A-SSCC 2021 Forward

Eun-Young Jung,Christopher J. Charles,Youngcheol Chae,Alioto Massimo,Changwoo Yoon,Woogeun Rhee
DOI: https://doi.org/10.1109/a-sscc53895.2021.9634178
2021-01-01
Abstract:Welcome to the IEEE Asian Solid-State Circuits Conference (A-SSCC) 2021.This year, the A-SSCC 2021 is held as a hybrid conference from Nov. 7th to Nov. 10th with attendees having the option to join the in-person meeting in Busan, Korea or participate virtually through on-line platform.Being one of the five conferences fully sponsored by the IEEE Solid-State Circuits Society, A-SSCC has grown to be a leading conference in the field of integrated circuits and systems design.The conference theme for this year is "Integrated Circuits and Systems for the Connection of Intelligent Things".The impact of COVID-19 has accelerated the trend of the mobile connectivity.Thereby, the role of integrated circuits has been more critical than ever to build an intelligent connection between human and human with high security and low power.The A-SSCC 2021 presents innovative silicon systems and circuit solutions to enrich our life with the Connection of Intelligent Things.This year, we received 249 submissions from 21 countries and regions around the world.Among all submissions, 94% of papers presented measurement results with silicon chips.After rigorous review process, the Technical Program Committee (TPC) selected 103 high quality papers with the acceptance rate of 41%.In addition, we invited 5 student papers from ESSCIRC 2021, having 108 technical paper presentations.From the A-SSCC 2021, the technical program is extended from a 3-day program to a 4-day program.Four plenary speeches are given by distinguished scholars and industry leaders.In the morning of Nov. 8,
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