, Beijing University of Technology, Institute of Semiconductors, Chinese Academy of Sciences, and Beijing University of Posts and Telecommunications, respectively. The participants were mainly undergraduates majoring in electronic engineering and junior graduate students majoring in IC design.
Introduction to the Special Section on the 2019 RFIC Symposium

Hongtao Xu

DOI: https://doi.org/10.1109/jssc.2020.2982726

IF: 5.4

2020-01-01

IEEE Journal of Solid-State Circuits

Abstract:This Special Section of the IEEE Journal of Solid-State Circuits (JSSC) covers expanded articles from the 2019 Radio Frequency Integrated Circuits Symposium (RFIC Symposium), which was held on June 2–4, 2019, in Boston, MA, USA.
Introduction to the Special Issue on the 2023 Symposium on VLSI Circuits

Mototsugu Hamada,Ron Kapusta

DOI: https://doi.org/10.1109/jssc.2024.3357259

IF: 5.4

2024-03-29

IEEE Journal of Solid-State Circuits

Abstract:This Special Issue of IEEE Journal of Solid-State Circuits highlights some of the outstanding circuit papers presented at the Symposium on VLSI Technology and Circuits. The Symposium was held in person, June 11–16, 2023, in Kyoto, Japan.

engineering, electrical & electronic
Advances in Information and Communication

DOI: https://doi.org/10.1007/978-3-030-39442-4

2020-01-01

Abstract:This book presents high-quality research on the concepts and developments in the field of information and communication technologies, and their applications. It features 134 rigorously selected papers (including 10 poster papers) from the Future of Information and Communication Conference 2020 (FICC 2020), held in San Francisco, USA, from March 5 to 6, 2020, addressing state-of-the-art intelligent methods and techniques for solving real-world problems along with a vision of future research. Discussing various aspects of communication, data science, ambient intelligence, networking, computing, security and Internet of Things, the book offers researchers, scientists, industrial engineers and students valuable insights into the current research and next generation information science and communication technologies.
Preface: Phys. Status Solidi C 6/3

Deren Yang,Martin Kittler

DOI: https://doi.org/10.1002/pssc.200960048

2009-01-01

physica status solidi c

Abstract:AbstractThese proceedings contain the contributions of the 3rd Sino–German Symposium “The Silicon Age: Silicon for Microelectronics, Photonics and Photovoltaics”, which was held from 9 to 14 June 2008 in the HNA Hotel, Hangzhou, P.R. China. Nearly 30 scientists from Germany and China were invited to present their views about different aspects of silicon.In the silicon age, microelectronics has driven the high‐speed development of economy, science and technology in the world during the last century and affects now every aspect of our life. Solar cells based on crystalline Si are expected to cover more than 10% of the worldwide energy consumption in a few decades. Furthermore, there are intensive research activities regarding Si‐based photonics, including on‐chip integration of photonics in CMOS IC technology. In addition, new areas being connected with silicon are starting to appear, such as electrical biochips, micro‐opto‐electro‐mechanics or nanotechnology and nanoelectronics. Silicon, one can reasonably argue, is the most intensively studied solid element of all materials in the world. However, there is still a need for continuation of research and development regarding numerous aspects of Si, which are the field of work of many laboratories all over the world. Examples for such ‘hot’ areas are larger Si crystals/wafers, SiGe hetrostructures for high speed devices, Si‐based light emitters, application of Si in new micro‐opto‐electro‐mechanic devices etc.During the 3rd Sino–German symposium, the progress regarding crystalline silicon materials in different areas has been discussed. German and Chinese scientists from universities and research institutes presented their views about the various facets of silicon materials. The symposium provided a forum for a fruitful, intensive and open communication allowing the participants to build up or intensify relationships for a close cooperation in future.We would like to thank all participants of the symposium for their contributions and the Sino–German Science Centre in Beijing for the financial support of the symposium.October 2008
Cognitive Systems and Signal Processing

Fan Sun,Huaping Liu,Dewen Hu

DOI: https://doi.org/10.1007/978-981-13-7986-4

2019-01-01

Abstract:ICCSIP 2018 Proceedings on vision and image, algorithms, robotics, human-computer interaction, deep learning, information processing and automatic driving, machine learning, networks, Artificial Intelligence, cognitive systems, healthcare, environment.
Proceedings of the 2010 2nd International Conference on Future Computer and Communication, ICFCC 2010: Preface

Lenoard Kleinrock,Zongkai Yang,Liansheng Tan,Weihua Zhuang,Yi Pan,Moshe Zukerman,Chao Lu,Cheng Tee Hiang,Zvi Rosberg,Jie Li,Maode Ma,Chai Teck Yoong,J. Hanumanthappa,Reza Malekian,Jivesh Govil,Lili Nurliyana Abdullah,Hung Min Sun,V. Saravanan,Nazir Ahmad Zafar,Madhu S. Nair,Richard M. Voyles,Dong Jae Kang,Sang Ho Lee,Hassan Fathabadi,Ahmed Wasif Reza,Ahmed Samak,Robert Kenny,Mostafa Mahmoud,Najla Algadi,Mullen Laurie,Safaa S. Mahmoud,Jianqiang Sun,Rajan John,Capanni Niccolo,Mahanti Prabhat Kumar,P. Chaiwanarom,Peddoju Sateesh Kumar,Sevaux Marc,Tahseen Ahmed Jilani,Soumit Chowdhury,Vlacic Ljubo,Wei Guo,B. K. Mohanty,Agarwal Ankur,Parvinder S. Sandhu,Wenfa Hu,Steve Thatcher,Jakkree Srinonchat,M. Nasseh Tabrizi,Hussein Moselhy Sayed Ahmed,Sonam Tobgay,P. Kiran Sree,Nasro Min-Allah,Basim Alhadidi,Taher Omran Ahmed,Pierre André Ménard,Neeraj Nehra,Chih Yung Chang,Li Ling Hung,Giancarlo Fortino,Cho Li Wang,Huei Ru Tseng,Filip Orság,Carlos T. Calafate,Carlo Fischione,Andras Farago,Guy Pujolle,Danil V. Prokhorov,Costas Busch,Alex Aravind,Alfredo Cuzzocrea,Francisco Javier Sanchez Bolumar,Yuhua Liu,Shuang-Hua Yang,Lachlan L. H. Andrew,Chris Zhang

DOI: https://doi.org/10.1109/icfcc.2010.5497304

2010-01-01

Abstract:Proceedings of the 2010 2nd International Conference on Future Computer and Communication, ICFCC 2010 : Preface

International Solid-State Circuits Conference 2019 Aims at "envisioning the Future"

Through the Looking Glass—The 2023 Edition: Trends in solid-state circuits from ISSCC

Through the Looking Glass-2020 Edition: Trends in Solid-State Circuits From ISSCC

Through the Looking Glass—The 2022 Edition: Trends in solid-state circuits from ISSCC

A-SSCC 2021 Forward

Introduction to the Special Issue on the 2009 IEEE International Solid-State Circuits Conference

Guest editorial: Selected papers from IEEE/CIC ICCC2014

Guest Editorial Introduction to the Special Section on the 2021 Asian Solid-State Circuits Conference (A-SSCC)

Introduction to the Special Section on the 2018 Custom Integrated Circuits Conference

Introduction to the Special Section on the 2013 Ieee Asian Solid-State Circuits Conference (A-Sscc)

ICCAD Tutorial Session Paper Ferroelectric FET Technology and Applications: From Devices to Systems

The 44th Annual IEEE Custom Integrated Circuits Conference (CICC 2023) [conference Reports]

EE4: Eureka! the Best Moments of Solid-State Circuit Design in the 2000S.

Guest Editorial 2019 Custom Integrated Circuits Conference

IEEE SSCS Beijing Chapter Organizes Five ISSCC Promotion Seminars [Chapters]

Introduction to the Special Section on the 2019 RFIC Symposium

Introduction to the Special Issue on the 2023 Symposium on VLSI Circuits

Advances in Information and Communication

Preface: Phys. Status Solidi C 6/3

Cognitive Systems and Signal Processing

Proceedings of the 2010 2nd International Conference on Future Computer and Communication, ICFCC 2010: Preface